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Home > Products > Integrated Circuits (ICs) > Specialized ICs > TC74LVXC3245FS(E,F
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TC74LVXC3245FS(E,F

In Stock 6300 pcs Reference Price(In US Dollars)
1+
$5.1809
Manufacturer Part Number:
TC74LVXC3245FS(E,F
Manufacturer / Brand
TOSHIBA
Part of Description:
897
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 6300 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number TC74LVXC3245FS(E,F
Manufacturer / Brand TOSHIBA
Stock Quantity 6300 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description 897
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
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Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

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Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
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TC74LVXC3245FS(E,F Product Details:

The TC74LVXC3245FS(E,F) is a specialized integrated circuit manufactured by TAEC Product (Toshiba Electronic Devices and Storage Corporation) that functions as a high-performance bidirectional voltage level translator and bus transceiver. This IC belongs to the specialized integrated circuits category and is specifically designed to address the critical challenge of interfacing between different voltage domains in modern electronic systems, particularly where 3.3V and 5V logic levels need to communicate seamlessly.

The device incorporates advanced CMOS technology to provide reliable bidirectional signal translation while maintaining signal integrity across different voltage rails. Its primary functionality centers on enabling communication between microcontrollers, processors, and peripheral devices operating at different voltage levels, which is essential in mixed-voltage system designs. The IC features multiple channels of level translation with automatic direction sensing, eliminating the need for external direction control signals and simplifying circuit design.

Key specifications include low power consumption characteristics typical of LVXC series devices, fast switching speeds suitable for high-frequency applications, and robust ESD protection to ensure reliability in harsh operating environments. The device operates across a wide temperature range and maintains consistent performance parameters, making it suitable for both commercial and industrial applications. The 634 package designation indicates a compact surface-mount form factor that optimizes board space utilization while providing adequate thermal dissipation.

The primary advantages of this specialized IC include its ability to reduce system complexity by eliminating the need for discrete level-shifting components, improved signal integrity through integrated design optimization, and enhanced reliability through Toshiba's proven semiconductor manufacturing processes. The device offers excellent noise immunity and minimal propagation delay, ensuring accurate signal transmission in timing-critical applications.

Compatibility extends across a broad range of microcontroller families, FPGA interfaces, memory systems, and communication protocols where voltage level translation is required. The IC seamlessly integrates with popular development platforms and supports various digital communication standards, making it versatile for diverse electronic designs.

Primary application areas encompass embedded systems development, industrial automation equipment, automotive electronics, consumer electronics, telecommunications infrastructure, and IoT device implementations. The device is particularly valuable in battery-powered applications where efficient power management and reliable inter-chip communication are paramount.

Regarding equivalent models, several alternatives exist in the market including Texas Instruments' TXS0108E and SN74LVC8T245, NXP's 74LVC8T245, Analog Devices' ADG3308, and Maxim Integrated's MAX3378E. Additional comparable options include ON Semiconductor's NLV8T245, Diodes Incorporated's 74LVC8T245, and various pin-compatible devices from manufacturers such as STMicroelectronics (ST74LVC8T245) and Nexperia (74LVC8T245). These alternatives offer similar functionality with varying specifications regarding channel count, voltage ranges, package options, and performance characteristics, allowing designers to select the most appropriate solution based on specific application requirements, cost considerations, and supply chain preferences.

TC74LVXC3245FS(E,F Key Technical Attributes

TC74LVXC3245FS(E,F

Integrated Circuits (ICs), Specialized ICs

TC74LVXC3245FS(E,F Packing Size

This product is packaged in the 634 form factor, designed for automated assembly and efficient manufacturing processes. The type and material of the package ensure enhanced durability and protection against environmental factors. Integrated with standardized pin configuration, the IC maintains stable thermal characteristics, supporting reliable operation across a range of electrical properties.

TC74LVXC3245FS(E,F Application

The TC74LVXC3245FS(E,F is ideally suited for high-speed and low-voltage digital system applications. It supports efficient data transfer between voltage domains, making it perfect for advanced communication systems, computer peripherals, industrial control units and consumer electronics where reliable bidirectional signal translation is required.

TC74LVXC3245FS(E,F Features

This specialized IC offers low power consumption, high noise immunity, and compatibility with TTL and CMOS logic levels. Its design supports true bidirectional data transmission, with output enable functionality that enhances flexibility in circuit implementations. The component’s advanced packaging delivers optimal thermal dissipation, and the robust materials safeguard the IC against mechanical and electrical stress. System designers benefit from its wide operating voltage range, making the part highly adaptable to various system requirements. The IC incorporates input and output protection circuitry, ensuring performance stability in fluctuating environments and meeting the stringent demands of high-speed digital systems.

TC74LVXC3245FS(E,F Quality and Safety Features

Superior reliability is achieved with the TC74LVXC3245FS(E,F) due to its rigorous manufacturing and testing protocols. The device complies with international safety standards for integrated circuits, reflecting high resilience to electrostatic discharge (ESD) and over-voltage. All units are produced under strict quality controls, guaranteeing consistent performance and extended operational lifespan.

TC74LVXC3245FS(E,F Compatibility

The TC74LVXC3245FS(E,F) is engineered for seamless integration into systems utilizing other TAEC (Toshiba) components or similar interface devices. Its compatibility with both TTL and CMOS logic families ensures flexible design possibilities. The device is pin- and functionality-compatible with industry-standard bidirectional voltage-level translators, facilitating easy substitution and upgrade.

