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A3PE600-FG484

In Stock 845 pcs Reference Price(In US Dollars)
1+
$103.7416
200+
$40.1477
500+
$38.7367
1000+
$38.0385
Manufacturer Part Number:
A3PE600-FG484
Manufacturer / Brand
Microchip Technology
Part of Description:
IC FPGA 270 I/O 484FBGA
Datasheets:
A3PE600-FG484.pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, 845 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number A3PE600-FG484
Manufacturer / Brand Microchip Technology
Stock Quantity 845 pcs Stock
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 270 I/O 484FBGA
Lead Free Status / RoHS Status: RoHS non-compliant
Voltage - Supply 1.425V ~ 1.575V
Total RAM Bits 110592
Supplier Device Package 484-FPBGA (23x23)
Series ProASIC3E
Package / Case 484-BGA
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Number of I/O 270
Number of Gates 600000
Mounting Type Surface Mount
Base Product Number A3PE600

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

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Shipping Fees reference DHL/FedEx
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Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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A3PE600-FG484 Product Details:

The A3PE600-FG484 is a sophisticated Field Programmable Gate Array (FPGA) integrated circuit manufactured by Microchip Technology (formerly Micrel), belonging to the ProASIC3E series of embedded programmable logic devices. This advanced FPGA solution addresses the critical design challenges of balancing high-density logic implementation with power efficiency and thermal management in modern electronic systems, making it particularly suitable for applications requiring flexible, reconfigurable digital logic without the need for custom ASIC development.

At its core, this device features an impressive 600,000 gates of programmable logic capacity, providing substantial resources for complex digital designs while maintaining a compact footprint. The chip offers 270 configurable I/O pins housed in a 484-FPBGA (Fine-Pitch Ball Grid Array) package measuring 23x23mm, delivering excellent pin density for interfacing with various peripheral components and systems. The device incorporates 110,592 bits of embedded RAM, enabling efficient on-chip data storage and buffering without requiring external memory for many applications. Operating from a tightly regulated supply voltage range of 1.425V to 1.575V, this FPGA demonstrates modern low-power design principles while maintaining robust performance across an industrial temperature range of 0°C to 85°C (junction temperature).

The primary advantages of this FPGA include its substantial logic capacity suitable for mid-range complexity designs, the generous I/O count that facilitates extensive system connectivity, surface mount technology compatibility for automated assembly processes, and the inherent flexibility of field-programmable devices that allows for design modifications and updates without hardware changes. The ProASIC3E series is known for its flash-based architecture, offering non-volatility, single-chip solutions, and enhanced security features compared to SRAM-based alternatives.

This device finds application across diverse sectors including industrial automation and control systems, telecommunications infrastructure, medical instrumentation, automotive electronics, aerospace and defense systems, test and measurement equipment, and embedded computing platforms where customizable logic, moderate power consumption, and reliable operation in varying environmental conditions are essential requirements.

Regarding equivalent or alternative models, designers might consider other devices within the ProASIC3E family such as the A3PE3000 for higher gate counts or the A3PE1500 for intermediate capacity requirements. Comparable FPGAs from other manufacturers include Xilinx Spartan-3E series devices (particularly XC3S500E or XC3S1200E), Intel/Altera Cyclone III family members (such as EP3C25 or EP3C40), and Lattice Semiconductor's MachXO2 or ECP3 series devices, though specific feature sets, architecture, and toolchain compatibility should be carefully evaluated when considering substitutions.

A3PE600-FG484 Key Technical Attributes

Manufacturer Part Number: A3PE600-FG484

Supplier Device Package: 484-FPBGA (23x23)

Number of Gates: 600,000

A3PE600-FG484 Packing Size

The A3PE600-FG484 utilizes a fine-pitch ball grid array (FBGA) package, specifically a 484-pin FBGA with 23x23mm dimensions. The surface-mount package ensures efficient space utilization on the PCB and enhances electrical performance due to minimized lead inductance. The package type, FBGA, is constructed with robust materials for reliable mechanical and environmental endurance, supporting mass production with tray-based shipment for safe handling. The pin configuration features 270 user I/O pins distributed across the 484 available connections, supporting extensive interfacing in embedded and programmable logic systems. This package offers optimal thermal management, essential for maintaining operational integrity within the 0°C to 85°C junction temperature range.

