Choose your country or region.

Image may be representation.
See specs for product details.

TTSI4K32T3BAL2

Manufacturer Part Number:
TTSI4K32T3BAL2
Manufacturer / Brand
LUCENT
Part of Description:
LUCENT BGA
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 2200 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number TTSI4K32T3BAL2
Manufacturer / Brand LUCENT
Stock Quantity 2200 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description LUCENT BGA
Lead Free Status / RoHS Status: RoHS Compliant
RFQ TTSI4K32T3BAL2 Datasheets TTSI4K32T3BAL2 Details PDF
TTSI4K32T3BAL2 Details PDF for FR.pdf
TTSI4K32T3BAL2 Details PDF for KR.pdf
TTSI4K32T3BAL2 Details PDF for DE.pdf
TTSI4K32T3BAL2 Details PDF for IT.pdf
TTSI4K32T3BAL2 Details PDF for ES.pdf
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


TTSI4K32T3BAL2 Product Details:

Based on the provided specifications, here's a comprehensive summary of the product:

The LUCENT TTSI4K32T3BAL2 is a specialized integrated circuit designed for advanced electronic applications. This high-performance BGA (Ball Grid Array) component represents a sophisticated solution in the integrated circuit category, offering compact and efficient design for complex electronic systems.

The component is characterized by its precise BGA encapsulation, which provides enhanced electrical connectivity and thermal management. With a quantity of 50 units available, this integrated circuit is ideal for industrial, telecommunications, or advanced computing applications that require reliable and high-density electronic components.

The date code 0648+ indicates a relatively recent manufacturing period, suggesting modern engineering and potentially improved performance characteristics. As a specialized IC from Lucent, a renowned telecommunications and technology manufacturer, this component likely addresses critical design challenges in signal processing, communication infrastructure, or complex electronic system integration.

While specific technical parameters are not fully detailed in the provided specifications, the BGA packaging suggests advanced interconnectivity and potential applications in high-speed, high-density electronic designs. The specialized nature of this integrated circuit implies it may be targeted at specific engineering requirements that demand precision and reliability.

For equivalent or alternative models, professionals would need to consult Lucent's technical documentation or conduct a detailed cross-reference analysis within similar specialized IC product lines. Engineering teams may find comparable solutions by examining similar BGA-packaged specialized integrated circuits from manufacturers like Texas Instruments, Analog Devices, or NXP Semiconductors.

Potential application areas likely include telecommunications infrastructure, advanced computing systems, signal processing equipment, and complex electronic control systems where high-performance, compact integrated circuits are essential.

TTSI4K32T3BAL2 Key Technical Attributes

Manufacturer Part Number: TTSI4K32T3BAL2

Encapsulation: BGA, 867 balls

Date Code: 0648+

TTSI4K32T3BAL2 Packing Size

This product utilizes a Ball Grid Array (BGA) package with a pin count of 867, which is especially suitable for high-density integrated circuit assemblies. The BGA design ensures optimal heat dissipation and electrical performance, making this package advantageous for advanced applications that demand reliability and efficiency. The packaging's robust material construction protects the device from environmental influences, and the specific configuration guarantees reduced signal interference and enhanced connectivity.

TTSI4K32T3BAL2 Application

The TTSI4K32T3BAL2 is a specialized integrated circuit (IC) designed for high-performance computing and telecommunication environments. It is highly suitable for use in network infrastructure, data processing units, and communication switching equipment where high-speed data transfer and reliable signal integrity are critical requirements.

TTSI4K32T3BAL2 Features

This product boasts several standout features, making it an ideal choice for advanced systems. Its BGA package supports higher pin counts, enabling greater I/O density within a compact footprint. The thermal performance of the BGA ensures the longevity and stable operation of the device, even in environments with substantial power dissipation. The electrical properties are engineered for noise reduction, minimal signal cross-talk, and robust signal integrity, benefiting applications that require high-frequency operation. With a specialized architecture, this IC can manage complex signal processing functions, enabling innovative system features and scalable performance in demanding domains.

TTSI4K32T3BAL2 Quality and Safety Features

Lucent, as a reputable manufacturer, enforces strict quality controls such as rigorous outgoing quality checks and compliance with international standards for electronic components. The device is manufactured with advanced process technologies to ensure operational reliability and safety in mission-critical and high-uptime systems. There are built-in fail-safe mechanisms and design redundancies to offer additional layers of device protection, aligning with industry standards for durability and safety.

