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EP2AGX45CU17C4G

In Stock 204 pcs Reference Price(In US Dollars)
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$420.369
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$159.3566
Manufacturer Part Number:
EP2AGX45CU17C4G
Manufacturer / Brand
Intel
Part of Description:
IC FPGA 156 I/O 358UBGA
Datasheets:
EP2AGX45CU17C4G(1).pdfEP2AGX45CU17C4G(2).pdfEP2AGX45CU17C4G(3).pdfEP2AGX45CU17C4G(4).pdf
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 204 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number EP2AGX45CU17C4G
Manufacturer / Brand Intel
Stock Quantity 204 pcs Stock
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 156 I/O 358UBGA
Lead Free Status / RoHS Status: RoHS Compliant
Voltage - Supply 0.87V ~ 0.93V
Total RAM Bits 3517440
Supplier Device Package 358-UBGA, FCBGA (17x17)
Series Arria II GX
Package / Case 358-LFBGA, FCBGA
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Number of Logic Elements/Cells 42959
Number of LABs/CLBs 1805
Number of I/O 156
Mounting Type Surface Mount
Base Product Number EP2AGX45

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

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2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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EP2AGX45CU17C4G Product Details:

The EP2AGX45CU17C4G is a sophisticated Field Programmable Gate Array (FPGA) manufactured by Intel, belonging to the Arria II GX series of embedded integrated circuits. This high-performance programmable logic device is engineered to address complex design challenges requiring substantial processing capabilities, flexible I/O configurations, and significant memory resources in a compact footprint.

At its core, this FPGA features an impressive 42,959 logic elements/cells organized into 1,805 LABs/CLBs, providing designers with extensive computational resources for implementing complex digital logic functions. The device incorporates 3,517,440 total RAM bits, enabling substantial on-chip data storage and buffering capabilities essential for data-intensive applications. With 156 I/O pins available, the EP2AGX45CU17C4G offers considerable connectivity options for interfacing with external components and systems, making it suitable for applications requiring multiple communication channels and peripheral connections.

The device comes in a compact 358-UBGA, FCBGA (17x17mm) package designed for surface mount installation, addressing space constraints in modern electronic designs while maintaining robust thermal and electrical performance. Operating within a commercial temperature range of 0°C to 85°C (junction temperature) and requiring a tightly regulated supply voltage of 0.87V to 0.93V, this FPGA is optimized for reliable operation in standard industrial and commercial environments. The product is RoHS compliant, meeting contemporary environmental and regulatory standards for electronic components, and is supplied in tray packaging for manufacturing convenience.

Primary advantages of this FPGA include its substantial logic capacity enabling complex algorithm implementation, generous embedded memory for data processing applications, flexible I/O configuration supporting diverse interface standards, and the reprogrammable nature inherent to FPGAs allowing for design iterations and field updates without hardware changes. The Arria II GX series is particularly known for balancing performance, power efficiency, and cost-effectiveness, making it suitable for mid-range applications requiring significant processing power without the expense of higher-end FPGA families.

This device finds application across numerous domains including telecommunications infrastructure, industrial automation and control systems, medical imaging equipment, test and measurement instrumentation, video and image processing systems, automotive electronics, and embedded computing platforms where customizable hardware acceleration is beneficial. The programmable nature allows engineers to implement custom protocols, signal processing algorithms, and control logic tailored to specific application requirements.

Regarding equivalent or alternative models, within Intel's own portfolio, other devices in the Arria II GX family such as the EP2AGX65, EP2AGX95, or EP2AGX125 offer different logic capacities and I/O counts while maintaining architectural compatibility. Alternative package options for the same die, such as different ball grid array configurations, may also be available. Competitive alternatives from other manufacturers include Xilinx Spartan-6 or Artix-7 series FPGAs, and Lattice ECP5 family devices, which offer comparable logic density and feature sets, though specific pin compatibility and toolchain differences would require design adaptation when substituting between manufacturers.

EP2AGX45CU17C4G Key Technical Attributes

Manufacturer: Intel

Manufacturer Part Number: EP2AGX45CU17C4G

Main Category: Integrated Circuits (ICs)

EP2AGX45CU17C4G Packing Size

The EP2AGX45CU17C4G is housed in a compact 358-UBGA, FCBGA (17x17) package, designed for high-density integration and robust performance. The package type ensures efficient thermal management and supports surface mount installation, allowing for streamlined manufacturing processes. Featuring a tray packing configuration, it enhances device protection and provides greater convenience during assembly. The pin configuration accommodates 156 I/O connections, enabling extensive interfacing capabilities for advanced systems. The device’s supply voltage ranges from 0.87V to 0.93V, supporting stable electrical performance in demanding applications.

EP2AGX45CU17C4G Application

This FPGA model is primarily used in embedded systems requiring high-speed data processing and flexible logic integration. It is an optimal choice for industrial automation, telecommunications infrastructure, high-performance computing platforms, video and imaging processing, and network security hardware. Its programmable nature makes it suitable for rapid prototyping and the development of customized accelerator functions.

EP2AGX45CU17C4G Features

The EP2AGX45CU17C4G stands out with 42,959 logic elements/cells and 1805 LABs/CLBs, ensuring substantial computational power for complex algorithms and parallel processing tasks. With 3,517,440 total RAM bits, it offers robust on-chip memory resources for buffering and data manipulation, critical for applications with intensive throughput requirements. The device operates reliably between 0°C and 85°C (TJ), supporting performance under a wide range of environmental conditions. The Arria II GX series guarantees high-speed transceiver capabilities, low latency, and advanced digital signal processing engines, allowing users to maximize bandwidth and processing speed in networking and embedded applications. The selection of surface mount technology ensures not only a compact footprint but also effective heat dissipation and easy integration onto modern PCBs. RoHS compliance ensures environmental safety by limiting hazardous substances.

