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S29GL128S10FHB013

In Stock 144755 pcs Reference Price(In US Dollars)
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$0.4054
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$0.1514
1000+
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Manufacturer Part Number:
S29GL128S10FHB013
Manufacturer / Brand
Infineon Technologies
Part of Description:
IC FLASH 128MBIT PARALLEL 64FBGA
Datasheets:
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 144755 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number S29GL128S10FHB013
Manufacturer / Brand Infineon Technologies
Stock Quantity 144755 pcs Stock
Category Integrated Circuits (ICs) > Memory - Memory
Description IC FLASH 128MBIT PARALLEL 64FBGA
Lead Free Status / RoHS Status: ROHS3 Compliant
Write Cycle Time - Word, Page 60ns
Voltage - Supply 2.7V ~ 3.6V
Technology FLASH - NOR
Supplier Device Package 64-FBGA (13x11)
Series Automotive, AEC-Q100, GL-S
Package / Case 64-LBGA
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 128Mbit
Memory Organization 8M x 16
Memory Interface Parallel
Memory Format FLASH
Base Product Number S29GL128
Access Time 100 ns

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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S29GL128S10FHB013 Product Details:

The S29GL128S10FHB013 from Cypress Semiconductor (now part of Infineon Technologies) is a high-performance 128-megabit NOR Flash memory integrated circuit designed to address the demanding requirements of automotive and industrial applications requiring reliable, non-volatile data storage. This parallel interface memory chip belongs to the Automotive GL-S series and meets stringent AEC-Q100 qualification standards, making it ideal for harsh operating environments where data integrity and long-term reliability are critical.

This memory device features a 128Mbit storage capacity organized as 8M x 16, providing flexible data management for embedded systems. The parallel memory interface enables fast data access with a 100-nanosecond access time and an impressive 60-nanosecond write cycle time for word and page operations, ensuring rapid read and write performance essential for real-time applications. Operating from a supply voltage range of 2.7V to 3.6V, the chip offers power efficiency while maintaining robust performance across a wide temperature range of -40°C to 105°C, specifically designed to withstand extreme environmental conditions found in automotive under-hood applications, industrial control systems, and outdoor equipment.

The device comes in a compact 64-FBGA (Fine-Pitch Ball Grid Array) package measuring 13x11mm, utilizing surface mount technology for efficient PCB integration and space optimization in modern electronic designs. This small form factor addresses design challenges related to board space constraints while providing reliable solder connections through the ball grid array configuration. The product is RoHS3 compliant, meeting current environmental regulations for lead-free manufacturing, and is supplied in tape and reel packaging for automated assembly processes.

Primary advantages include its automotive-grade qualification ensuring reliability in mission-critical systems, non-volatile storage that retains data without power, fast parallel access for performance-intensive applications, and wide temperature tolerance for extreme environments. The NOR Flash technology provides execute-in-place capability, allowing processors to run code directly from the memory without loading it into RAM first, which is particularly valuable in boot code and firmware storage applications.

This memory solution finds extensive application in automotive electronics including engine control units, infotainment systems, advanced driver assistance systems (ADAS), and instrument clusters, as well as industrial automation, telecommunications infrastructure, medical devices, aerospace systems, and any embedded application requiring reliable code storage and data logging capabilities in challenging environmental conditions.

Equivalent and alternative models include other members of the Cypress S29GL family such as the S29GL128P, S29GL256S, and S29GL512S offering different densities, as well as competing NOR Flash solutions from manufacturers like Micron (MT28EW and M29W series), Winbond (W29N series), Macronix (MX29GL series), and ISSI (IS29GL series) that provide similar parallel NOR Flash functionality with comparable specifications for automotive and industrial applications.

S29GL128S10FHB013 Key Technical Attributes

128Mbit Flash Memory

Parallel Interface

100ns Access Time

S29GL128S10FHB013 Packing Size

The S29GL128S10FHB013 comes in a 64-FBGA (13x11 mm) low-profile package, offering high-density memory in a compact footprint to optimize board space. This surface-mount package is made for automated production, with robust thermal performance for typical automotive or industrial environments. The device features a pin configuration suitable for parallel memory architectures, allowing efficient data transfer. Its electrical properties include a supply voltage range from 2.7V to 3.6V, supporting stable operations even with voltage variations.

S29GL128S10FHB013 Application

This IC flash memory is ideal for automotive, industrial, and embedded applications requiring reliable non-volatile storage. As part of the GL-S series with AEC-Q100 automotive qualification, it meets stringent industry standards for reliability and endurance. It also suits general-purpose memory expansion and code/data storage for complex MCU or FPGA-based systems, where parallel access and fast read/write cycles are essential.

S29GL128S10FHB013 Features

The S29GL128S10FHB013 is based on NOR Flash technology, with an 8M x 16 bit memory organization. It delivers fast access time of 100ns and a write cycle time of 60ns per word/page. The parallel memory interface facilitates rapid data throughput and efficient system interaction. It supports operation in extended temperature ranges from -40°C to +105°C, making it suitable for harsh environments. The package is ROHS3 compliant, ensuring environmentally responsible production and usage. The component is delivered in Tape & Reel (TR) for industry-standard automated assembly processes. The S29GL128S10FHB013 is designed to withstand high vibration and thermal stress, commonly encountered in automotive and industrial settings.

S29GL128S10FHB013 Quality and Safety Features

The product is AEC-Q100 qualified, guaranteeing high reliability for automotive-grade applications. RoHS3 compliance certifies that the device is free from hazardous substances, ensuring safety for both production and end use. Cypress (Infineon) FLASH memories undergo strict quality assessments, including rigorous endurance and retention testing, to guarantee long-term data reliability. The surface-mount FBGA package also allows secure and stable installation for high-vibration environments.

