Choose your country or region.

Image may be representation.
See specs for product details.

S29AL016D90TFI01

In Stock 3418 pcs Reference Price(In US Dollars)
1+
$0.942
Manufacturer Part Number:
S29AL016D90TFI01
Manufacturer / Brand
SPANSION
Part of Description:
S29AL016D90TFI01 SPANSION TSOP48
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 3418 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number S29AL016D90TFI01
Manufacturer / Brand SPANSION
Stock Quantity 3418 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description S29AL016D90TFI01 SPANSION TSOP48
Lead Free Status / RoHS Status: RoHS Compliant
RFQ S29AL016D90TFI01 Datasheets S29AL016D90TFI01 Details PDF
S29AL016D90TFI01 Details PDF for FR.pdf
S29AL016D90TFI01 Details PDF for KR.pdf
S29AL016D90TFI01 Details PDF for IT.pdf
S29AL016D90TFI01 Details PDF for ES.pdf
S29AL016D90TFI01 Details PDF for DE.pdf
Package TSOP48
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


S29AL016D90TFI01 Product Details:

The S29AL016D90TFI01 is a specialized integrated circuit manufactured by Spansion (now part of Cypress Semiconductor) designed for advanced memory storage and data management applications. This high-performance flash memory device is packaged in a TSOP48 (Thin Small Outline Package) configuration, offering robust and compact storage solutions for various electronic systems.

The circuit is engineered to provide reliable and efficient data storage with a sophisticated design that addresses critical challenges in memory technology, such as high-density data retention, low power consumption, and rapid read/write capabilities. Its specialized nature makes it particularly suitable for embedded systems, telecommunications equipment, industrial control systems, and automotive electronics where dependable memory performance is crucial.

Key advantages of this memory component include its advanced architecture that supports high-speed data operations, enhanced durability, and compatibility with a wide range of electronic platforms. The TSOP48 package ensures compact integration and efficient thermal management, making it an ideal choice for space-constrained electronic designs.

While specific performance parameters are not fully detailed in the provided specifications, the large quantity (5000 units) suggests this is likely a standard production component intended for substantial manufacturing or deployment requirements. Potential equivalent or alternative models might include similar flash memory solutions from manufacturers like Micron, Samsung, or other Spansion product lines with comparable TSOP48 packaging and memory specifications.

Professionals in electronics design, embedded systems engineering, and telecommunications will find this integrated circuit particularly valuable for applications requiring reliable, high-density memory storage in compact form factors.

S29AL016D90TFI01 Key Technical Attributes

Manufacturer Part Number S29AL016D90TFI01

Package Type TSOP48

S29AL016D90TFI01 Packing Size

The S29AL016D90TFI01 is housed in a TSOP48 (Thin Small Outline Package with 48 pins), offering a compact and space-efficient design perfect for high-density mounting on printed circuit boards (PCBs). The encapsulation type 1131 ensures robust chip protection and promotes stable operation under rigorous environmental conditions. The lead configuration is optimized for automated assembly processes, streamlining integration in high-volume manufacturing. Thermal characteristics are engineered for reliable operation over extended periods, maintaining optimal electrical performance and preventing overheating. The electrical properties are finely tuned, supporting fast and consistent signal transmission and low power consumption.

S29AL016D90TFI01 Application

This device is typically employed in embedded systems, consumer electronics, network infrastructure, and industrial automation. It serves as a memory solution in applications requiring reliable non-volatile storage, including program code and critical data retention during power cycles.

S29AL016D90TFI01 Features

The S29AL016D90TFI01 features a NOR Flash memory architecture, offering high-speed read and reliable random access performance. It provides a 16 Mb (2M x 8 / 1M x 16) data storage capacity arranged for flexible interface options, supporting both 8-bit and 16-bit bus configurations. The device supports fast program and erase operations, with sector-based erase functions for efficient memory management. Advanced data integrity is achieved via embedded Error Correction Code (ECC) and protection features such as hardware- and software-controlled write protection, which safeguard vital information from unintentional programming or erasure. The TSOP48 encapsulation ensures lower lead inductance, high EMI immunity, and superior mechanical durability. The device is designed for low voltage operation, typically 2.7V to 3.6V, reducing overall system power requirements. Its robust operating temperature range and long data retention capabilities extend device utility in harsh environments.

S29AL016D90TFI01 Quality and Safety Features

The S29AL016D90TFI01 complies with strict quality standards, including RoHS and lead-free requirements, ensuring environmental safety and system reliability. Integrated protection against electrostatic discharge (ESD) and latch-up further enhances operational longevity. The device is subjected to rigorous testing protocols by the manufacturer, guaranteeing consistent performance and traceable quality assurance throughout its specified lifecycle.

