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ADSP-BF533SBB500

In Stock 1261 pcs Reference Price(In US Dollars)
1+
$23.5389
Manufacturer Part Number:
ADSP-BF533SBB500
Manufacturer / Brand
Analog Devices Inc.
Part of Description:
IC DSP CTLR 16BIT 500MHZ 169-BGA
Datasheets:
ADSP-BF533SBB500(1).pdfADSP-BF533SBB500(2).pdfADSP-BF533SBB500(3).pdfADSP-BF533SBB500(4).pdf
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 1261 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number ADSP-BF533SBB500
Manufacturer / Brand Analog Devices Inc.
Stock Quantity 1261 pcs Stock
Category Integrated Circuits (ICs) > Embedded - DSP (Digital Signal Processors)
Description IC DSP CTLR 16BIT 500MHZ 169-BGA
Lead Free Status / RoHS Status: RoHS Compliant
RFQ ADSP-BF533SBB500 Datasheets ADSP-BF533SBB500 Details PDF
ADSP-BF533SBB500 Details PDF for FR.pdf
ADSP-BF533SBB500 Details PDF for KR.pdf
ADSP-BF533SBB500 Details PDF for ES.pdf
ADSP-BF533SBB500 Details PDF for DE.pdf
ADSP-BF533SBB500 Details PDF for IT.pdf
Voltage - I/O 3.30V
Voltage - Core 1.20V
Type Fixed Point
Supplier Device Package 169-PBGA (19x19)
Series Blackfin®
Package / Case 169-BBGA
Package Tray
Operating Temperature -40°C ~ 85°C
On-Chip RAM 148kB
Non-Volatile Memory ROM (1kB)
Mounting Type Surface Mount
Interface SPI, SSP, UART
Clock Rate 500MHz
Base Product Number ADSP-BF533

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

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Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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ADSP-BF533SBB500 Product Details:

The ADSP-BF533SBB500 is a high-performance 16-bit digital signal processor (DSP) controller manufactured by Analog Devices Inc. (ADI), belonging to the renowned Blackfin series of embedded DSP integrated circuits. This sophisticated processor operates at an impressive 500MHz clock rate, making it exceptionally well-suited for demanding real-time signal processing applications that require rapid computational capabilities and precise digital signal manipulation.

Functionally, this DSP controller excels in executing complex mathematical operations, filtering algorithms, and signal transformation tasks with remarkable efficiency. The device incorporates a fixed-point arithmetic architecture optimized for digital signal processing workloads, enabling developers to implement sophisticated audio, video, communications, and control algorithms. The processor features comprehensive on-chip memory resources including 148kB of RAM for program and data storage, complemented by 1kB of non-volatile ROM for boot code and critical system functions.

The design addresses several critical challenges in embedded DSP applications, particularly the need for high computational throughput while maintaining power efficiency and compact form factor requirements. The 169-PBGA (19x19mm) package format represents an optimal balance between pin count, thermal management, and board space utilization, making it suitable for space-constrained applications without compromising connectivity options. The surface mount configuration facilitates automated assembly processes and enables dense PCB layouts essential for modern embedded systems.

Key technical specifications include dual voltage operation with 3.30V I/O voltage and 1.20V core voltage, providing flexibility in system integration while optimizing power consumption. The processor operates reliably across an extended temperature range from -40°C to 85°C, ensuring robust performance in harsh industrial and automotive environments. Multiple communication interfaces including SPI, SSP, and UART provide versatile connectivity options for peripheral devices, sensors, and communication modules.

The primary advantages of this DSP controller include exceptional processing power for real-time applications, comprehensive peripheral integration reducing external component requirements, and proven reliability backed by ADI's extensive experience in signal processing solutions. The Blackfin architecture offers excellent code efficiency and development tool support, accelerating time-to-market for complex embedded applications.

Compatibility extends across various development environments and toolchains, with comprehensive software support including optimized libraries, real-time operating systems, and debugging tools. The standard interface protocols ensure seamless integration with common peripheral devices and communication networks.

Primary application areas encompass audio processing systems, digital communications equipment, industrial automation controllers, medical instrumentation, automotive infotainment systems, and military/aerospace applications requiring high-performance signal processing capabilities. The processor excels in applications demanding real-time response, such as active noise cancellation, software-defined radio, motor control systems, and advanced driver assistance systems.

