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Home > Products > Integrated Circuits (ICs) > Memory - Memory > PC28F00BM29EWHA
Micron Technology Inc.
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PC28F00BM29EWHA

In Stock 5620 pcs Reference Price(In US Dollars)
1+
$234.3999
Manufacturer Part Number:
PC28F00BM29EWHA
Manufacturer / Brand
Micron Technology Inc.
Part of Description:
IC FLASH 2GBIT PARALLEL 64FBGA
Datasheets:
PC28F00BM29EWHA(1).pdfPC28F00BM29EWHA(2).pdfPC28F00BM29EWHA(3).pdfPC28F00BM29EWHA(4).pdfPC28F00BM29EWHA(5).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 5620 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number PC28F00BM29EWHA
Manufacturer / Brand Micron Technology Inc.
Stock Quantity 5620 pcs Stock
Category Integrated Circuits (ICs) > Memory - Memory
Description IC FLASH 2GBIT PARALLEL 64FBGA
Lead Free Status / RoHS Status: ROHS3 Compliant
RFQ PC28F00BM29EWHA Datasheets PC28F00BM29EWHA Details PDF
PC28F00BM29EWHA Details PDF for KR.pdf
PC28F00BM29EWHA Details PDF for IT.pdf
PC28F00BM29EWHA Details PDF for ES.pdf
PC28F00BM29EWHA Details PDF for DE.pdf
PC28F00BM29EWHA Details PDF for FR.pdf
Write Cycle Time - Word, Page 100ns
Voltage - Supply 2.7V ~ 3.6V
Technology FLASH - NOR
Supplier Device Package 64-FBGA (11x13)
Series -
Package / Case 64-LBGA
Package Tray
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 2Gbit
Memory Organization 256M x 8, 128M x 16
Memory Interface Parallel
Memory Format FLASH
Base Product Number PC28F00B
Access Time 100 ns

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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PC28F00BM29EWHA Product Details:

The Micron Technology PC28F00BM29EWHA is a high-performance, non-volatile memory integrated circuit (IC) that offers a 2Gb (256M x 8, 128M x 16) storage capacity. Designed for a wide range of applications, this FLASH - NOR memory IC features a parallel interface with a 100ns access time and write cycle time, making it suitable for applications that require fast data access and storage.

The PC28F00BM29EWHA is a surface-mount device (SMD) that comes in a 64-FBGA (11x13) package, providing a compact and efficient footprint for integration into various electronic systems. It is RoHS-compliant, ensuring its environmental friendliness and compliance with industry standards.

One of the key advantages of this memory IC is its wide operating temperature range of -40°C to 85°C (TA), making it suitable for use in harsh environments or applications that require reliable performance across a broad temperature spectrum.

The PC28F00BM29EWHA is compatible with a wide range of electronic devices and systems, including industrial control systems, automotive electronics, communication equipment, and consumer electronics. Its non-volatile memory technology ensures data retention even in the event of power loss, making it a reliable choice for applications that require persistent data storage.

Regarding equivalent or alternative models, the PC28F00BM29EWHA has the following comparable products available:

1. Micron Technology PC28F00BM29EPIA - This model is similar to the PC28F00BM29EWHA, with the same memory capacity and performance specifications, but it is packaged in a 64-LBGA (11x13) package.

2. Micron Technology PC28F00BM29EPIH - This model is also similar to the PC28F00BM29EWHA, with the same memory capacity and performance specifications, but it is packaged in a 64-LBGA (11x13) package.

3. Micron Technology PC28F00BM29EPIE - This model is again similar to the PC28F00BM29EWHA, with the same memory capacity and performance specifications, but it is packaged in a 64-LBGA (11x13) package.

All these equivalent models provide comparable functionality and can be considered as alternatives to the PC28F00BM29EWHA, depending on the specific requirements of the application and the preferred package type.

