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S9S08DZ48F1MLF

Manufacturer Part Number:
S9S08DZ48F1MLF
Manufacturer / Brand
NXP USA Inc.
Part of Description:
IC MCU 8BIT 48KB FLASH 48LQFP
Datasheets:
S9S08DZ48F1MLF(1).pdfS9S08DZ48F1MLF(2).pdfS9S08DZ48F1MLF(3).pdfS9S08DZ48F1MLF(4).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 14006 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number S9S08DZ48F1MLF
Manufacturer / Brand NXP USA Inc.
Stock Quantity 14006 pcs Stock
Category Integrated Circuits (ICs) > Embedded - Microcontrollers
Description IC MCU 8BIT 48KB FLASH 48LQFP
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Supplier Device Package 48-LQFP (7x7)
Speed 40MHz
Series S08
RAM Size 3K x 8
Program Memory Type FLASH
Program Memory Size 48KB (48K x 8)
Peripherals LVD, POR, PWM, WDT
Package / Case 48-LQFP
Package Tray
Oscillator Type External
Operating Temperature -40°C ~ 125°C (TA)
Number of I/O 39
Mounting Type Surface Mount
EEPROM Size 1.5K x 8
Data Converters A/D 16x12b
Core Size 8-Bit
Core Processor S08
Connectivity CANbus, I²C, LINbus, SCI, SPI
Base Product Number S9S08

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

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Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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S9S08DZ48F1MLF Product Details:

The Freescale / NXP Semiconductors S9S08DZ48F1MLF is a high-performance 8-bit microcontroller designed for embedded systems requiring robust functionality and versatile connectivity. This integrated circuit represents a sophisticated solution in the microcontroller category, specifically engineered to address complex design challenges in automotive, industrial, and consumer electronic applications.

At its core, the microcontroller features an 8-bit S08 processor architecture, delivering efficient performance with a maximum operating speed of 40MHz. The device provides substantial embedded memory resources, including 48KB of Flash program memory, 3KB of RAM, and 1.5KB of EEPROM, enabling comprehensive program storage and data management capabilities.

A key strength of this microcontroller is its extensive peripheral integration, which includes multiple communication interfaces such as CANbus, LINbus, SCI, and SPI. These connectivity options make the device particularly suitable for automotive and industrial control systems that require robust and flexible communication protocols. Additionally, the integrated peripherals like Low Voltage Detection (LVD), Power-On Reset (POR), Pulse Width Modulation (PWM), and Watchdog Timer (WDT) enhance system reliability and operational safety.

The microcontroller offers remarkable analog capabilities with a 16-channel, 12-bit analog-to-digital converter, enabling precise signal measurement and conversion. Its wide operating voltage range of 2.7V to 5.5V ensures compatibility with diverse power supply configurations, while the extended operating temperature range of -40°C to 125°C guarantees performance in harsh environmental conditions.

Packaged in a compact 48-pin LQFP (Low-Profile Quad Flat Package) measuring 7x7mm, the device supports surface mount technology, facilitating easy integration into modern PCB designs. The microcontroller provides 39 configurable I/O pins, offering significant flexibility for various input and output requirements.

Equivalent or alternative models in the S08 series include the MC9S08DZ60, MC9S08DZ48, and MC9S08AC60, which share similar architectural characteristics and are designed for comparable application domains. The device's RoHS3 compliance further underscores its commitment to environmental sustainability and meets stringent global electronic manufacturing standards.

This microcontroller is ideally suited for applications in automotive electronics, industrial control systems, consumer devices, and embedded systems requiring compact, high-performance 8-bit processing with comprehensive connectivity and peripheral support.

S9S08DZ48F1MLF Key Technical Attributes

- 8-bit S08 core up to 40 MHz

- 48 KB Flash, 3 KB RAM, 1.5 KB EEPROM

- 39 I/O, 16-channel 12-bit ADC

- Supply voltage 2.7–5.5 V, external oscillator

- Operating temperature −40 to +125 °C TA

- Connectivity CANbus, I2C, LINbus, SCI, SPI

- Peripherals LVD, POR, PWM, WDT

- Series S08, base product S9S08

- Package 48-LQFP 7x7 mm, RoHS3 compliant

- Inventory 2663 units, tray packaging

S9S08DZ48F1MLF Packing Size

- Type 48-LQFP, 7 x 7 mm body, approx. 0.5 mm lead pitch

- Material molded epoxy package with copper alloy leadframe, lead-free plating typical of RoHS3 LQFP families

