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S34ML04G100TFI003

Manufacturer Part Number:
S34ML04G100TFI003
Manufacturer / Brand
Cypress Semiconductor Corp
Part of Description:
IC FLASH 4GBIT PARALLEL 48TSOP
Datasheets:
S34ML04G100TFI003(1).pdfS34ML04G100TFI003(2).pdfS34ML04G100TFI003(3).pdfS34ML04G100TFI003(4).pdfS34ML04G100TFI003(5).pdfS34ML04G100TFI003(6).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 4312 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number S34ML04G100TFI003
Manufacturer / Brand Cypress Semiconductor Corp
Stock Quantity 4312 pcs Stock
Category Integrated Circuits (ICs) > Memory - Memory
Description IC FLASH 4GBIT PARALLEL 48TSOP
Lead Free Status / RoHS Status: ROHS3 Compliant
RFQ S34ML04G100TFI003 Datasheets S34ML04G100TFI003 Details PDF
S34ML04G100TFI003 Details PDF for FR.pdf
S34ML04G100TFI003 Details PDF for IT.pdf
S34ML04G100TFI003 Details PDF for DE.pdf
S34ML04G100TFI003 Details PDF for ES.pdf
S34ML04G100TFI003 Details PDF for KR.pdf
Write Cycle Time - Word, Page 25ns
Voltage - Supply 2.7V ~ 3.6V
Technology FLASH - NAND
Supplier Device Package 48-TSOP
Series ML-1
Package / Case 48-TFSOP (0.724", 18.40mm Width)
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 4Gbit
Memory Organization 512M x 8
Memory Interface Parallel
Memory Format FLASH
Base Product Number S34ML04

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


S34ML04G100TFI003 Product Details:

The Cypress Semiconductor S34ML04G100TFI003 is a high-capacity, non-volatile NAND flash memory integrated circuit (IC) designed for a wide range of applications. With a memory size of 4Gb (512M x 8), this parallel interface device offers a robust and reliable storage solution.

The S34ML04G100TFI003 is classified as a memory IC, specifically in the NAND flash memory category. It is housed in a 48-TSOP I (Thin Small Outline Package) enclosure, which provides a compact and space-efficient form factor. The device is RoHS-compliant, ensuring environmental responsibility and compatibility.

This NAND flash memory IC addresses several design challenges, including the need for high-density, non-volatile storage with fast read/write capabilities. The S34ML04G100TFI003 boasts a wide operating temperature range of -40°C to 85°C, making it suitable for a variety of applications, including industrial and automotive environments.

Key specifications of the S34ML04G100TFI003 include:

- Memory size: 4Gb (512M x 8)

- Memory type: Non-volatile NAND flash

- Memory interface: Parallel

- Write cycle time: 25ns (word/page)

- Supply voltage: 2.7V to 3.6V

- Moisture Sensitivity Level (MSL): 3 (168 Hours)

- Mounting type: Surface mount

The primary advantages of the S34ML04G100TFI003 include its high-density storage capacity, fast write/read performance, and wide operating temperature range. These features make it a suitable choice for applications that require reliable and efficient non-volatile memory, such as industrial automation, automotive electronics, consumer electronics, and data storage systems.

Regarding compatibility, the S34ML04G100TFI003 is part of the ML-1 series from Cypress Semiconductor. While there may be equivalent or alternative models available from other manufacturers, it is essential to consult the specific requirements of your application and ensure compatibility with any replacement devices.

S34ML04G100TFI003 Image
S34ML04G100TFI003 (1)

S34ML04G100TFI003 Key Technical Attributes

Memory Size: 4Gb

Memory Type: Non-Volatile

Technology: FLASH - NAND

S34ML04G100TFI003 Packing Size

Package Type: TSOP48

Material: Plastic Encapsulation

Size: 48-TFSOP (0.724", 18.40mm Width)

Thermal characteristics: Operating Temperature: -40°C ~ 85°C

Electrical Properties: Voltage Supply: 2.7 V ~ 3.6 V

S34ML04G100TFI003 Application

Suitable for high-density, high-performance memory applications including solid-state storage devices, digital cameras, and other electronics requiring robust memory solutions.

S34ML04G100TFI003 Features

This Cypress Semiconductor NAND FLASH Memory IC features a parallel interface with a typical write cycle time for word/page at 25ns. The device holds a memory size of 4Gb configured as 512M x 8, optimized for fast and reliable storage. Operating within a voltage range of 2.7 V to 3.6 V, it suits a variety of power-sensitive applications. Furthermore, it is packaged in a 48-TSOP I format, ideal for assembly and integration into surface mount technology (SMT).

S34ML04G100TFI003 Quality and Safety Features

The S34ML04G100TFI003 is lead-free and RoHS compliant, ensuring safety and sustainability standards are met. Moisture Sensitivity Level (MSL) 3 (168 Hours) guarantees stability and functionality within humid environments.

S34ML04G100TFI003 Compatibility

The product employs a standard parallel interface—a widely accepted protocol for storage ICs, ensuring broad device compatibility and ease of integration in various design architectures.

S34ML04G100TFI003 Datasheet PDF

For the most accurate and detailed specifications and operational guidelines, visit our website. We provide the most authoritative datasheet PDF for the S34ML04G100TFI003 model, available for download on the current page.

Quality Distributor

IC-Components is a premium distributor of Cypress Semiconductor products. We ensure top quality and reliability in storing and handling sensitive integrated circuits like the S34ML04G100TFI003. For top-notch service and a detailed quote, we encourage customers to get in touch through our website today.