TC74LVXC3245FS(E,F Datasheet PDF

We host the most up-to-date and authoritative datasheet for the TC74LVXC3245FS(E,F) on our website. For comprehensive technical information, electrical parameters, and application guidelines, customers are strongly encouraged to download the datasheet directly from this product page to ensure optimal integration and utilization.

Quality Distributor

IC-Components is recognized as a premium distributor of TAEC products. We offer verified stock and expert support for the TC74LVXC3245FS(E,F), ensuring reliable supply chain solutions. For the best pricing and immediate availability, customers are invited to request a quote directly on our site and experience our outstanding service and product expertise.

Frequently Asked Questions

What are the key considerations when integrating the TC74LVXC3245FS IC into a low-voltage, high-speed digital system?
When integrating the TC74LVXC3245FS, ensure that the power supply voltage (Vcc) and input voltage levels are within specified ranges to prevent damage or unreliable operation. Pay attention to the signal integrity at the 634-package case, especially regarding trace lengths and parasitic inductances. Proper decoupling with adequate bypass capacitors is critical to maintain signal stability at high speeds. Confirm that the system's timing requirements respect the IC's propagation delay specifications to avoid setup and hold time violations.
How should I select an appropriate power supply and grounding scheme for the TC74LVXC3245FS in a mixed-signal environment?
Use a well-designed power distribution network with clean, low-noise power supplies tailored to the IC's voltage range. Employ separate analog and digital ground planes if applicable, and connect them at a single ground point to minimize ground loop noise. Ensure that the supply voltage (Vcc) remains stable under different load conditions, and include decoupling capacitors close to the IC pins to mitigate transient fluctuations that could affect digital signal integrity.
Is the TC74LVXC3245FS suitable for industrial applications requiring extended temperature operation?
Confirm the operating temperature range specified by Toshiba for the TC74LVXC3245FS. If intended for industrial use, verify that the device's temperature ratings align with your application's environmental conditions. For extended reliability under harsh conditions, consider additional measures such as conformal coating or thermal management, as the standard package (634) may have specific temperature limits.
What are the best practices for replacing a similar IC with the TC74LVXC3245FS to ensure compatibility and reliability?
When replacing an existing IC with the TC74LVXC3245FS, verify that the pin configuration, voltage levels, and timing characteristics match or are compatible. Review the existing system's board layout for compatibility of package size and pin pitch. Consider the electrical characteristics, such as drive strength and input/output voltage levels, to prevent signal degradation. Update the schematic and layout documentation accordingly, and conduct thorough testing to confirm proper operation.
How does the package case (634) of the TC74LVXC3245FS influence heat dissipation and reliability in high-density designs?
The 634 package case provides limited surface area for heat dissipation. In high-density or high-power designs, ensure adequate thermal management through proper PCB layout, including ground planes and thermal vias near the IC. Use thermal interface materials if necessary to enhance heat transfer. Monitoring operating temperature during operation will help prevent thermal stress that could compromise long-term reliability.
Can the TC74LVXC3245FS operate correctly when powered from a single supply voltage in various digital logic levels?
Yes, the TC74LVXC3245FS is designed for operation with a single supply voltage within its specified range. Ensure that input signals adhere to the recommended voltage levels for logic high and low at that supply voltage. Consistent reference voltages and proper level shifting are essential if integrating with different logic families to maintain data integrity.
What are the implications of using the TC74LVXC3245FS in systems with multiple clock domains or high-speed data transfer?
When deploying the TC74LVXC3245FS across multiple clock domains, ensure that signal timing, setup, and hold times are respected to avoid metastability. For high-speed data transfer, maintain proper termination and impedance matching on high-speed lines to minimize reflections. Proper PCB layout, shielding, and differential signaling where applicable will reduce electromagnetic interference and improve overall system stability.
Is the TC74LVXC3245FS compatible with standard logic families like TTL or CMOS, and what should I consider when connecting it to these?
The TC74LVXC3245FS is compatible with TTL and CMOS logic levels within its specified input voltage ranges. When connecting to TTL devices, note that input thresholds are different; ensure that signal levels meet the required logic high and low thresholds. Also, consider the drive capability of the IC and the loading of the connected logic devices to prevent signal degradation.
How does the quantity (6100 units) of the TC74LVXC3245FS influence procurement and batch consistency considerations?
A large quantity like 6100 units indicates suitability for mass production or long-term projects. Confirm that the manufacturer provides consistent quality and batch-to-batch uniformity. Establish supplier quality agreements, and consider requesting sample lots from different production batches early to verify electrical and mechanical consistency before full-scale procurement.
What limitations or potential risks should I be aware of when designing systems with the TC74LVXC3245FS in high-reliability or safety-critical applications?
Verify the device's specified operating temperature, voltage, and timing margins to ensure suitability for safety-critical systems. Watch for potential issues like latch-up, early failure modes, or environmental stress. Implement redundancy and error detection where possible. Regularly review the manufacturer's datasheet for updates on recommended operating conditions and reliability data, and incorporate robustness measures such as adequate decoupling and thermal management to enhance overall system reliability.

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TC74LVXC3245FS(E,F

TOSHIBA

897

In Stock: 6300

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