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TC74LVXC3245FS(E,F)

In Stock 6200 pcs Reference Price(In US Dollars)
1+
$5.522
Manufacturer Part Number:
TC74LVXC3245FS(E,F)
Manufacturer / Brand
TOSHIBA
Part of Description:
897
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 6200 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number TC74LVXC3245FS(E,F)
Manufacturer / Brand TOSHIBA
Stock Quantity 6200 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description 897
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

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Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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TC74LVXC3245FS(E,F) Product Details:

The TC74LVXC3245FS(E,F) is a specialized integrated circuit manufactured by TAEC Product (Toshiba Electronic Devices and Storage Corporation), designed to address critical voltage level translation and bus interface challenges in modern digital systems. This IC belongs to the category of specialized integrated circuits, specifically engineered for bidirectional voltage level translation applications where different logic voltage domains need to communicate effectively.

The product functions as an octal bus transceiver with 3-state outputs, capable of translating signals between different voltage levels, typically from 5V TTL/CMOS logic to 3.3V CMOS logic and vice versa. This functionality is essential in mixed-voltage systems where components operating at different supply voltages must interface seamlessly. The device incorporates advanced CMOS technology to ensure low power consumption while maintaining high-speed operation, making it suitable for battery-powered and portable applications where power efficiency is paramount.

Key specifications include its 24-pin SSOP (Shrink Small Outline Package) configuration designated as package case 634, which provides a compact footprint while maintaining reliable electrical connections. The IC operates with dual supply voltages, typically supporting VCC(A) for the A-port side and VCC(B) for the B-port side, allowing flexible voltage level translation between 1.65V to 5.5V ranges. The device features high-speed switching characteristics with propagation delays typically in the nanosecond range, ensuring minimal signal degradation in high-frequency applications.

The primary advantages of this specialized IC include its bidirectional data flow capability, which eliminates the need for separate transmit and receive circuits, thereby reducing board space and component count. The 3-state output feature allows multiple devices to share common bus lines without signal contention, while the integrated ESD protection enhances reliability in harsh operating environments. The device's wide operating temperature range and robust design make it suitable for industrial applications where environmental conditions may be challenging.

Compatibility extends across various microcontroller families, FPGA interfaces, memory systems, and communication protocols where voltage level translation is required. The IC seamlessly integrates with popular microcontroller platforms including ARM Cortex-M series, PIC microcontrollers, and Arduino-compatible boards, making it versatile for both professional and hobbyist applications.

Primary application areas encompass embedded systems design, IoT device development, industrial automation equipment, automotive electronics, telecommunications infrastructure, and consumer electronics where mixed-voltage interfacing is necessary. The device is particularly valuable in system upgrades where legacy 5V components must interface with modern 3.3V or lower voltage devices, extending the useful life of existing designs while enabling integration of newer, more efficient components.

Equivalent models and alternatives include the Texas Instruments SN74LVCC3245A, which offers similar functionality with comparable electrical characteristics and pinout compatibility. The NXP 74LVCC3245A provides another direct alternative with equivalent performance specifications. For applications requiring different channel counts, the TC74LVXC3244 series offers similar voltage translation capabilities in different configurations. The Fairchild (now ON Semiconductor) 74LVCC3245 represents another functionally equivalent option, while the Analog Devices ADG3245 provides enhanced features for more demanding applications. Additionally, the Maxim MAX3245 and the IDT (now Renesas) 74LVCC3245 serve as suitable alternatives, each offering slight variations in specifications such as propagation delay, power consumption, or operating temperature ranges to meet specific application requirements.

TC74LVXC3245FS(E,F) Key Technical Attributes

Manufacturer Part Number: TC74LVXC3245FS(E,F)

Manufacturer: TAEC Product (Toshiba Electronic Devices and Storage Corporation)

Package / Case: 634

TC74LVXC3245FS(E,F) Packing Size

This model is encapsulated in package type 634, commonly known for its compact size and reliable pin layout ensuring secure placement on PCBs. It features a lead-free, RoHS-compliant material for enhanced environmental safety. The material construction helps optimize thermal dissipation, preventing overheating during high-speed operations, and the electrical configuration ensures precise signal routing. The pin configuration is designed for ease of integration into various system builds and maintains effective electrical isolation where required.

TC74LVXC3245FS(E,F) Application

The TC74LVXC3245FS(E,F) is primarily used for specialized data communication, bus interface and level-shifting applications in advanced electronic systems. It is widely implemented in server motherboards, high-speed data transfer devices, consumer electronic goods, digital communication equipment, and embedded system designs, ensuring robust and efficient signal transmission.

TC74LVXC3245FS(E,F) Features

This IC offers low-voltage operation, making it ideal for portable and battery-powered applications. It is engineered for high-speed and low-power silicon gate CMOS technology, providing improved switching performance and reduced power dissipation. The device supports bidirectional signal transfer, which is managed internally to prevent signal reflection and cross talk, guaranteeing reliable communication even under fluctuating electrical conditions. The device’s wide operating voltage range offers compatibility with various logic families and ensures system flexibility. Electrostatic discharge (ESD) protection and power-off isolation further ensure that the unit remains protected in electrostatically sensitive environments and during power-down scenarios. The symmetrical output drive improves load distribution and timing uniformity, making it highly suitable for precise timing requirements.