Equivalent and alternative models within the ADSP-BF533 family include variants with different clock speeds and package options, such as the ADSP-BF533SBBZ400 (400MHz version) and ADSP-BF533SBBZ600 (600MHz version). Alternative Blackfin processors offering similar functionality include the ADSP-BF531 (lower performance variant) and ADSP-BF537 (enhanced connectivity version with Ethernet MAC). Competitive alternatives from other manufacturers include Texas Instruments' TMS320C55x series, Freescale's DSP56800 family, and certain ARM Cortex-M4 processors with DSP extensions, though each offers different architectural advantages and trade-offs in terms of performance, power consumption, and development ecosystem support.

ADSP-BF533SBB500 Key Technical Attributes

Manufacturer Part Number: ADSP-BF533SBB500

Main Category: Integrated Circuits (ICs)

Type: Embedded - DSP (Digital Signal Processors)

ADSP-BF533SBB500 Packing Size

The ADSP-BF533SBB500 is housed in a 169-PBGA (Plastic Ball Grid Array) package, with dimensions of 19x19 mm, offering a compact profile suitable for high-density circuit board designs. This surface-mount component is delivered in tray packaging for secure handling during manufacturing processes, and provides reliable electrical contact with its precise ball array configuration. The thermal properties are engineered to support robust operation over a wide industrial temperature range from -40°C to 85°C, and the electrical characteristics include 3.30V I/O and a 1.20V core voltage supply for power efficiency and compatibility with various system designs.

ADSP-BF533SBB500 Application

This device excels as a Digital Signal Processor (DSP) in embedded applications, particularly in audio, communication, industrial control, video processing, and high-speed data acquisition systems. Its powerful 500MHz fixed-point processing engine makes it ideal for advanced signal processing algorithms, real-time operations, and applications demanding high throughput in compact, power-sensitive environments.

ADSP-BF533SBB500 Features

The ADSP-BF533SBB500 is part of the acclaimed Blackfin series from Analog Devices and offers advanced DSP capabilities, combining a 16-bit fixed-point core running at 500MHz with 148kB of high-speed on-chip RAM to manage intensive signal processing tasks. A built-in ROM (1kB) provides additional flexibility for boot or configuration data. It incorporates versatile interface options such as SPI, SSP, and UART, enabling seamless communication and system integration. The 169-PBGA (19x19) package ensures both mechanical stability and optimal thermal performance, supporting reliable operation across wide temperature ranges. Furthermore, the chip supports low operating voltages with 3.30V for I/O and 1.20V for the core, minimizing power consumption. With robust peripheral support and high-speed data handling, it is tailored for applications requiring fast signal processing, real-time computation, and low latency.

ADSP-BF533SBB500 Quality and Safety Features

The ADSP-BF533SBB500 adheres to strict industrial quality standards, ensuring high reliability and safe operation even in demanding thermal and electrical environments. As a surface-mount DSP, it features sturdy package construction and precise ball grid configuration to prevent contact issues and thermal runaway, supporting extended operational life and consistent performance in mission-critical applications.

ADSP-BF533SBB500 Compatibility

This component is fully compatible with reference designs and software development tools supporting the Blackfin series, streamlining integration into existing and new platforms. Its support for industry-standard SPI, SSP, and UART interfaces ensures broad applicability across a range of control, communications, and industrial automation systems.

ADSP-BF533SBB500 Datasheet PDF

Our website offers the most comprehensive and authoritative datasheet for the ADSP-BF533SBB500. We strongly recommend downloading the datasheet directly from this page to access the latest, manufacturer-verified technical specifications, design guidelines, electrical characteristics, and application insights, ensuring your project's success.

Quality Distributor

IC-Components is a premier distributor of Analog Devices components. With our extensive inventory, competitive pricing, and verified sourcing, we guarantee authentic and high-quality ADSP-BF533SBB500 units. For immediate quotes and expert support, visit our website now to take advantage of our exclusive distributor benefits and fulfill your project needs with confidence!

