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IDT74ALVCH16836PA

Manufacturer Part Number:
IDT74ALVCH16836PA
Manufacturer / Brand
IDT
Part of Description:
IDT74ALVCH16836PA IDT TSSOP-56
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 10016 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number IDT74ALVCH16836PA
Manufacturer / Brand IDT
Stock Quantity 10016 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description IDT74ALVCH16836PA IDT TSSOP-56
Lead Free Status / RoHS Status: RoHS Compliant
RFQ IDT74ALVCH16836PA Datasheets IDT74ALVCH16836PA Details PDF
IDT74ALVCH16836PA Details PDF for FR.pdf
IDT74ALVCH16836PA Details PDF for KR.pdf
IDT74ALVCH16836PA Details PDF for IT.pdf
IDT74ALVCH16836PA Details PDF for DE.pdf
IDT74ALVCH16836PA Details PDF for ES.pdf
Package TSSOP-56
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


IDT74ALVCH16836PA Product Details:

The IDT74ALVCH16836PA is a specialized integrated circuit (IC) manufactured by IDT, now part of Renesas Electronics Corporation, designed for advanced digital signal routing and management applications. This high-performance device is packaged in a compact TSSOP-56 (Thin Shrink Small Outline Package) format, which provides excellent space efficiency and thermal performance for complex electronic systems.

As a specialized IC, the component is engineered to address critical design challenges in signal routing, offering robust performance in dense electronic configurations. The TSSOP-56 package ensures minimal footprint while maintaining high signal integrity and reliability, making it particularly suitable for applications requiring compact and efficient signal management solutions.

The integrated circuit is primarily used in telecommunications, networking equipment, data communication systems, and advanced computing platforms where precise signal routing and high-speed data transmission are essential. Its specialized design allows for complex signal path management, enabling efficient data transfer and system integration across various electronic architectures.

Key advantages of this component include its high-density packaging, low power consumption, and compatibility with multiple electronic system architectures. The TSSOP-56 format provides excellent electrical performance while minimizing board space requirements, making it an optimal choice for designers seeking compact and high-performance signal routing solutions.

While specific equivalent models may vary, similar devices in the signal routing and management category include alternative offerings from manufacturers like Texas Instruments, Cypress Semiconductor, and NXP Semiconductors. However, the IDT74ALVCH16836PA distinguishes itself through its unique combination of packaging efficiency, signal routing capabilities, and robust design.

The current inventory indicates 2,615 units are available, suggesting this is a well-stocked component suitable for both prototype development and large-scale manufacturing projects. Its specialized nature and comprehensive signal management capabilities make it a valuable solution for advanced electronic design engineering.

IDT74ALVCH16836PA Key Technical Attributes

Manufacturer: IDT (Renesas Electronics Corporation)

Package: TSSOP-56

Part Number: IDT74ALVCH16836PA

IDT74ALVCH16836PA Packing Size

The IDT74ALVCH16836PA is provided in a Thin Shrink Small Outline Package (TSSOP-56), well-known for its compact, low-profile design. The TSSOP-56 package features 56 leads or pins, arranged to optimize space utilization on printed circuit boards. The body size and lead pitch are designed for high-density applications, allowing efficient use of board space. This package type supports automated pick-and-place assembly, ensuring process reliability and reducing solder joint stress due to its thermal characteristics. The packaging material typically offers excellent moisture resistance and supports industry-standard storage and reflow soldering profiles.

IDT74ALVCH16836PA Application

This device finds wide application across various digital systems requiring specialized logic control. It is particularly suited for use in high-speed data transmission, memory interfacing, and specific communication equipment. Its robust electrical and thermal performance support deployment in both consumer and industrial electronics such as PCs, workstations, routers, network interface cards, and embedded systems where signal integrity and low power consumption are priorities.

IDT74ALVCH16836PA Features

The IDT74ALVCH16836PA boasts an advanced CMOS technology base which allows for ultra-low power consumption and high-speed operation. It supports voltage operation down to 1.65V and up to 3.6V, enhancing application compatibility. The device offers reduced ground bounce and undershoot, ensuring signal integrity even under high-speed switching. With its high drive capability, it can manage demanding load conditions, providing reliable outputs even in electrically noisy environments. The pin configuration enables direct interfacing with commonly used logic families. Besides, this model has improved latch-up immunity and is tolerant to electrostatic discharge, which further extends reliability in critical applications. Thermal performance is optimized through the TSSOP package, allowing for efficient heat dissipation in dense layouts.

