The DS90CR287SLCX is a specialized integrated circuit designed by National Semiconductor (NSC), representing a high-performance solution in the digital signal processing and communication infrastructure domain. This BGA (Ball Grid Array) packaged device is engineered to address complex signal transmission and routing challenges in advanced electronic systems.
As a sophisticated integrated circuit, the component offers advanced signal conditioning and transmission capabilities, making it particularly suitable for high-speed data communication applications, telecommunications infrastructure, and advanced networking equipment. The BGA packaging ensures optimal signal integrity, thermal performance, and compact form factor, which is critical for modern, densely packed electronic designs.
The circuit's specialized nature suggests it likely provides critical signal management, potentially supporting high-bandwidth data streams, clock synchronization, or signal conditioning functions. Its 867-type encapsulation indicates a robust design targeting professional and industrial-grade electronic systems that demand reliability and precision.
While specific performance parameters are not fully detailed, the substantial quantity (1800 units) implies this is a component used in production-scale electronic manufacturing, likely for networking, telecommunications, or specialized communication equipment. The Ball Grid Array packaging indicates it is designed for surface-mount technology, enabling efficient, high-density PCB integration.
Equivalent or alternative models might include similar signal management ICs from manufacturers like Texas Instruments, Analog Devices, or Maxim Integrated, though direct comparisons would require detailed technical specification matching. The product represents a niche but essential component in advanced electronic system design, offering specialized signal processing capabilities within a compact, reliable packaging format.
DS90CR287SLCX Key Technical Attributes
Manufacturer Part Number: DS90CR287SLCX
Package Type: BGA, 867 Pins
DS90CR287SLCX Packing Size
The DS90CR287SLCX is offered in a Ball Grid Array (BGA) package, featuring 867 pins for high-density interconnection. The BGA type ensures reliable electrical and thermal contact, suitable for advanced integrated circuit applications. This high pin-count configuration supports dense signal routing, crucial for complex systems requiring robust data integrity. The device is designed for optimal heat dissipation, enhancing performance stability under continuous operation.
DS90CR287SLCX Application
The DS90CR287SLCX from NSC is a specialized integrated circuit commonly used in high-speed data transmission systems, such as LCD controllers, digital video interfaces, and advanced graphical processing units. It is ideal for applications that demand reliable high-bandwidth data transfer with minimal signal degradation, making it suitable for industrial, commercial, and consumer electronics.
DS90CR287SLCX Features
This product stands out for its advanced LVDS (Low Voltage Differential Signaling) interface capability, enabling efficient high-speed data communication with low electromagnetic interference and reduced power consumption. The integrated circuit is engineered to support multiplexed channel configurations, allowing for flexible adaptation in various system architectures. Its robust signal integrity and low-jitter performance are vital for systems that require accurate and synchronized data flow. The BGA encapsulation offers superior mechanical stability and allows for efficient board space utilization, crucial in compact device designs. Additionally, the construction facilitates automated assembly processes and provides enhanced resistance against thermal cycling and mechanical stress.
DS90CR287SLCX Quality and Safety Features
The DS90CR287SLCX complies with stringent quality control measures throughout the manufacturing process. This device achieves a high standard of reliability under wide operating conditions and features built-in safeguards against electrostatic discharge and voltage spikes. Its BGA form factor enhances the long-term reliability of board-level interconnections by minimizing the risk of solder joint failures, which is a frequent issue in more traditional packaging approaches. These features collectively support the consistent and safe performance of the device in mission-critical applications.
DS90CR287SLCX Compatibility
The DS90CR287SLCX exhibits excellent compatibility with a wide range of industrial standard signal processing and control units. Its multipurpose configuration ensures straightforward integration with LCD display drivers, embedded controllers, and advanced communication system architectures requiring LVDS data transmission. The BGA pin mapping is engineered for seamless connection to high-performance circuit boards, reducing the need for complex adaptation circuitry.
DS90CR287SLCX Datasheet PDF
Our website provides the most authoritative and comprehensive datasheet for the DS90CR287SLCX. Customers are strongly encouraged to download the official PDF datasheet on this page to access detailed technical specifications, recommended operating parameters, and design guidelines. Having the latest datasheet ensures accurate integration and maximizes the device’s performance in your application.
Quality Distributor
IC-Components is proud to be a premium distributor of NSC products, including the DS90CR287SLCX. We guarantee product authenticity and competitive pricing, backed by industry-leading customer service and supply chain reliability. For the best purchase experience and immediate access to quotations, we strongly recommend requesting a quote directly through our website. Partner with IC-Components for trusted sourcing and professional support on all your component needs.