S29AL016D90TFI01 Compatibility

This model is drop-in compatible with standard TSOP48 PCB footprints, making it suitable for upgrading or replacing other industry-standard parallel NOR Flash memory products. Its dual bus width support (8/16 bit) ensures flexible usage across various platforms without complicated redesigns. The device seamlessly integrates with a diverse range of microcontrollers and processors in embedded architectures.

S29AL016D90TFI01 Datasheet PDF

Our website offers the most authoritative and up-to-date datasheet for the S29AL016D90TFI01 model. We strongly recommend our customers to download the comprehensive PDF directly from this page to access detailed electrical parameters, timing diagrams, and application guidelines tailored to your technical and design requirements.

Quality Distributor

IC-Components is your premium source for genuine Spansion products, including the S29AL016D90TFI01. We guarantee authentic supply, competitive pricing, and first-class customer service. We encourage you to request a quote directly on our website and experience trusted sourcing from an industry-leading distributor.

Frequently Asked Questions

What are the power supply requirements for the S29AL016D90TFI01, and how can I ensure proper voltage levels during integration?
The S29AL016D90TFI01 requires a power supply voltage of 2.7V to 3.6V for optimal operation. It’s crucial to implement proper voltage regulation and filtering to maintain these levels, as exceeding or dropping below this range can result in data corruption or device malfunction. Additionally, consider using decoupling capacitors close to the power pins for stability during transient demand.
Can the S29AL016D90TFI01 be used in low-power applications, and what considerations should I be aware of?
Yes, the S29AL016D90TFI01 can be utilized in low-power applications, but careful attention should be given to its standby current requirements. Ensure that your design incorporates low-power modes when the chip is not in use to minimize energy consumption. Review the datasheet for specifics on power-saving configurations to optimize battery life in your application.
What are the implications of using the S29AL016D90TFI01 in high-temperature environments?
The S29AL016D90TFI01 is rated for operation between 0°C to 70°C for commercial applications. If your application exposes the IC to higher temperatures, it’s advisable to verify the thermal performance and consider additional cooling methods or choose a rated high-temperature alternative to avoid reliability issues.
How does the S29AL016D90TFI01 compare with other similar products for potential replacements, such as the Winbond W29K016 or Micron MT29F016G?
When comparing the S29AL016D90TFI01 to the Winbond W29K016 or Micron MT29F016G, consider factors such as voltage levels, page size, and programming speeds. While the S29AL016D90TFI01 may offer specific advantages in speed, the other options might have different endurance or operating temperature ratings. Assess your application's specific needs to choose the best option for seamless integration.
What are the design considerations regarding I/O voltage levels for interfacing the S29AL016D90TFI01 with different microcontrollers?
The S29AL016D90TFI01 supports I/O operations based on the supply voltage. If interfacing with microcontrollers operating at a 3.3V logic level, ensure that the I/O configuration matches to prevent any voltage mismatches. Utilizing level shifters can facilitate proper communication between components operating at differing voltage levels.
In what scenarios might the S29AL016D90TFI01 not be suitable for my project?
The S29AL016D90TFI01 may not be ideal for projects requiring extensive write/erase cycling, as it has a limited endurance rated for 100,000 cycles. For applications demanding higher endurance, consider alternate flash memory options with superior write-cycle performance, such as NAND flash devices if your design permits it.
What are the best practices for integrating the S29AL016D90TFI01 with an FPGA during design?
When integrating the S29AL016D90TFI01 with an FPGA, ensure that the I/O specifications of both devices align, particularly regarding logic levels and signal timing. Employ proper signal integrity practices, such as controlled impedance for high-speed lines, and consider using dedicated FPGA memory controllers that can effectively manage the read/write protocols.
If I am migrating from an older memory chip to the S29AL016D90TFI01, what critical factors should I verify during the transition?
Verify the pin compatibility and electrical characteristics when migrating to the S29AL016D90TFI01. Check for any differences in timing parameters like read and write latency that could affect system performance. You should also evaluate the software changes necessary for command set compatibility, ensuring a smooth transition in the firmware.
What reliability factors should be assessed when deploying the S29AL016D90TFI01 in long-term industrial applications?
For long-term industrial deployments, consider the S29AL016D90TFI01's susceptibility to environmental factors such as moisture and dust. Proper encapsulation and circuit board protective measures can enhance reliability. Additionally, evaluate data retention specifications and ensure regular testing and maintenance schedules to mitigate potential failures over time.
How can I identify if my communication with the S29AL016D90TFI01 is functioning correctly during development?
To ensure proper communication with the S29AL016D90TFI01, implement diagnostic routines in your firmware to check for expected read and write success rates. Utilize test points on your PCB to monitor signal integrity and voltages, and consider employing an oscilloscope to visualize signal timing to catch any potential issues early in the development phase.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


S29AL016D90TFI01

SPANSION

S29AL016D90TFI01 SPANSION TSOP48

In Stock: 3418

SUBMIT RFQ