As a global leader in the HBM thermal compression bonding equipment market, Hanmi Semiconductor’s latest move is aimed at securing a leading position in next-generation HBM packaging equipment. Hybrid bonding technology replaces conventional solder bumps with direct copper-to-copper bonding, significantly increasing chip interconnect density, improving data transfer speeds, and reducing power consumption. It is regarded as an enabling technology for the mass production of high-layer-count HBM stacks of 20 layers or more, and a major competitive focus in semiconductor equipment amid surging demand for AI computing power.
Hanmi Semiconductor first introduced its first-generation HBM hybrid bonding machine in 2020 and has since built substantial experience in research, development, and validation. The upcoming second-generation prototype incorporates the technological strengths of the first-generation platform and delivers broad improvements in nanometer-level precision, process stability, and production yield. Its alignment accuracy is expected to reach ±100 nanometers, placing it on par with leading global industry benchmarks and making it suitable for next-generation HBM chips with larger die sizes and higher stack counts.
On the manufacturing side, Hanmi Semiconductor has already begun construction of its hybrid bonding machine production plant. Located in the Juan National Industrial Complex in Incheon, South Korea, the facility represents an investment of 100 billion won (approximately $34 million). With a total floor area of 14,570 square meters, it will feature a Class 100 cleanroom designed to support nanometer-level ultra-precision manufacturing. Commercial operations are scheduled to begin in the first half of 2027.
Hanmi Semiconductor currently holds a dominant 71.2% share of the global HBM thermal compression bonding equipment market, with major customers including leading memory manufacturers such as SK hynix. The launch of its second-generation hybrid bonding machine and the build-out of a dedicated production facility reflect the company’s dual-track strategy of reinforcing its existing leadership while positioning for future growth. The initiative is intended to address near-term HBM technology upgrade demand while laying the groundwork for large-scale commercialization of hybrid bonding technology by 2029, further strengthening Hanmi Semiconductor’s position in the semiconductor equipment market and supporting the advancement of the global HBM industry.