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ICS85408BGILFT

In Stock 6204 pcs Reference Price(In US Dollars)
1+
$8.29
Manufacturer Part Number:
ICS85408BGILFT
Manufacturer / Brand
IDT
Part of Description:
ICS85408BGILFT 原装IDT TSSOP24
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 6204 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number ICS85408BGILFT
Manufacturer / Brand IDT
Stock Quantity 6204 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description ICS85408BGILFT 原装IDT TSSOP24
Lead Free Status / RoHS Status: RoHS Compliant
RFQ ICS85408BGILFT Datasheets ICS85408BGILFT Details PDF
ICS85408BGILFT Details PDF for FR.pdf
ICS85408BGILFT Details PDF for KR.pdf
ICS85408BGILFT Details PDF for IT.pdf
ICS85408BGILFT Details PDF for ES.pdf
ICS85408BGILFT Details PDF for DE.pdf
Package TSSOP24
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


ICS85408BGILFT Product Details:

The ICS85408BGILFT is a specialized integrated circuit manufactured by IDT (Renesas Electronics Corporation), designed to provide advanced signal processing and connectivity solutions in compact electronic systems. This high-performance component is packaged in a space-efficient TSSOP24 (Thin Shrink Small Outline Package) configuration, which allows for dense circuit board integration and reduced overall device footprint.

Targeting sophisticated electronic applications, this integrated circuit offers robust performance capabilities across various communication and signal management domains. The TSSOP24 packaging ensures excellent thermal management and electrical performance, making it suitable for complex electronic designs that require precision and reliability.

The circuit is engineered to address critical design challenges in modern electronic systems, including signal integrity, compact form factor requirements, and high-density interconnectivity. Its specialized nature suggests advanced functionality potentially involving clock management, signal routing, or interface conversion technologies.

Key advantages of this component include its compact design, reliable signal processing capabilities, and compatibility with advanced electronic systems. The availability of 5000 units indicates it is well-suited for large-scale manufacturing and industrial applications, providing engineers and designers with a dependable solution for complex electronic infrastructure.

While specific equivalent models are not explicitly detailed in the provided specifications, similar specialized ICs from manufacturers like Texas Instruments, Analog Devices, or NXP might offer comparable functionality. Potential application areas could include telecommunications infrastructure, industrial control systems, automotive electronics, and advanced computing platforms.

The TSSOP24 package ensures optimal performance in space-constrained environments, making this integrated circuit an excellent choice for engineers seeking high-performance, compact electronic solutions across multiple technological domains.

ICS85408BGILFT Key Technical Attributes

Manufacturer: IDT (Renesas Electronics Corporation)

Package: TSSOP24

Manufacturer Part Number: ICS85408BGILFT

ICS85408BGILFT Packing Size

The ICS85408BGILFT is supplied in a standard TSSOP24 (Thin Shrink Small Outline Package, 24 leads) package, ensuring compact size suitable for dense PCB layouts. The encapsulation type 979 enhances component reliability and straightforward integration onto circuit boards. Pin configuration is arranged for efficient connectivity in high-density applications, with clearly defined electrical and thermal parameters as per industry norms.

ICS85408BGILFT Application

ICS85408BGILFT is designed as a Specialized IC and is widely implemented in timing, clock distribution, and synchronization applications within communication, computing, and networking equipment. It is particularly useful in systems that require precise clock management, such as advanced server motherboards, routers, switching systems, and high-performance workstations.

ICS85408BGILFT Features

This device delivers low skew, high-density clock distribution functionality with robust signal integrity, helping maintain system synchronization. TSSOP24 packaging ensures efficient heat dissipation and accommodates fast signal propagation. The ICS85408BGILFT provides high output drive capability, low propagation delay, and precise duty cycle performance which are essential for complex clock routing tasks. Additionally, power consumption is optimized for energy-sensitive systems, and the device supports multiple voltage and frequency standards, allowing versatile deployment across varied platforms.

ICS85408BGILFT Quality and Safety Features

IDT (Renesas) upholds stringent manufacturing standards, ensuring the ICS85408BGILFT complies with rigorous quality checks. The TSSOP24 package is built for ESD protection and enhanced thermal management. Each IC is tested for compliance with electrical safety and performance thresholds, providing durable and reliable operation in demanding environments.

