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Home > Products > Capacitors > Ceramic Capacitors > C2012C0G1H681J
TDK Corporation
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C2012C0G1H681J

Manufacturer Part Number:
C2012C0G1H681J
Manufacturer / Brand
TDK Corporation
Part of Description:
CAP CER 680PF 50V C0G 0805
Datasheets:
C2012C0G1H681J(1).pdfC2012C0G1H681J(2).pdfC2012C0G1H681J(3).pdf
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 2711 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number C2012C0G1H681J
Manufacturer / Brand TDK Corporation
Stock Quantity 2711 pcs Stock
Category Capacitors > Ceramic Capacitors
Description CAP CER 680PF 50V C0G 0805
Lead Free Status / RoHS Status: RoHS Compliant
RFQ C2012C0G1H681J Datasheets C2012C0G1H681J Details PDF
C2012C0G1H681J Details PDF for FR.pdf
C2012C0G1H681J Details PDF for KR.pdf
C2012C0G1H681J Details PDF for IT.pdf
C2012C0G1H681J Details PDF for ES.pdf
C2012C0G1H681J Details PDF for DE.pdf
Voltage - Rated 50V
Tolerance ±5%
Thickness (Max) 0.028' (0.70mm)
Temperature Coefficient C0G, NP0
Size / Dimension 0.079' L x 0.049' W (2.00mm x 1.25mm)
Series C
Ratings -
Package / Case 0805 (2012 Metric)
Package Tape & Reel (TR)
Operating Temperature -55°C ~ 125°C
Mounting Type Surface Mount, MLCC
Lead Style -
Lead Spacing -
Height - Seated (Max) -
Features -
Failure Rate -
Capacitance 680 pF
Applications General Purpose

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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C2012C0G1H681J Product Details:

The TDK Corporation C2012C0G1H681J is a high-performance ceramic multilayer capacitor (MLCC) designed for versatile electronic applications. This compact surface-mount component offers exceptional reliability and precision for general-purpose electronic circuits.

Featuring a compact 0805 (2.00mm x 1.25mm) form factor, this capacitor provides 680 pF capacitance with a tight ±5% tolerance, making it ideal for precision electronic design. Its C0G/NP0 temperature coefficient ensures stable performance across a wide -55°C to 125°C operating temperature range, which is critical for applications requiring consistent electrical characteristics under varying environmental conditions.

The capacitor is rated at 50V and utilizes a ceramic dielectric with excellent temperature stability. Its surface-mount design allows for efficient PCB integration, and the component comes packaged in a convenient tape and reel format, facilitating automated assembly processes.

Key advantages include high reliability, compact size, wide temperature tolerance, and suitable performance for general-purpose electronic circuits. The component is particularly well-suited for applications in telecommunications, consumer electronics, automotive systems, and industrial control equipment where consistent electrical performance is paramount.

Equivalent alternative models might include similar 0805 MLCC capacitors from manufacturers like Murata, Samsung Electro-Mechanics, and Yageo, with comparable specifications in the 680 pF, C0G/NP0 category and 50V rating.

The capacitor's robust design and precise electrical characteristics make it an excellent choice for engineers seeking a reliable, high-performance passive component for complex electronic systems.

C2012C0G1H681J Key Technical Attributes

Capacitance 680 pF

Rated Voltage 50 V

Tolerance ±5%

C2012C0G1H681J Packing Size

Package type Tape & Reel (TR)

Package size 0805 (2012 Metric)

Dimensions 2.00 mm length x 1.25 mm width x 0.70 mm max thickness

Pin configuration Surface Mount Device (SMD), 2 terminals

Thermal characteristics Operating temperature range -55°C to 125°C

Electrical properties Temperature coefficient C0G (NP0), stable and low loss dielectric

C2012C0G1H681J Application

Suitable for general purpose electronic circuits including filtering, timing, and coupling applications in consumer electronics, industrial devices, and communication equipment

C2012C0G1H681J Features

Constructed with high-quality C0G/NP0 ceramic dielectric material providing excellent electrical stability and minimal capacitance change over temperature

Low dissipation factor ensures efficient signal integrity and low energy loss

Surface mount MLCC design enables compact PCB layouts and reliable automated assembly

Wide operating temperature range maintains consistent performance in harsh environments

Rated for 50 volts, suitable for low to medium voltage circuits

Premium TDK C Series technology guarantees long-term reliability and reduced aging effects

C2012C0G1H681J Quality and Safety Features

Manufactured under stringent quality controls by TDK Corporation, a globally recognized leader in passive components

Compliance with international standards for capacitors ensures safety, reliability, and performance consistency

Materials selected to provide enhanced moisture resistance and mechanical robustness

Extensive testing for dielectric strength, insulation resistance, and thermal shock resilience

C2012C0G1H681J Compatibility

Fully compatible with standard 0805 (2012 metric) PCB footprints for seamless integration into existing designs

Suitable for automatic pick-and-place assembly machines due to tape & reel packaging format

Interchangeable with other C0G/NP0 capacitors of similar ratings while maintaining superior temperature stability and tolerance characteristics

C2012C0G1H681J Datasheet PDF

Our website hosts the most authoritative and up-to-date datasheet for the C2012C0G1H681J capacitor model. Customers are highly encouraged to download the datasheet directly from this page to obtain detailed electrical, mechanical, and reliability specifications essential for precise design and application.

Quality Distributor

IC-Components is a premium and authorized distributor of TDK Corporation products, guaranteeing genuine parts and excellent customer service. We invite customers to request a quote on our website to secure competitive pricing and reliable supply for the C2012C0G1H681J capacitor and other TDK components. Trust IC-Components for quality, authenticity, and fast delivery.