PC28F00BM29EWHA Key Technical Attributes

Memory Size: 2Gb (256M x 8, 128M x 16)

Memory Type: Non-Volatile, FLASH - NOR

Memory Interface: Parallel

PC28F00BM29EWHA Packing Size

Package Type: 64-FBGA (11x13)

Encapsulation: BGA, Surface Mount

Operating Temperature: -40°C ~ 85°C (TA)

PC28F00BM29EWHA Application

Designed for applications requiring high-speed, high-density, non-volatile memory storage

PC28F00BM29EWHA Features

The PC28F00BM29EWHA from Micron Technology is a high-performance FLASH - NOR Memory IC that ensures high-speed operation with an access and write cycle time of 100ns. Given its parallel memory interface, it provides a robust, wide-bandwidth pipe for data transmission. It suits applications requiring rapid loading or updating of operating instructions or data. Its non-volatile nature ensures data retention without power, providing reliability across various conditions. In addition, with a vast memory size of 2Gb, it accommodates extensive data or system firmware.

PC28F00BM29EWHA Quality and Safety Features

Complies with RoHS (Restriction of Hazardous Substances) directives, indicating it is lead-free. The component has a Moisture Sensitivity Level (MSL) rating of 3, requiring moisture care during handling to avoid damage during reflow. This ensures safety and quality in its operational environment.

PC28F00BM29EWHA Compatibility

The IC integrates effectively with many standard electronic assembly processes and is compatible with other devices requiring a voltage supply of 2.7 V ~ 3.6 V. The pin configuration and package make it compatible with general BGA-mounted setups.

PC28F00BM29EWHA Datasheet PDF

For comprehensive technical details, refer to the authoritative datasheet PDF for PC28F00BM29EWHA, available for download on our website. Customers are highly recommended to consult this document to ensure compatibility, specifications, and proper usage guidelines.

Quality Distributor

IC-Components is a premier distributor of Micron Technology products, offering a full range of integrated circuits including the sophisticated PC28F00BM29EWHA. To guarantee the authenticity and best prices, we encourage customers to take advantage of our quoting system available on our website, ensuring an excellent purchasing experience backed by our expert service and support.