EP2AGX45CU17C4G Quality and Safety Features

Intel’s manufacturing standards guarantee rigorous testing and strict quality controls to minimize defects and ensure long-term reliability. The RoHS compliant status certifies that the product is manufactured in accordance with environmental protection standards, reducing potential risks associated with hazardous materials. Built-in ESD protection and enhanced thermal characteristics further contribute to device resilience, protecting sensitive circuitry during operation and handling.

EP2AGX45CU17C4G Compatibility

The EP2AGX45CU17C4G is fully compatible with Intel’s Arria II GX toolchains, development kits, and reference designs, ensuring seamless integration into existing workflows and project upgrades. Its flexible interface options and programmable architecture make it suitable for a broad range of embedded platforms, allowing easy adaptation to varied system requirements.

EP2AGX45CU17C4G Datasheet PDF

Our website provides the most authoritative and complete datasheet for the EP2AGX45CU17C4G product model. We highly recommend that you download the datasheet from this page to access the latest technical specifications, application guidelines, and detailed performance metrics directly supplied by Intel. This ensures you have the most accurate information for design, verification, and deployment.

Quality Distributor

IC-Components is proud to serve as a premium distributor of Intel products. We are committed to offering genuine and high-quality components with exceptional service for all your embedded and FPGA needs. For the EP2AGX45CU17C4G and other Arria II GX series models, get a quote directly through our website and experience the convenience and trust that comes with ordering from an industry-leading source. Take action today to enhance your project’s performance with our reliable supply chain and technical support.

Frequently Asked Questions

What are the critical considerations when integrating the Intel EP2AGX45CU17C4G FPGA into a low-voltage power supply system?
When integrating the Intel EP2AGX45CU17C4G FPGA, ensure your power supply can reliably provide a voltage between 0.87V and 0.93V, as specified. Also, implement proper power sequencing and filtering to minimize noise and voltage fluctuations, which could impact FPGA performance or stability.
Is the Intel EP2AGX45CU17C4G suitable for industrial environments with temperatures up to 85°C?
Yes, the Intel EP2AGX45CU17C4G is rated for an operating temperature range of 0°C to 85°C, making it suitable for industrial applications. However, ensure adequate thermal management and proper PCB layout to maintain reliability at higher operating temperatures.
How can I replace an older FPGA with the Intel EP2AGX45CU17C4G without redesigning the entire PCB?
To replace an older FPGA with the EP2AGX45CU17C4G, check the footprint compatibility, specifically the 358-UBGA, FCBGA package. Confirm that I/O counts, configuration interfaces, and power requirements align. You may need to adapt your PCB layout or add appropriate level shifters if voltage levels differ.
What are the key differences between the Intel EP2AGX45CU17C4G and other Arria II GX series FPGAs that I should consider for my design?
When migrating within the Arria II GX series, compare the I/O count, RAM capacity, logic elements, and package size. The EP2AGX45CU17C4G offers 156 I/O, 4.5 million logic elements, and 3.5 million RAM bits, making it suitable for moderate to high complexity designs. Evaluate your current and future needs to select the most appropriate model.
Are there any specific signal integrity or I/O voltage considerations I should be aware of when using the EP2AGX45CU17C4G in high-speed applications?
Yes. The FPGA's I/O voltage range (0.87V to 0.93V) is optimized for low-voltage signaling. Ensure your PCB trace impedance, termination, and impedance matching are designed for high-speed operation to prevent signal integrity issues. Use proper grounding and shielding for sensitive signals.
Can the Intel EP2AGX45CU17C4G operate reliably in applications with extended, continuous operation?
Yes, provided that the operating temperature stays within 0°C to 85°C and that the device is supplied with clean, stable power. Incorporate adequate cooling and electrostatic protection to enhance long-term reliability in continuous operation scenarios.
How does the 358-UBGA package size impact the soldering process and final assembly for the EP2AGX45CU17C4G?
The 358-UBGA (or FCBGA) package requires precise reflow soldering with controlled temperature profiles. Use appropriate stenciling and inspection methods (such as X-ray) for quality assurance. The surface-mount design allows for compact PCB layouts but demands careful handling during assembly.
Does the high logic element count of 42,959 in the EP2AGX45CU17C4G affect the design complexity or power consumption?
A higher logic element count allows for more complex designs but can increase power consumption and heat dissipation. Optimize your design for power efficiency, and implement effective cooling strategies to maintain performance and reliability.
If I need to operate the FPGA at its maximum I/O capacity, what design considerations regarding I/O pin usage and routing should I keep in mind?
When utilizing all 156 I/O pins, ensure that the routing maintains signal integrity, minimizes skew, and provides proper impedance control. Consider common-mode voltage levels, termination, and the availability of dedicated clock and high-speed I/O resources to optimize performance.
What are the reliability considerations of using the EP2AGX45CU17C4G in mission-critical systems where uptime is essential?
For mission-critical applications, ensure proper power supply decoupling, incorporate redundancy where possible, and follow best practices for PCB layout. Also, validate the device under your specific operating conditions through thorough testing to ensure long-term reliability.

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