A3PE600-FG484 Application

The A3PE600-FG484 is designed for embedded systems, including industrial controls, computing acceleration, communications hardware, instrumentation, and consumer electronics requiring robust reconfigurable logic resources. Its integration capability makes it suitable for applications demanding low power, high security, and reliability in field-programmable logic. The device is well-suited for product designs where re-programmability and hardware flexibility are critical for rapid prototyping and iterative development.

A3PE600-FG484 Features

The product is based on the ProASIC3E FPGA series, providing 600,000 system gates, 270 programmable I/O, and 110,592 total RAM bits. It supports a supply voltage range from 1.425V to 1.575V, allowing for energy-efficient operations without compromising on performance. The 484-FPBGA (23x23) package supports high I/O bandwidth and robust signal integrity. The architecture benefits from embedded RAM blocks for optimized memory operations and hardware-level security, including non-volatile configuration to resist unauthorized tampering and secure key applications. It is designed for surface mounting, simplifying board assembly and manufacturing processes. With a standardized supply package (tray), logistics and device handling are streamlined for high-volume applications.

A3PE600-FG484 Quality and Safety Features

While this device is RoHS non-compliant, its construction adheres to stringent industrial reliability standards. The package offers good mechanical protection, and the electrical characteristics are optimized for low noise and power integrity. The internal architecture of the ProASIC3E series prevents unauthorized access, ensuring secure hardware-based applications and minimizing cybersecurity risks in critical deployments. The operating temperature range (0°C ~ 85°C) ensures safe performance in controlled ambient or commercial electronic environments.

A3PE600-FG484 Compatibility

The A3PE600-FG484 is designed to be compatible with established design flows and toolchains supporting Microchip FPGA technology. It interfaces seamlessly with industry-standard voltage and logic levels, allowing integration into existing embedded systems. The device is suitable as a drop-in replacement or upgrade within the ProASIC3E series, simplifying product lifecycle management and design reuse for OEMs and system integrators. The 484-FPBGA package is widely supported in leading PCB assembly processes.

A3PE600-FG484 Datasheet PDF

Our website features the most authoritative and comprehensive datasheet for the A3PE600-FG484 product. We strongly recommend customers download the datasheet directly from this page to access the latest and most accurate technical information, reference designs, and best practices relevant to this FPGA model.

Quality Distributor

IC-Components is a premium, trusted distributor of Micrel / Microchip Technology products. We guarantee authentic sourcing and competitive pricing for all listed products. For project requirements or volume purchases, we invite you to request a quote on our website today and experience our top-tier customer service, rapid fulfillment, and technical support for the A3PE600-FG484 and the entire ProASIC3E FPGA lineup.