Frequently Asked Questions

When designing with the TDK C2012C0G1H681J capacitor for high-frequency filtering, what are the practical implications of its C0G temperature coefficient beyond just capacitance stability?
The C0G/NP0 temperature coefficient in the TDK C2012C0G1H681J ensures excellent capacitance stability across a wide operating temperature range (-55°C to 125°C), which is critical for precise filtering in RF applications. Beyond stability, C0G exhibits very low dielectric loss (high Q factor), minimizing signal attenuation and distortion at high frequencies. This makes the C2012C0G1H681J suitable for applications where signal integrity is paramount, such as impedance matching networks or resonant circuits, where other capacitor types with higher loss tangents would introduce significant performance degradation.
What are the key considerations for replacing an older 0805 MLCC with the TDK C2012C0G1H681J in a legacy industrial control system designed for 100V operation, considering the 50V rating of the C2012C0G1H681J?
Replacing an older 0805 MLCC with the TDK C2012C0G1H681J in a legacy system originally designed for 100V operation presents a significant risk. The C2012C0G1H681J has a rated voltage of 50V. Operating it at or near 100V would likely lead to premature dielectric breakdown, device failure, and potential damage to other components in the circuit. A direct drop-in replacement is not feasible without a thorough re-evaluation of the circuit's voltage stress. Engineers must either identify a higher voltage-rated C0G capacitor with similar dimensions and performance characteristics or redesign the circuit to accommodate the 50V limitation of the C2012C0G1H681J.
How does the ±5% tolerance of the TDK C2012C0G1H681J impact its suitability for precision timing circuits compared to components with tighter tolerances?
For precision timing circuits, a ±5% tolerance on capacitance, as found in the TDK C2012C0G1H681J, may introduce unacceptable drift and timing inaccuracies, especially in applications requiring nanosecond-level resolution. While C0G exhibits excellent temperature stability, the initial ±5% variation can be a limiting factor. If the application demands tighter timing, a capacitor with a ±1% or ±2% tolerance would be a more appropriate choice. Engineers should carefully assess the cumulative tolerance effects of all components in the timing path before selecting the C2012C0G1H681J for such critical functions.
In a high-temperature industrial environment where operating temperatures can reach 110°C, how does the C0G formulation of the TDK C2012C0G1H681J contribute to long-term reliability and avoid capacitance drift?
The C0G (Class 1) dielectric in the TDK C2012C0G1H681J is specifically engineered for exceptional capacitance stability across a wide temperature range, including high temperatures up to 125°C. Unlike Class 2 dielectrics (e.g., X7R, Y5V) which exhibit significant capacitance shifts with temperature, voltage, and aging, the C0G formulation of the C2012C0G1H681J experiences minimal capacitance change. This inherent stability ensures that the performance of circuits relying on precise capacitance values, such as resonant circuits or filters, remains consistent over the lifespan of the industrial equipment, preventing premature failures or performance degradation due to thermal variations.
Are there any specific considerations or potential trade-offs when migrating from a different manufacturer's 0805 C0G capacitor (e.g., Murata GRM series, KEMET C0G series) to the TDK C2012C0G1H681J for a mass-produced consumer electronics product?
When migrating from another manufacturer's 0805 C0G capacitor to the TDK C2012C0G1H681J, key considerations include validating the exact capacitance value (680pF), voltage rating (50V), and physical dimensions (0805 package). While all C0G capacitors offer good temperature stability, minor variations in dielectric formulation or electrode materials between manufacturers can lead to subtle differences in Equivalent Series Resistance (ESR), dielectric loss, and self-resonant frequency. It is prudent to perform validation testing on a pilot run to ensure that the TDK C2012C0G1H681J meets all performance and reliability specifications for the specific application and that there are no unexpected interactions with the PCB or other components. The TDK C2012C0G1H681J is known for its robust construction and consistent quality, making it a strong candidate for such migrations, provided thorough qualification is performed.
For applications requiring a bypass capacitor near a microcontroller's power pins, what are the limitations of using the TDK C2012C0G1H681J with its 680pF capacitance and 50V rating if the microcontroller operates at 3.3V but has transient voltage spikes that could exceed this?
While the TDK C2012C0G1H681J's 680pF capacitance is generally suitable for high-frequency decoupling, its 50V rating provides ample headroom for a 3.3V system under normal operation. However, if transient voltage spikes on the microcontroller's power pins consistently exceed 50V, the C2012C0G1H681J would be at risk of breakdown. In such scenarios, a capacitor with a higher voltage rating, such as 100V or more, would be necessary to ensure reliability. Additionally, the relatively low capacitance value of 680pF might be insufficient for effective bypassing of lower frequency noise components, and a combination of capacitors with different values might be required for comprehensive power supply filtering.
What are the implications of the 0.70mm maximum thickness of the TDK C2012C0G1H681J when integrating it into a very thin portable device with tight vertical space constraints, and are there alternative MLCC options with similar electrical properties but reduced thickness?
The 0.70mm maximum thickness of the TDK C2012C0G1H681J is a standard dimension for an 0805 (2012 metric) package. For very thin portable devices with extremely tight vertical space constraints, this thickness might be problematic. While TDK offers other MLCC series, finding a direct C0G replacement with significantly reduced thickness in the 0805 package while maintaining the same capacitance and voltage rating can be challenging. Engineers may need to consider alternative capacitor packages (e.g., smaller case sizes like 0603 if suitable for the capacitance and voltage) or explore specialized low-profile MLCCs from TDK or other manufacturers, which may come with trade-offs in terms of capacitance density, voltage rating, or dielectric type. A thorough review of TDK's product portfolio or consultation with their application engineers would be recommended for such specific integration challenges.

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