- Pin configuration 48 leads with corner Pin 1 index and gull-wing terminations, 39 user I/O with remaining pins for power, ground, reset, clock, and communication/analog functions

- Thermal characteristics ambient operating −40 to +125 °C; junction-to-ambient and MSL depend on board and handling conditions, consult datasheet for exact ratings

- Electrical properties core supply 2.7–5.5 V, external clock source required; observe standard ESD and moisture handling practices per manufacturer guidance

S9S08DZ48F1MLF Application

- Automotive CAN and LIN nodes, body electronics, gateways

- Industrial control, motor and actuator control with PWM and ADC feedback

- White goods and appliance controllers

- Instrumentation and data acquisition for 12-bit ADC

- General-purpose embedded control in 5 V systems

S9S08DZ48F1MLF Features

- Processing and memory

- Proven 8-bit S08 core delivering responsive control at up to 40 MHz for time-critical tasks and deterministic real-time behavior

- Embedded nonvolatile memory mix optimized for control loops and configuration storage with 48 KB Flash for application code, 3 KB RAM for fast data, and 1.5 KB EEPROM for parameters and logs

- Analog and timing

- Integrated 16-channel 12-bit ADC enables precise sensing of multiple analog inputs without external ADCs, supporting multiplexed measurements and calibration routines

- PWM generation for motor control, solenoids, LEDs, and power-stage modulation with fine granularity for efficient drive and reduced ripple

- Communications

- Built-in CAN 2.0B controller for robust multi-node networks in automotive and industrial environments

- LIN interface for cost-effective subnetwork control such as door, seat, HVAC, and lighting modules

- I2C (listed as IC in supplied parameters), SPI, and SCI/UART provide flexible serial connectivity to sensors, EEPROMs, displays, transceivers, and host interfaces

- Power and clocking

- Wide 2.7–5.5 V operating range simplifies integration into existing 5 V systems while also supporting low-voltage designs

- External oscillator support for precision timing with crystals or resonators, enabling accurate baud rates, stable control loops, and synchronized network operation

- Robustness and reliability

- Low-voltage detect and power-on reset maintain safe start-up and brownout behavior, protecting program and data integrity

- Windowed watchdog timer supervises software execution to recover from fault conditions automatically

- Operating temperature −40 to +125 °C helps meet demanding automotive and industrial environments

- Design productivity

- S08/S9S08 software and peripheral compatibility streamlines reuse of drivers, middleware, and application code across the family

- Broad ecosystem and debugging support from NXP and third-party tool vendors accelerates development and test

S9S08DZ48F1MLF Quality and Safety Features

- Power-on reset, low-voltage detect, and watchdog timer provide layered protection against supply disturbances and software lockups

- RoHS3 compliance supports environmentally responsible manufacturing and global market access

- External crystal option for robust timing integrity in safety-related communication and control loops

- Extended ambient temperature range −40 to +125 °C suited to automotive and harsh industrial applications

- Manufactured and tested to NXP’s quality standards; consult the datasheet for ESD ratings, moisture sensitivity level, and any formal qualification status

S9S08DZ48F1MLF Compatibility

- Code and peripheral compatibility within the S08 family enables easy migration among S9S08 devices with different memory and package options

- 5 V system compatibility and wide supply range ease integration with legacy logic, sensors, and actuators

- Drop-in footprint compatibility across 48-LQFP members of the S9S08DZ family for hardware reuse, subject to pin function mapping and board constraints

- Works with standard CAN and LIN transceivers and common serial peripherals via I2C, SPI, and SCI/UART

- Supported by mainstream development tools, programmers, and debuggers for HCS08/S08 devices

S9S08DZ48F1MLF Datasheet PDF

Our website hosts the most authoritative and up-to-date datasheet for S9S08DZ48F1MLF. For complete electrical specifications, pin assignments, thermal data, timing diagrams, and application guidance, we strongly recommend downloading the datasheet directly from this page.

Quality Distributor

IC-Components is a premium distributor for NXP Semiconductors products. Benefit from genuine inventory, competitive pricing, and responsive technical support. Get an instant quote for S9S08DZ48F1MLF on our website today and accelerate your build with confidence.

