According to sources, TSMC’s 3nm fabs in Taiwan were originally expected to reach a monthly capacity of 150,000 wafers by the end of 2026. That figure is now projected to increase to 180,000 wafers, approximately 20% higher than initial estimates.
As noted in the report, the company is actively ramping up production of its 3nm process. By the end of 2025, monthly output is expected to reach approximately 120,000 to 130,000 wafers, rising to around 180,000 wafers by the end of 2026—representing year-over-year growth of more than 40%.
During an earnings call, the company stated that historically, once a process node reached its target capacity, further expansion would typically not follow. However, in response to strong demand from artificial intelligence applications, TSMC is increasing capital investment to further expand 3nm capacity.
The report also indicates that a new 3nm fab located in the Southern Taiwan Science Park is expected to begin mass production in the first half of 2027. Meanwhile, the company’s second fab in Arizona has been completed and is scheduled to begin 3nm wafer production in the second half of 2027.
In addition, a second fab in Kumamoto, Japan, is also expected to adopt the 3nm process, with mass production anticipated to begin in 2028.
According to TweakTown, demand for the 3nm process is being driven primarily by AI hardware, including GPUs from NVIDIA and AMD, as well as CPUs. Strong demand from NVIDIA, AMD, Intel, and automotive manufacturers is rapidly consuming available 3nm capacity. The report notes that even as capacity targets are achieved, existing supply remains insufficient to meet demand.
At the same time, with the 2nm process scheduled to enter mass production by the end of 2025, monthly capacity is expected to approach 100,000 wafers by the end of 2026. Economic Daily News previously reported that TSMC plans to begin volume production of its 2nm process in the fourth quarter of 2025, with strong yield performance.
Driven by robust demand from smartphones, high-performance computing, and AI applications, TSMC is producing this node across multiple fabs in Hsinchu and Kaohsiung. As part of its ongoing roadmap strategy, the company plans to introduce N2P and A16 processes, with the 2nm family expected to become another major, long-term demand driver.
By the end of 2025, monthly wafer starts for the 2nm process are expected to reach approximately 30,000 to 40,000 wafers. If projections hold, capacity could approach 100,000 wafers per month by the end of the following year, representing a 1.4x to 2.1x increase within a year.