TC74LVXC3245FS(E,F) Quality and Safety Features

The TC74LVXC3245FS(E,F) conforms to international RoHS standards, ensuring the use of environmentally friendly materials free from hazardous substances. It is designed to maintain stable operation even at extreme operational margins, providing built-in protections against supply voltage surges and electrical transients. The device further incorporates industry-leading quality standards observed during Toshiba’s manufacturing processes, ensuring long-term reliability and operational safety across diverse environments.

TC74LVXC3245FS(E,F) Compatibility

This specialized IC demonstrates excellent compatibility across a range of voltage levels, seamlessly interfacing with both TTL and CMOS logic families. Its pin-for-pin compatibility and compliance with various bus interface protocols allow it to be integrated effortlessly into both new designs and legacy system upgrades without the need for extensive reconfiguration.

TC74LVXC3245FS(E,F) Datasheet PDF

For comprehensive product insights, technical diagrams, and detailed application notes, you can download the most up-to-date and authoritative datasheet for TC74LVXC3245FS(E,F) directly from our website. We recommend customers utilize the dedicated download link on this page to ensure the information they receive is accurate, complete, and officially provided.

Quality Distributor

IC-Components is recognized as a premium distributor of Toshiba Electronic Devices and Storage Corporation parts. We offer genuine, high-quality ICs with traceable sourcing and full certification. Customers are encouraged to reach out for competitive quotations directly on our platform, benefiting from exclusive offers, fast delivery, and dedicated customer service throughout the procurement process.

Frequently Asked Questions

What considerations should I keep in mind when integrating the TC74LVXC3245FS(E,F) into a high-speed digital system regarding I/O voltage compatibility?
When integrating the TC74LVXC3245FS(E,F), ensure that the I/O voltage levels align with your system’s logic levels. This device typically supports low-voltage operation; verify the datasheet for the recommended I/O voltage range (e.g., 1.8V to 3.3V) to prevent potential signal integrity issues or damage. Design your power supply and I/O interface circuitry accordingly for reliable operation.
Can the TC74LVXC3245FS(E,F) be used in a mixed-signal environment that includes both analog and digital components?
The TC74LVXC3245FS(E,F) is designed as a digital logic device and is not suitable for direct use in analog signal paths. When incorporating this IC into a mixed-signal environment, isolate it from analog signals and ensure proper grounding and shielding strategies. Verify that the device’s switching noise does not impact sensitive analog circuitry.
What are the key differences between the TAEC TC74LVXC3245FS(E,F) and similar 3.3V level shifter ICs from other manufacturers, and how might these differences impact my design?
The TC74LVXC3245FS(E,F) is optimized for high-speed, low-voltage translation with a 64 or 72-bit configuration, supporting multiple channels. Compared to equivalents, it may offer faster switching speeds or lower power consumption. Consider trade-offs such as pin compatibility, package size (634), and availability. Review the datasheet for electrical characteristics to match your timing, power, and I/O requirements precisely.
Is the TC74LVXC3245FS(E,F) suitable for long-term industrial deployment in a temperature range of -40°C to +85°C?
Confirm the industrial temperature specification in the datasheet of the TC74LVXC3245FS(E,F). If it supports -40°C to +85°C, it is suitable for industrial environments. If not, consider alternative parts with extended temperature ranges for reliable long-term operation in harsh conditions.
How does the package type (634 case) for the TC74LVXC3245FS(E,F) influence its integration into densely populated PCBs?
The 634 package offers a compact form factor suitable for high-density applications. Ensure your PCB layout accommodates the package’s dimensions and pin pitch, and verify thermal management provisions since dense configurations can lead to increased junction temperature. Use appropriate land patterns and consider airflow or heat sinking if necessary.
What should I consider when replacing the TC74LVXC3245FS(E,F) with an alternative IC from another manufacturer?
When migrating to a different brand or model, compare electrical parameters such as voltage levels, speed, number of channels, and power consumption. Check for differences in package type, pinout, and supported features. Confirm that the alternative maintains the system’s timing and signal integrity requirements, and validate the new component through rigorous testing.
Can the TC74LVXC3245FS(E,F) handle simultaneous switching of multiple channels without signal degradation?
The device is designed for high-speed digital translation and supports multiple channels. However, simultaneous switching can induce noise and coupling; therefore, ensure proper PCB layout with sufficient grounding, decoupling capacitors, and signal routing to mitigate potential timing and integrity issues.
What are the critical power supply considerations for ensuring stable operation of the TAEC TC74LVXC3245FS(E,F)?
Provide a clean, well-regulated power supply within the recommended voltage range specified in the datasheet. Use proper decoupling capacitors close to the VCC pins, and implement filtering measures to minimize supply noise, which could affect switching performance and reliability.
Is the TC74LVXC3245FS(E,F) suitable for use in low-latency, high-speed communication interfaces such as PCIe or DDR memory interfaces?
While the TC74LVXC3245FS(E,F) supports high-speed translation for certain digital signals, it may not meet the specific timing, skew, and signal integrity requirements of protocols like PCIe or DDR. Consult the datasheet for maximum propagation delay and timing parameters; for critical high-performance interfaces, specialized level shifters are recommended.
What testing considerations should I keep in mind when deploying the TC74LVXC3245FS(E,F) in a production environment?
Verify IC functionality through functional and parametric testing, including speed, voltage levels, and noise margins. Ensure proper handling of static-sensitive components, and perform endurance testing under typical operating conditions to confirm long-term reliability. Document lot-specific variations and establish quality control procedures for mass production.

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TC74LVXC3245FS(E,F)

TOSHIBA

897

In Stock: 6200

SUBMIT RFQ