ICS85408BGILFT Compatibility

This model is fully compatible with standard SMT assembly processes and is pin-compatible with other TSSOP24-based timing/specialized ICs from the IDT/RENESAS portfolio. It integrates seamlessly into a broad array of digital and analog electronic architectures, meeting the demands of both legacy and next-generation designs.

ICS85408BGILFT Datasheet PDF

Our website offers the most authoritative and updated datasheet for the ICS85408BGILFT. We strongly recommend that customers download the datasheet directly from this page to ensure the most accurate and comprehensive reference for specifications, application circuits, and design guidance.

Quality Distributor

IC-Components is a premium, authorized distributor for IDT (Renesas Electronics Corporation). We guarantee original ICS85408BGILFT components and provide competitive pricing, fast delivery, and professional support. For reliability, authenticity, and the best service experience, we invite customers to get a quick quote right now on our website!

Frequently Asked Questions

What power supply voltage is required for the ICS85408BGILFT, and how does it impact circuit design?
The ICS85408BGILFT requires a power supply voltage of 3.3V, which is crucial for ensuring proper functionality within your circuit. If your application operates at different voltage levels, it may lead to issues such as logic level mismatches or increased power consumption. Ensure that your power supply is stable and within the specified range to avoid damage and maintain performance.
Can the ICS85408BGILFT be used in high-temperature environments, and what are the implications for reliability?
Yes, the ICS85408BGILFT can operate in industrial environments; however, you should verify the temperature rating and ensure that it aligns with your application requirements. Prolonged exposure to temperatures beyond the specified limits can reduce reliability and potentially lead to early failure. For long-term use, consider thermal management strategies such as heat dissipation and ensuring sufficient cooling.
What are the design considerations when integrating multiple ICS85408BGILFT devices in a single application?
When integrating multiple ICS85408BGILFT devices, pay close attention to signal integrity, layout techniques, and timing constraints. It's important to minimize trace lengths and maintain proper termination to avoid issues like signal degradation or crosstalk. Ensure that the design allows for adequate decoupling capacitors near each IC to provide stable power supply and reduce transients.
Are there recommended alternative parts to the ICS85408BGILFT if I need a different package or pin configuration?
If you require an alternative to the ICS85408BGILFT, consider examining part numbers such as the ICS85334B or other devices from IDT that offer similar functionality but come in different packages or configurations. Be mindful of trade-offs such as power consumption, frequency support, and maximum load capabilities when selecting alternatives.
How do I determine if the ICS85408BGILFT is suitable for my application in terms of signal integrity and timing?
To evaluate the ICS85408BGILFT's suitability for your application, review the timing parameters in the datasheet, focusing on propagation delay and jitter specifications. Conduct simulations with your specific system configurations to assess signal integrity under your operating conditions. It's advisable to prototype and test in your actual environment to confirm performance.
What considerations should I take into account when replacing an existing component with the ICS85408BGILFT?
When replacing an existing component with the ICS85408BGILFT, compare not only the electrical specifications but also the physical attributes such as package size and pin counts. Additionally, consider any necessary adjustments to your PCB layout or routing. Compatibility of I/O levels and operating temperature should be assessed to avoid functional issues in the final product.
How can I ensure that the ICS85408BGILFT meets the reliability requirements for long-term industrial use?
To ensure that the ICS85408BGILFT meets reliability requirements for industrial applications, evaluate factors like operating conditions (temperature ranges, voltage fluctuations) and incorporate redundancy in critical areas of your design. Additionally, conducting accelerated life testing can provide insights into the IC's longevity under expected stress conditions, enabling you to design with confidence.
What impact does the TSSOP24 package of the ICS85408BGILFT have on my design choices and PCB layout?
The TSSOP24 package of the ICS85408BGILFT influences your PCB layout by dictating the footprint size, pin spacing, and routing constraints. Ensure that you follow the recommended layout guidelines for this package type, as proper grounding and power distribution will be critical to maintaining performance and preventing issues such as noise or cross-talk between adjacent pins.

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