Frequently Asked Questions

Can the S34ML04G100TFI003 NAND flash be used as a drop-in replacement for a Micron MT29F4G08ABADA or Samsung K9F4G08U0D in an existing 3.3V embedded design?
The S34ML04G100TFI003 is electrically compatible with the Micron MT29F4G08ABADA and Samsung K9F4G08U0D in terms of voltage (2.7V–3.6V), page size (2KB), block size (128 pages), and ONFI 1.0 interface timing. However, command set nuances and status register bit definitions differ slightly—verify initialization sequences and ECC handling in your firmware. Additionally, the S34ML04G100TFI003 requires stricter tWB (Write Busy) timing management during program/erase cycles; ensure your controller supports adequate busy polling or interrupt-driven wait states.
What are the critical layout and signal integrity considerations when routing the parallel interface of the S34ML04G100TFI003 on a 4-layer PCB?
For reliable operation of the S34ML04G100TFI003, maintain matched trace lengths (±100 mil tolerance) for data lines (DQ0–DQ7) and control signals (CLE, ALE, WE#, RE#, CE#, R/B#). Route all signals over a solid ground plane to minimize crosstalk and impedance discontinuities. Keep clock-to-data skew under 500 ps if using synchronous timing modes. Avoid vias in high-speed signal paths, and terminate unused inputs per the datasheet. Decoupling capacitors (100 nF ceramic) must be placed within 2 mm of VCC pins due to fast transient currents during page programming.
Is the S34ML04G100TFI003 suitable for automotive under-hood applications given its -40°C to +85°C operating range?
While the S34ML04G100TFI003 meets the -40°C to +85°C temperature rating, it is not AEC-Q100 qualified and lacks automotive-grade screening (e.g., burn-in, PPAP documentation). For under-hood use where junction temperatures may exceed 105°C or require extended reliability validation, consider industrial-grade alternatives like the Cypress S34ML04G100TFV003 (automotive variant) or evaluate thermal derating and conformal coating to mitigate moisture and thermal cycling risks.
How does the S34ML04G100TFI003 handle bad block management compared to other ONFI 1.0 NAND devices, and what firmware adjustments are needed?
The S34ML04G100TFI003 marks factory bad blocks in the spare area of the first page of each block using a specific byte pattern (0x00 in byte 0 of spare area). Unlike some legacy devices, it does not support dynamic bad block remapping in hardware—your firmware must implement wear-leveling and bad block skipping. Ensure your NAND controller or file system (e.g., UBIFS, YAFFS2) includes robust ECC (minimum 4-bit correction per 512 bytes) and bad block table tracking to maintain data integrity over the device’s lifetime.
Can I operate the S34ML04G100TFI003 at 2.5V to save power in a battery-powered IoT node?
No—the S34ML04G100TFI003 has a minimum supply voltage of 2.7V. Operating below this threshold violates the datasheet specifications and risks undefined behavior, including failed program/erase operations or data corruption. For low-power designs targeting 2.5V systems, consider migrating to a 1.8V NAND such as the S34ML01G200TFI000 (1Gb, 1.8V) or implement a boost converter to maintain 3.0V–3.6V supply rails during active flash transactions.
What is the expected endurance and data retention behavior of the S34ML04G100TFI003 under continuous logging in industrial environments?
The S34ML04G100TFI003 guarantees 100,000 program/erase cycles per block and 10-year data retention at 25°C. In industrial settings with elevated temperatures (e.g., 70°C+), retention drops significantly—expect ~2–3 years at 85°C. For continuous logging, implement aggressive wear leveling across all blocks and refresh critical data periodically. Monitor uncorrectable bit error rates (UBER); if ECC failures increase, retire affected blocks proactively to prevent system crashes.
Does the S34ML04G100TFI003 support hardware-based ECC generation and correction, or must this be handled externally?
The S34ML04G100TFI003 does not include on-die ECC logic—all error correction must be implemented externally by the host controller or SoC. You must provide a minimum of 4-bit BCH or 8-bit LDPC ECC per 512-byte page. Many ARM-based MCUs (e.g., NXP i.MX RT, STM32MP1) include built-in NAND ECC engines compatible with this requirement. Verify your ECC engine’s syndrome calculation aligns with the S34ML04G100TFI003’s bit error characteristics to avoid uncorrectable errors during high-temperature operation.
Are there known compatibility issues when migrating from a 5V-tolerant parallel NAND to the 3.3V-only S34ML04G100TFI003 in legacy systems?
Yes—the S34ML04G100TFI003 is not 5V tolerant on any I/O pin. Direct connection to 5V logic will damage the device. Use level shifters (e.g., TXB0108) or series resistors with Schottky clamping diodes on all control and data lines if interfacing with 5V microcontrollers. Ensure power sequencing adheres to VCC ramp-up before I/O activity to prevent latch-up. Re-evaluate pull-up/pull-down resistor values, as 5V systems often use weaker terminations that may not meet the S34ML04G100TFI003’s VIH/VIL thresholds at 3.3V.
What moisture sensitivity precautions are required during assembly of the S34ML04G100TFI003 in high-volume production?
The S34ML04G100TFI003 has an MSL 3 rating (168 hours floor life at ≤30°C/60% RH). Components must be baked at 125°C for 24 hours if exposed beyond this window before reflow. Store reels in dry cabinets (<5% RH) or sealed moisture barrier bags with desiccant. During SMT processing, limit reflow to one cycle above 217°C peak temperature to avoid package delamination. Implement in-circuit test (ICT) within 8 hours post-reflow to catch latent moisture-induced defects early.

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