Frequently Asked Questions

What are the key considerations when integrating the Freescale/NXP S9S08DZ48F1MLF microcontroller into a low-voltage industrial control system?
When integrating the S9S08DZ48F1MLF into industrial control systems operating between 2.7V and 5.5V, ensure your power supply design maintains stable voltage within this range. Pay attention to the internal voltage regulators and decoupling capacitors to manage voltage fluctuations. Also, verify that the external oscillator and peripheral interfaces meet industrial noise and EMI standards, and confirm that the device's -40°C to 125°C operating temperature aligns with your environmental conditions to ensure reliability.
How should I choose the appropriate I/O configuration on the S9S08DZ48F1MLF to reliably interface with external sensors and actuators?
The S9S08DZ48F1MLF provides 39 I/O pins; assess your application’s sensor and actuator interface requirements including voltage levels, current drive capability, and protocol compatibility. Use open-drain configurations or external level shifters if interfacing with higher voltages. Configure I/O pins as inputs or outputs with appropriate internal pull-ups or pull-downs, and consider pin multiplexing options to optimize available pins for your specific signals.
Can the S9S08DZ48F1MLF's 48KB Flash memory and 3KB RAM support my firmware update and real-time data processing needs?
With 48KB of Flash and 3KB of RAM, the S9S08DZ48F1MLF is suitable for moderate complexity applications requiring embedded control, such as motor control or sensor data acquisition. Ensure your firmware is efficiently optimized for size, and consider whether your application demands frequent firmware updates or large data buffers, in which case additional external memory or a microcontroller with larger memory capacity might be needed.
What are the best practices for establishing reliable communication via CANbus, LINbus, SCI, or SPI with the S9S08DZ48F1MLF in noisy industrial environments?
To ensure robust communication, implement proper shielding and grounding strategies, use twisted-pair wiring for differential signals like CANbus and LINbus, and include termination resistors at network ends. For serial interfaces (SCI) and SPI, ensure proper signal termination, signal integrity, and compliance with impedance matching. Configure communication protocols with error-checking features, and incorporate watchdog timers to recover from faults caused by noise or communication failures.
Given the use of an external oscillator with the S9S08DZ48F1MLF, how should I select and connect the oscillator to meet timing precision and startup performance requirements?
Select an external crystal or clock source with the frequency stability and accuracy matching your application's timing needs; the device supports external oscillators. Connect the oscillator to the designated pins with proper load capacitors as specified in the datasheet. Ensure the startup time aligns with your system's power-up sequence, and incorporate software or hardware measures to handle oscillator stabilization.
Is the S9S08DZ48F1MLF suitable for long-term industrial deployment with high reliability and minimal maintenance?
Yes, the S9S08DZ48F1MLF is rated for operating temperatures from -40°C to 125°C and is RoHS3 compliant, making it suitable for harsh industrial environments. To maximize reliability, implement proper PCB design practices, supply decoupling, overvoltage protection, and consider redundancy for critical functions. Regular firmware updates and thorough testing under operational conditions can further enhance long-term reliability.
How do I migrate from a similar 8-bit microcontroller with a different peripheral set to the S9S08DZ48F1MLF without significant redesign?
Identify compatible peripheral functions such as UART, SPI, and ADC channels in your current microcontroller and map them to the S9S08DZ48F1MLF's equivalents. Review the pin assignment and peripheral configuration in its datasheet, and adapt your firmware accordingly. Be aware of differences in voltage levels, clock sources, and peripheral protocols, and update your hardware schematics to accommodate the 48-LQFP package’s pinout.
What potential limitations should I consider when using the S9S08DZ48F1MLF in applications with high-speed clock requirements?
With a maximum speed of 40MHz, ensure your application’s timing and frequency requirements do not exceed this limit. For high-speed data acquisition or processing, verify that the internal bus architecture and peripheral interfaces are compatible and can meet your timing constraints. Use an external oscillator with low jitter and consider clock synchronization and distribution strategies to maintain system stability.
Are there any specific power supply filtering or decoupling recommendations for the S9S08DZ48F1MLF to ensure stable operation?
Yes, employ low-ESR ceramic decoupling capacitors (typically 0.1μF and bulk capacitors of 10μF or higher) close to the Vdd pins to filter switching noise and voltage transients. Maintain proper ground plane layouts to minimize ground bounce and EMI. Ensure the power supply bandwidth meets the microcontroller's requirements, especially during high-speed switching activities, to prevent system resets or malfunctions.
How does the package type (48-LQFP 7x7) influence the PCB design and assembly process for the S9S08DZ48F1MLF?
The 48-LQFP package requires precise PCB footprint design with properly designed land patterns, including adequate pad sizes and solder mask clearance. Use appropriate soldering techniques such as reflow or stencil printing to ensure consistent solder joints. Pay attention to thermal management during assembly, especially if operating in high-temperature environments, to prevent thermal stress on the package and maintain reliable connections.

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