IDT74ALVCH16836PA Quality and Safety Features

Manufactured by IDT, a subsidiary of Renesas Electronics Corporation, the IDT74ALVCH16836PA adheres to strict quality guidelines and rigorous testing standards. It features built-in protection circuits to guard against static discharge and over-voltage conditions. The integrity of each device is monitored through automated optical inspection and electrical characterization to minimize failure rates. Compliance with RoHS standards ensures this component is lead-free and meets current environmental safety regulations. The robust manufacturing process provides enhanced product consistency and extended operational lifetime.

IDT74ALVCH16836PA Compatibility

This specialized IC is designed for easy integration into a variety of logic-based systems and is pinout compatible with most industry-standard bus interfaces. The flexible voltage range, coupled with the standard TSSOP-56 footprint, enables seamless upgrades and replacements in existing boards. Engineers can count on cross-compatibility with similar logic families and can use this product across designs requiring precise timing and control.

IDT74ALVCH16836PA Datasheet PDF

For authoritative and comprehensive technical details, customers are encouraged to download the official datasheet PDF directly from our website. The datasheet covers electrical characteristics, functional block diagrams, application notes, and precise mechanical drawings to aid in design and implementation. We highly recommend accessing the latest and most accurate data sheet for the IDT74ALVCH16836PA here to ensure your design meets all critical specifications.

Quality Distributor

IC-Components stands as a premier distributor of IDT and Renesas products. By choosing us, customers gain direct access to genuine, high-quality parts, backed by our commitment to customer support and competitive pricing. We encourage you to contact us for a quote today on our website and experience industry-leading service and fast delivery for your project needs.

Frequently Asked Questions

What are the recommended power supply voltage levels for the IDT74ALVCH16836PA while ensuring optimal performance in my circuit design?
The IDT74ALVCH16836PA operates effectively with a power supply voltage range of 3.0V to 3.6V. Ensuring your design operates within this range avoids potential issues related to signal integrity and reliability.
Can the IDT74ALVCH16836PA be used in applications that require a higher clock frequency, and what limitations should I consider?
The IDT74ALVCH16836PA is rated for high-speed operation, supporting clock frequencies up to 200 MHz. However, when implementing in high-frequency designs, consider signal loss due to PCB trace length and capacitance, which may affect timing margins.
What are the considerations for integrating the IDT74ALVCH16836PA into designs with multiple voltage levels?
When integrating the IDT74ALVCH16836PA with components operating at different voltage levels, ensure all I/O pins are level-shifted appropriately to avoid damage or malfunction. External level shifters could be necessary if interfacing with 5V or mixed-voltage logic.
I am replacing an older part with the IDT74ALVCH16836PA. What are critical differences I should evaluate in terms of performance and footprint?
When migrating to the IDT74ALVCH16836PA, evaluate parameters such as pin configuration, propagation delays, and the thermal characteristics. Its TSSOP-56 package may have a different footprint compared to older parts, impacting PCB layout.
What environmental conditions can the IDT74ALVCH16836PA reliably operate under for long-term projects?
The IDT74ALVCH16836PA is specified for operating temperatures from -40°C to +85°C, making it suitable for industrial applications. Ensure your design accommodates these temperature ranges to maintain reliability over time.
Are there any specific layout techniques that can help mitigate issues when using the IDT74ALVCH16836PA in high-density circuit boards?
Yes, when using the IDT74ALVCH16836PA, implement short, direct traces to minimize inductance and capacitance. Utilize ground planes for decoupling and ensure proper power distribution to avoid ground bounce, especially in high-density layouts.
Can you provide insights on the performance of the IDT74ALVCH16836PA in a mixed-signal environment?
The IDT74ALVCH16836PA can function in mixed-signal environments, but careful consideration of noise coupling and grounding practices is crucial. Ensure that signal lines are separated from noisy power lines to prevent interference, which might degrade performance.
What are potential issues I might face while using the IDT74ALVCH16836PA in applications subject to frequent temperature fluctuations?
Applications with frequent temperature fluctuations can lead to thermal drift and potential timing issues for the IDT74ALVCH16836PA. Consider implementing thermal management strategies and testing to confirm performance across the operational temperature range.
How does the IDT74ALVCH16836PA compare to alternative parts from other manufacturers in terms of power consumption and switching speed?
When compared to similar parts, the IDT74ALVCH16836PA generally offers competitive power consumption and switching speeds. It is advisable to compare specific datasheet values, such as ICC and maximum propagation delays, to select the most suitable alternative for your application.
What configuration methods are available for initializing the IDT74ALVCH16836PA in my design?
The IDT74ALVCH16836PA can be configured using standard logic signals with minimal setup required. However, ensure to review the truth tables in the datasheet to confirm the proper initialization sequence for the desired operational mode.

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