S29GL128S10FHB013 Compatibility

This IC is compatible with a range of microprocessors, MCUs, FPGAs, and other digital systems that require parallel memory access. Its standard pinout and electrical characteristics make integration straightforward with existing automotive or industrial design platforms. The 2.7V ~ 3.6V supply range matches many industry-standard digital logic levels.

S29GL128S10FHB013 Datasheet PDF

IC-Components offers the most authoritative and up-to-date datasheet for the S29GL128S10FHB013 directly on this page. For detailed specifications, pinouts, performance benchmarks, and environmental ratings, we strongly recommend downloading the official datasheet from our website for your reference and design needs.

Quality Distributor

IC-Components is a premium global distributor of Cypress Semiconductor (now Infineon Technologies) products. Our commitment to quality, authenticity, and reliable supply ensures you receive genuine original components. Request a quote today on our website to secure the best offer and expedited service for your S29GL128S10FHB013 procurement.

Frequently Asked Questions

How should I approach integrating the Cypress S29GL128S10FHB013 128Mb parallel NOR flash into a high-reliability automotive system considering its operating temperature range?
The Cypress S29GL128S10FHB013 is rated for -40°C to 105°C, making it suitable for automotive applications. Ensure your PCB layout accommodates its 64-FBGA package (13x11 mm) for optimal heat dissipation and signal integrity. Verify that the power supply voltage (2.7V to 3.6V) is stable under automotive voltage fluctuations, and incorporate appropriate decoupling capacitors close to the device to ensure reliable operation throughout the temperature range.
What are the critical considerations for replacing a similar 128Mb NOR flash device with the S29GL128S10FHB013 in an existing design?
When replacing a similar device, confirm the package type (64-FBGA, 13x11 mm), supply voltage range (2.7V–3.6V), and the memory interface (parallel, 8M x 16 organization). Evaluate the access time (100 ns) and write cycle times (60 ns) to ensure compatibility with your system timing. Also, check the package footprint and pinout differences to prevent mechanical or electrical issues. Consider the device’s series compatibility (Automotive, AEC-Q100, GL-S) for reliability standards.
Can the Cypress S29GL128S10FHB013 be reliably used in low-power portable devices, and what are the key power considerations?
Yes, with a supply voltage of 2.7V to 3.6V, the S29GL128S10FHB013 is suitable for low-power applications. To optimize power consumption, implement proper power-down modes if available, and ensure the device is operated within the specified voltage range. Manage the device’s activity periods to minimize unnecessary power draw during idle states, and verify that the ground and Vcc lines are well-decoupled for stable operation.
What are potential risks of operating the Cypress S29GL128S10FHB013 at temperatures approaching 105°C in an industrial environment?
While the device is rated up to 105°C, prolonged operation at high temperatures may accelerate device aging and increase the risk of wear-out failures. Ensure adequate thermal management such as heatsinking or PCB thermal vias to maintain device temperature below recommended limits. Conduct thorough temperature cycling and stress testing in your application environment to confirm long-term reliability.
How does the parallel memory interface of the S29GL128S10FHB013 influence system design compared to serial NOR flash parts?
The parallel interface (8M x 16 organization) provides higher data throughput suitable for bandwidth-critical applications but requires more I/O lines, intricate PCB routing, and careful signal integrity management. When designing your system, ensure the microcontroller or FPGA has sufficient parallel data lines and compatible control signals. Consider the increased complexity in PCB layout and potential EMI issues associated with parallel interfaces.
Are there specific considerations for programming or updating data in the S29GL128S10FHB013 during in-field firmware updates?
The device features a 60 ns write cycle time per word and supports in-system programming. To ensure data integrity, implement thorough erase and write verification steps, and consider the need for a dedicated programmer or flash loader algorithm. Be aware of the device’s endurance—consult datasheet specifications for maximum write/erase cycles—and design your firmware update process accordingly to avoid premature memory failure.
What are the advantages or trade-offs of choosing the S29GL128S10FHB013's GL-S series for automotive applications over other series?
The GL-S series complies with AEC-Q100 standards, ensuring automotive-grade reliability, wide temperature operation, and robust manufacturing quality. The trade-offs include potentially higher cost and larger package size compared to consumer-grade parts. However, for automotive designs, these trade-offs favor long-term reliability and compliance, which outweigh alternative options lacking such standards.
How should I handle the initial power-up sequencing to ensure reliable startup with the S29GL128S10FHB013?
Maintain a power-up sequence that ensures the Vcc supply (2.7V to 3.6V) stabilizes before enabling external control signals. It is recommended to follow the device’s datasheet guidelines for power-up timing, including managing OE (Output Enable) and CE (Chip Enable) signals to prevent undefined states. Incorporate reset circuitry or supervisor ICs to handle power-on reset sequences sheathing the flash for reliable initialization.
Is the S29GL128S10FHB013 suitable for use in systems requiring high-speed data logging, and what are the limitations?
With a 100 ns access time and 60 ns write cycle time, the S29GL128S10FHB013 can support moderate data logging speeds. However, for high-speed applications, verify that the system’s clock rates and bus widths are compatible and that the controller can sustain cycle times effectively. Limitations include the relatively longer write cycles compared to SDRAM or SRAM, and the need to manage erase/write cycles to prevent wear-out.
What are best practices for ensuring long-term data retention and device reliability in industrial environments using the Cypress S29GL128S10FHB013?
Implement proper thermal management and avoid operating at the maximum temperature range continuously. Use error correction codes (ECC) if applicable to detect and correct bit errors. Plan for periodic data integrity checks and limit write/erase cycles within the specified endurance. Ensure robust power supply filtering and grounding to mitigate noise and voltage transients that could affect data retention and device longevity.

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