Frequently Asked Questions

How can I ensure compatible power supply levels when integrating the Micrel / Microchip Technology A3PE600-FG484 FPGA into my design?
The A3PE600-FG484 FPGA requires a core supply voltage ranging from 1.425V to 1.575V. It is essential to use a well-regulated, low-noise power supply with sufficient decoupling capacitors close to the device pins to maintain signal integrity and reliable operation. Verify that your power management circuitry can deliver stable voltage within this range under all operating conditions.
Is the A3PE600-FG484 FPGA suitable for long-term industrial applications operating at 85°C, and what considerations should I keep in mind?
The A3PE600-FG484 is rated for operation up to 85°C (TJ). For long-term industrial use, ensure that your thermal management system maintains junction temperatures well below this maximum. Use appropriate heat sinking, airflow, and PCB layout techniques to prevent thermal stress, which could affect reliability and device lifespan.
Can I replace the A3PE600-FG484 FPGA with a different FPGA from another manufacturer without significant redesign?
Replacement requires careful comparison of pinout, package, power requirements, functionality, and performance. The A3PE600-FG484 uses a 484-FPBGA package with 270 I/O pins, so find a comparable device with similar package size, I/O count, and voltage ranges. Consider differences in configuration methods, support circuitry, and compatibility with existing design elements to avoid complex redesigns.
What are the key design considerations when embedding the A3PE600-FG484 FPGA in a board with limited space and high-density I/O requirements?
Given the 23x23 mm 484-FPBGA package and 270 I/O pins, ensure your PCB layout can accommodate fine-pitch ball grid array connections. Pay attention to proper PCB grounding and decoupling strategies to support high I/O density. Additionally, plan for thermal management within the compact space to prevent hot spots and ensure reliable operation.
How should I compare the A3PE600-FG484 FPGA with other series like Cyclone V or Spartan-6 for design-in considerations?
Compare the overall number of logic gates, I/O count, power consumption, package compatibility, and application-specific features. The A3PE600-FG484 offers 600,000 gates and 270 I/O, tailored for moderate complexity applications. Ensure that the target FPGA's capabilities match your functional and environmental requirements, and consider trade-offs in power efficiency, latency, and toolchain support.
What are the potential risks or limitations of using a RoHS non-compliant FPGA like the A3PE600-FG484 in environmentally sensitive applications?
Since the A3PE600-FG484 is RoHS non-compliant, it contains certain substances that may not meet strict environmental standards. For high-reliability or environmentally regulated applications, consider whether this compliance status aligns with your certifications. Otherwise, select RoHS-compliant alternatives to mitigate legal and environmental risks.
What integration considerations should I keep in mind regarding the A3PE600-FG484's mounting and PCB layout?
As a surface-mount device in a 484-FPBGA package, precise PCB design is crucial. Use controlled impedance traces, proper via stitching for ground planes, and ample solder masking for fine-pitch balls. Also, ensure your pick-and-place assembly process is optimized for BGA packages to avoid voids or unconnected balls, which could cause intermittent failures.
How does the A3PE600-FG484 FPGA's configuration interface influence design complexity?
The configuration method details are not specified here, but typically, FPGAs like the A3PE600-FG484 can support JTAG or dedicated configuration Flash devices. Confirm the supported configuration interface and plan for necessary circuitry. Proper design ensures secure, fast, and reliable FPGA programming and reconfiguration.
Is the 110,592 bits of total RAM sufficient for my application, and how do I evaluate whether this parameter meets my memory requirements?
Calculate your design's total memory usage, including logic and embedded memory requirements. The 110,592 RAM bits (13,824 bytes) serve embedded functions and buffer storage; ensure that this capacity aligns with your data processing needs. If more memory is necessary, consider external memory solutions or modules.
What are practical implications of the A3PE600-FG484's 600,000 gates in hardware design and performance?
The gate count indicates the device's complexity and logic capacity. For your application, verify that the logic elements are sufficient for your functionalities without over-constraining the clock speeds or resource utilization. Accurate planning helps prevent performance bottlenecks and allows room for future feature expansion.
Are there environmental or performance considerations when operating the A3PE600-FG484 FPGA outside the recommended temperature range (0°C to 85°C)?
Operating beyond the specified temperature range could result in unreliable operation, increased error rates, or device failure. If your environment exceeds these limits, consider enhanced cooling solutions, derating, or choosing a device with a wider operating temperature range to ensure robustness.
How can I determine whether the A3PE600-FG484 FPGA is suitable for high-speed I/O or clocking application scenarios?
The datasheet or technical support should provide maximum I/O and clock frequencies. Ensure your design's timing requirements are within the FPGA's specifications. Incorporate proper clock routing, impedance matching, and signal integrity measures in your PCB layout to leverage the high-speed capabilities.
What impact does the 484-FPBGA package have on automatic assembly and testing processes?
The large BGA package requires precise pick-and-place equipment and X-ray inspection capabilities for quality assurance. Plan for accurate placement, thermal profiles during reflow, and thorough testing protocols to mitigate assembly risks such as voids or weak solder joints.
How does the non-RoHS compliance of the A3PE600-FG484 influence high-volume manufacturing and end-product environmental certification?
Non-RoHS compliance may limit use in products targeting environmentally friendly certifications or markets with strict environmental regulations. For high-volume manufacturing, ensure your supply chain is aware of this status, and weigh the cost and logistical benefits against potential regulatory limitations.
What are the best practices for upgrading from an older FPGA model to the A3PE600-FG484 in a legacy design?
Review pin compatibility, voltage levels, configuration methods, and timing characteristics. Re-evaluate your power supply and PCB layout to accommodate the new FPGA's pinout and package. Validate the new design thoroughly through simulation and prototyping to address any integration challenges.

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