Frequently Asked Questions

What are the key considerations when integrating the ADSP-BF533SBB500 into a high-speed digital signal processing system?
When integrating the ADSP-BF533SBB500, ensure your power supply can provide stable 1.20V for the core and 3.3V for I/O, properly design the decoupling capacitors to handle 500MHz operation, and verify that your system clock source can reliably deliver up to 500MHz. Pay attention to the PCB layout to minimize signal integrity issues due to high-frequency signals. Confirm that the memory and peripherals are compatible with the on-chip ROM and RAM, and ensure proper thermal management within the -40°C to 85°C operating range.
How do I choose between SPI, SSP, and UART interfaces on the ADSP-BF533SBB500 for my application?
Choose the SPI, SSP, or UART interface based on your communication needs. SPI and SSP are suitable for high-speed, full-duplex data transfer with other digital devices, making them ideal for real-time data streaming. UART is better suited for serial console communication or lower-speed data exchange. Verify that your external devices support the chosen interface and configure the pins accordingly. Consider impedance matching and signal integrity for high-speed SPI or SSP connections.
Can the ADSP-BF533SBB500 reliably operate in industrial environments with temperatures up to 85°C?
Yes, the ADSP-BF533SBB500 is rated to operate from -40°C to 85°C, making it suitable for industrial applications. Ensure your PCB design uses high-quality, temperature-rated components, and implement appropriate thermal management measures like heatsinks or airflow. Test the system under actual operating conditions to validate long-term reliability and consider margin in your power supply design to accommodate temperature variations.
What are the design considerations for replacing a different Blackfin DSP with the ADSP-BF533SBB500?
When replacing an existing Blackfin DSP with the ADSP-BF533SBB500, check compatibility of pinout and interface signals. Evaluate differences in processing power (clock rate up to 500MHz), internal memory sizes, and peripherals. Consider the impact on existing firmware, as the instruction set and timing may vary slightly. Review the electrical specifications, especially I/O voltage levels (3.3V), and ensure that your PCB layout can support the 169-BGA package with proper thermal and signal integrity.
Is the 1kB ROM sufficient for booting and firmware storage in embedded applications?
The 1kB ROM on the ADSP-BF533SBB500 is mainly intended for small boot routines or configuration data. For more extensive firmware or application code, use external memory interfaces or load code into on-chip RAM during startup. Consider whether your application requires updates or larger firmware size; if so, integrate external non-volatile memory (e.g., Flash) to supplement the internal ROM.
What are the best practices for ensuring reliable operation when powering the ADSP-BF533SBB500 with a 1.20V core supply and 3.3V I/O?
Use low-noise, well-filtered power supplies with proper decoupling capacitors placed close to the VDD pins. Employ separate power domains for core and I/O and include bulk and high-frequency decoupling capacitors. Implement voltage regulators with tight regulation and proper layout techniques to minimize voltage fluctuations. Use proper grounding schemes and consider adding power filtering components if operating in noisy environments.
How does the 500MHz clock rate impact PCB layout and signal integrity design considerations?
At 500MHz, signal integrity becomes critical. Shorten trace lengths for high-speed signals, maintain controlled impedance, and use differential signaling where applicable. Implement proper termination and matching techniques to reduce reflections. Use ground planes and solid reference planes to minimize EMI and crosstalk. Carefully route clock and high-frequency signals to prevent skew and jitter, ensuring timing integrity for reliable processing.
Are there any specific reliability or long-term operational concerns when using the ADSP-BF533SBB500 in continuous-operation environments?
The ADSP-BF533SBB500 is rated for industrial temperature ranges, but long-term reliability depends on proper thermal management, stable power supplies, and avoiding electrical overstress. Regularly monitor operating temperatures, ensure adequate cooling, and use quality PCB materials. Verify that all supply voltages remain within specified limits during startup and operation. Plan for periodic system testing and firmware updates to address potential reliability issues over the product lifecycle.
What are the main differences and trade-offs between the ADSP-BF533SBB500 and other Blackfin series DSPs for similar embedded applications?
The ADSP-BF533SBB500 offers a high clock rate of 500MHz, integrated 148kB RAM, and specific I/O interfaces (SPI, SSP, UART), suited for high-performance tasks. Other Blackfin DSPs may differ in processing power, memory size, or peripheral availability, leading to trade-offs in cost, power consumption, and complexity. Choose the model that balances your application's real-time processing needs, peripheral requirements, and thermal constraints. Also, consider software and ecosystem support for migration compatibility.
Can I design a future-proof system using the ADSP-BF533SBB500, considering possible updates or scalability?
Yes, the ADSP-BF533SBB500 provides sufficient processing power and flexible interfaces for many advanced embedded applications. For future scalability, consider using external memory and peripherals to expand system capabilities. Keep in mind the supported voltage levels and package size for integration into larger systems. Also, evaluate development tools, firmware, and software support to ensure long-term maintainability and upgrade paths.

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