Frequently Asked Questions

What are the critical power supply sequencing requirements when integrating the PC28F00BM29EWHA NOR Flash memory into a 3.3V system to avoid latch-up or data corruption?
The PC28F00BM29EWHA requires that VCC (2.7V–3.6V) be applied before or simultaneously with I/O voltages (VCCQ) to prevent forward-biasing internal ESD protection diodes, which can cause latch-up or unintended current paths. Ensure power sequencing complies with Micron’s recommendation of VCC ≥ VCCQ during ramp-up; if using separate regulators, implement a supervisor circuit to enforce this sequence. Failure to do so may result in degraded reliability or permanent damage, especially in industrial environments with frequent power cycling.
Can the PC28F00BM29EWHA be directly substituted for a 5V-compatible parallel NOR Flash like the Intel JS28F256M29EW in an existing design without hardware changes?
No, direct substitution is not recommended. The PC28F00BM29EWHA operates at 2.7V–3.6V and is not 5V-tolerant on its I/O pins. Replacing a 5V-compatible device without level-shifting or redesigning the interface will likely damage the Micron part or cause logic misinterpretation. Additionally, the PC28F00BM29EWHA uses a 64-FBGA (11x13) package with different ball mapping than many legacy TSOP-based 5V NOR flashes, requiring PCB layout changes.
How does the 100ns access time of the PC28F00BM29EWHA impact real-time firmware execution in a microcontroller-based embedded system with zero wait-state requirements?
With a 100ns access time, the PC28F00BM29EWHA typically requires at least two wait states when interfaced with microcontrollers running above 10 MHz (e.g., ARM Cortex-M running at 72 MHz). This can bottleneck instruction fetch performance in time-critical applications. For zero wait-state operation, consider pairing it with a cache-enabled MCU or using execute-in-place (XIP) configurations only if the system clock allows sufficient margin. Always validate timing closure using the device’s tACC specification under worst-case voltage and temperature conditions.
Is the PC28F00BM29EWHA suitable for automotive under-hood applications given its -40°C to 85°C operating temperature rating?
While the PC28F00BM29EWHA meets the -40°C to 85°C (TA) industrial temperature range, it is not qualified to AEC-Q100 standards and lacks automotive-grade reliability testing (e.g., extended thermal cycling, HTOL at 125°C junction). It should not be used in safety-critical or under-hood automotive systems requiring long-term reliability beyond 85°C ambient. For such applications, select a certified automotive NOR Flash like Micron’s MT28EW series with AEC-Q100 Grade 2 or better qualification.
What design considerations are necessary for reliable soldering and rework of the PC28F00BM29EWHA in a 64-FBGA (11x13) package, especially regarding moisture sensitivity and reflow profiles?
The PC28F00BM29EWHA is rated MSL 3 (168 hours floor life), meaning it must be baked at 125°C for 24 hours if exposed to ambient conditions beyond 168 hours before reflow. Use a reflow profile compliant with J-STD-020, with peak temperature between 240°C–250°C and time above liquidus (TAL) of 60–90 seconds. Due to the fine-pitch BGA layout, ensure PCB pad design follows Micron’s recommended land pattern and use X-ray inspection post-assembly to detect voids or opens. Improper handling increases risk of popcorning or latent solder joint failures.
Can the PC28F00BM29EWHA support byte-wide and word-wide accesses simultaneously, and what are the implications for mixed 8/16-bit microcontroller interfaces?
Yes, the PC28F00BM29EWHA supports both 8-bit (256M x 8) and 16-bit (128M x 16) organizations via the BYTE# pin. However, switching between modes requires a hardware reset or power cycle—it cannot be dynamically toggled during operation. Designers must hardwire BYTE# to GND (16-bit) or VCC (8-bit) based on the MCU interface. Mixing access widths without proper configuration can lead to address aliasing or data corruption. Ensure firmware accounts for address translation differences between modes.
When migrating from a serial NOR Flash (e.g., Micron MT25QL256ABA) to the parallel PC28F00BM29EWHA, what system-level trade-offs should be evaluated beyond interface speed?
Migrating from serial to parallel NOR like the PC28F00BM29EWHA increases pin count (64 vs. 8–16), requiring a larger MCU with more GPIOs and a more complex PCB layout with tighter impedance control for address/data buses. While parallel offers higher throughput, it consumes more board space and power. Additionally, boot code must be rewritten to handle parallel interface protocols, and EMI may increase due to simultaneous switching noise. This migration is justified only when bandwidth exceeds ~50 Mbps or XIP performance is critical.
How does the write cycle time of 100ns for the PC28F00BM29EWHA compare to typical block erase times, and what system-level buffering strategy is recommended for frequent small writes?
Although the PC28F00BM29EWHA supports 100ns word/page program times, block erase operations take milliseconds (e.g., 128KB block ≈ 1.5s typical). Frequent small writes without buffering will stall the system due to erase-before-write overhead. Implement a wear-leveling algorithm with RAM buffering and journaling to batch writes into full-block updates. Without this, endurance (typically 100K cycles) may be exhausted prematurely in logging or configuration storage applications.
Are there known compatibility issues when using the PC28F00BM29EWHA with 3.3V CMOS microcontrollers that have 5V-tolerant I/O pins but operate at reduced VOH levels?
Yes. While 5V-tolerant MCUs can accept 3.3V inputs, their output high voltage (VOH) may fall below the PC28F00BM29EWHA’s minimum VIH (typically 0.7 × VCC = 1.89V at 2.7V supply). If the MCU’s VOH is marginal (e.g., <2.0V under load), use a Schmitt-trigger buffer or ensure the MCU drives strongly under all conditions. Validate logic levels across temperature and supply variation using worst-case DC parameters from both datasheets to avoid read/write failures.
What long-term reliability risks should be considered when deploying the PC28F00BM29EWHA in outdoor industrial IoT nodes with extended operational lifespans (>10 years)?
Key risks include data retention degradation at elevated temperatures (accelerated above 85°C ambient), cumulative endurance wear from frequent writes, and solder joint fatigue due to thermal cycling. The PC28F00BM29EWHA guarantees 20-year data retention at 85°C, but real-world field temperatures and voltage fluctuations may reduce this. Implement error correction (ECC), periodic data scrubbing, and derate write frequency. Also, ensure conformal coating is applied to mitigate humidity-induced corrosion on BGA joints over time.

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