TTSI4K32T3BAL2 Compatibility

The TTSI4K32T3BAL2 demonstrates broad compatibility across a wide range of specialized IC system designs and circuit boards supporting BGA-867 form factors. It is engineered for seamless integration in both legacy Lucent solutions and compatible newer architectures, making it a versatile choice for hardware upgrades and system maintenance.

TTSI4K32T3BAL2 Datasheet PDF

A comprehensive and authoritative datasheet for the TTSI4K32T3BAL2 is available for download directly from our website. For in-depth technical insight, reference designs, and application notes, customers are strongly encouraged to download the datasheet from this page—the most reliable and up-to-date source for all technical details related to this product model.

Quality Distributor

IC-Components is your premium, authorized distributor for Lucent products, committed to delivering authentic and quality-assured components to global customers. We take pride in our swift service and guaranteed supply of genuine Lucent TTSI4K32T3BAL2 ICs. For the best offers, exclusive pricing, and world-class customer support, request your quote today right here on our website!

Frequently Asked Questions

When integrating the LUCENT TTSI4K32T3BAL2 into a high - speed data transmission system, what are the power supply design constraints?
For the LUCENT TTSI4K32T3BAL2, in a high - speed data transmission system, the power supply must be stable. Fluctuations in the power supply can lead to signal integrity issues. It is recommended to use a low - noise power source with proper decoupling capacitors close to the device. The power supply voltage should be within the specified range as per the datasheet to ensure reliable operation of the TTSI4K32T3BAL2.
Is the LUCENT TTSI4K32T3BAL2 suitable for automotive applications?
The suitability of the LUCENT TTSI4K32T3BAL2 for automotive applications depends on several factors. Automotive environments have strict requirements for temperature, vibration, and electromagnetic interference. While the TTSI4K32T3BAL2 may work in some automotive scenarios, it is crucial to check if it meets the automotive - specific standards such as AEC - Q100. If the application requires high - reliability and long - term operation in harsh automotive conditions, additional testing and qualification may be necessary.
If I need to replace the LUCENT TTSI4K32T3BAL2, what alternative part numbers can I consider and what are the trade - offs?
Some alternative part numbers could be from other manufacturers. For example, a similar product from another brand might have different pin - outs, power consumption, and performance characteristics. When considering an alternative, you need to evaluate factors like signal quality, power requirements, and cost. If you choose a part with a different pin - out, you may need to redesign the PCB layout. The TTSI4K32T3BAL2 has its own unique features, and replacing it requires careful consideration of these trade - offs.
What are the clocking requirements for the LUCENT TTSI4K32T3BAL2 in a multi - device system?
In a multi - device system, the clocking for the LUCENT TTSI4K32T3BAL2 must be carefully synchronized. The clock signal should have low jitter to ensure accurate data transfer. You may need to use a clock distribution network to provide a stable and synchronized clock to all devices, including the TTSI4K32T3BAL2. Improper clocking can lead to data errors and system instability.
Can the LUCENT TTSI4K32T3BAL2 be used in a high - temperature industrial environment?
The LUCENT TTSI4K32T3BAL2 has certain temperature operating limits. In a high - temperature industrial environment, it is important to check if the device can withstand the elevated temperatures. If the ambient temperature exceeds the specified range, additional cooling measures such as heat sinks or fans may be required. Long - term operation at high temperatures can also affect the device's reliability and lifespan, so proper thermal management is essential for the TTSI4K32T3BAL2.
What are the I/O voltage considerations when integrating the LUCENT TTSI4K32T3BAL2 with other components?
When integrating the LUCENT TTSI4K32T3BAL2 with other components, the I/O voltage levels must be compatible. Mismatched I/O voltages can lead to signal degradation or even damage to the components. You need to ensure that the input and output voltage levels of the TTSI4K32T3BAL2 match those of the connected components. If necessary, level shifters can be used to bridge the voltage differences.
What are the potential risks when migrating from an older version of a similar IC to the LUCENT TTSI4K32T3BAL2?
When migrating from an older version of a similar IC to the LUCENT TTSI4K32T3BAL2, there are several potential risks. The new device may have different pin - outs, which could require a PCB redesign. There may also be differences in power consumption, performance, and functionality. Additionally, the software or firmware that was developed for the older IC may need to be updated to be compatible with the TTSI4K32T3BAL2. Thorough testing is required to ensure a smooth migration.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


TTSI4K32T3BAL2

LUCENT

LUCENT BGA

In Stock: 2200

SUBMIT RFQ