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SN74LVC07APWT

In Stock 8750 pcs Reference Price(In US Dollars)
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$0.9419
250+
$0.3647
500+
$0.3516
1000+
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Manufacturer Part Number:
SN74LVC07APWT
Manufacturer / Brand
Texas Instruments
Part of Description:
IC BUF NON-INVERT 5.5V 14TSSOP
Datasheets:
SN74LVC07APWT(1).pdfSN74LVC07APWT(2).pdfSN74LVC07APWT(3).pdfSN74LVC07APWT(4).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 8750 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SN74LVC07APWT
Manufacturer / Brand Texas Instruments
Stock Quantity 8750 pcs Stock
Category Integrated Circuits (ICs) > Logic - Buffers, Drivers, Receivers, Transceivers
Description IC BUF NON-INVERT 5.5V 14TSSOP
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply 1.65V ~ 5.5V
Supplier Device Package 14-TSSOP
Series 74LVC
Package / Case 14-TSSOP (0.173", 4.40mm Width)
Package Tape & Reel (TR)
Output Type Open Drain
Operating Temperature -40°C ~ 125°C (TA)
Number of Elements 6
Number of Bits per Element 1
Mounting Type Surface Mount
Logic Type Buffer, Non-Inverting
Input Type -
Current - Output High, Low -, 24mA
Base Product Number 74LVC07

Packaging & ESD

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The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


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SN74LVC07APWT Product Details:

The SN74LVC07APWT is a sophisticated integrated circuit buffer designed by Texas Instruments (formerly Luminary Micro) that belongs to the logic buffers, drivers, receivers, and transceivers category within the broader integrated circuits family. This non-inverting buffer IC addresses critical design challenges in digital systems where signal integrity, voltage level translation, and current drive capabilities are paramount concerns for engineers working with mixed-voltage environments and high-speed digital applications.

Functionally, this device operates as a hex buffer with open-drain outputs, featuring six independent buffer elements where each element processes single-bit signals without inverting the logic state. The open-drain output configuration makes it particularly valuable for applications requiring wired-OR logic implementations, bus interfacing, and voltage level shifting between different logic families. The IC operates across an impressive supply voltage range from 1.65V to 5.5V, enabling seamless integration in both low-power portable devices and traditional 5V systems, while maintaining robust performance across an extended temperature range of -40°C to 125°C for industrial and automotive applications.

The device's key specifications include a maximum output current capability of 24mA in the low state, making it suitable for driving moderate loads and multiple inputs simultaneously. The 14-TSSOP package format with 0.173-inch width provides an optimal balance between pin count, thermal performance, and board space efficiency, while the surface mount configuration ensures compatibility with modern automated assembly processes. The RoHS3 compliance certification guarantees environmental safety standards adherence, making it suitable for commercial and consumer electronics applications worldwide.

Primary advantages of the SN74LVC07APWT include its exceptional voltage flexibility allowing direct interfacing between 1.8V, 3.3V, and 5V systems without additional level translation circuitry, low power consumption characteristics essential for battery-powered applications, and high noise immunity ensuring reliable operation in electrically noisy environments. The open-drain outputs eliminate the need for external pull-up resistors in many applications while providing flexibility for custom pull-up configurations when specific timing or voltage requirements exist.

Compatibility extends across multiple logic families including TTL, CMOS, and low-voltage CMOS systems, making it an ideal choice for mixed-signal designs and legacy system upgrades. The device seamlessly interfaces with microcontrollers, FPGAs, DSPs, and other digital processing units from various manufacturers, while its wide supply voltage range ensures compatibility with both emerging low-power designs and established higher-voltage systems.

Application areas encompass a broad spectrum including industrial automation systems for signal buffering and isolation, automotive electronics for sensor interfacing and control module communications, telecommunications equipment for line driving and signal conditioning, consumer electronics for level translation between different voltage domains, and embedded systems requiring reliable signal buffering with minimal power consumption. The device proves particularly valuable in I2C bus applications, LED driving circuits, relay control systems, and general-purpose digital signal buffering where open-drain outputs provide system design flexibility.

Equivalent and alternative models include the SN74LVC07ADBR offering the same functionality in a different package format, SN74LVC07ADGVR providing similar performance with enhanced ESD protection, and SN74LVC07ANSR featuring identical electrical characteristics in a standard SOIC package. Alternative manufacturers offer comparable solutions such as the NXP 74LVC07APW, ON Semiconductor MC74LVC07ADR2G, and Fairchild 74LVC07AMX, all providing similar hex buffer functionality with open-drain outputs. For applications requiring different output configurations, the SN74LVC17APWT offers similar buffering with standard push-pull outputs, while the SN74LVC125APWT provides tri-state outputs for bus-oriented applications. These alternatives ensure design flexibility and supply chain redundancy while maintaining functional compatibility across different system requirements and cost constraints.

SN74LVC07APWT Key Technical Attributes

Manufacturer Part Number: SN74LVC07APWT

Main Category: Integrated Circuits (ICs)

RoHS: ROHS3 Compliant

SN74LVC07APWT Packing Size

The SN74LVC07APWT is supplied in a 14-TSSOP (Thin Shrink Small Outline Package) form factor, with package dimensions of 0.173 inches (4.40mm width). This compact and efficient surface-mount package supports high-density PCB applications. It features 14 pins, carefully laid out to enable straightforward integration into modern circuit designs. The package uses lead-free materials to ensure RoHS3 compliance, and the device is commonly supplied on tape and reel (TR) for automated assembly.

Type, Material, and Pin Configuration

As a 14-TSSOP device, the SN74LVC07APWT utilizes a high-quality epoxy resin and copper-lead frame to achieve both thermal efficiency and reliability. With 14 individually distinguishable pins, the configuration supports 6 non-inverting buffers—each buffer assigned to a dedicated pin, reinforcing signal isolation and facilitating ease of design on multi-channel PCB layouts.

Thermal Characteristics and Electrical Properties

Operating within a temperature range of -40°C to 125°C, this IC is built to endure both commercial and industrial environments. The supply voltage ranges from 1.65V to 5.5V, offering flexibility for a wide spectrum of logic levels. It provides an open-drain output with a 24mA current sinking capability per channel, while the high impedance inputs ensure negligible power draw in standby mode. The TSSOP package supports efficient heat dissipation and stable operation under continuous load.

SN74LVC07APWT Application

The SN74LVC07APWT is engineered for broad application across digital circuits requiring robust buffer operation, including voltage level translation, signal isolation, and driving of high-current loads. It is widely employed in telecommunications, commercial computing equipment, industrial controllers, signal multiplexing, and any system that requires reliable non-inverting logic buffering. Its compatibility with various voltage nodes also makes it a preferred solution in mixed-signal systems.

SN74LVC07APWT Features

This device integrates six independent buffer channels within a single package, each configured as a non-inverting buffer with open-drain outputs. The open-drain design allows direct wire-OR connections and facilitates interfacing with different voltage levels via external pull-up resistors. Designed with the advanced 74LVC CMOS process, the SN74LVC07APWT delivers high switching speeds, reduced propagation delays, and robust signal integrity. Its wide voltage supply range (1.65V to 5.5V) ensures compatibility with both legacy 5V systems and modern low-voltage logic families. The IC offers strong output drive (up to 24mA sink current per channel) for effective driving of LEDs or relay coils. Additional noise immunity and latch-up protection guarantee reliable performance in electrically noisy environments. The device's compact TSSOP packaging optimizes space savings, making it ideal for portable and miniaturized electronics. This buffer adheres to the latest environmental standards, featuring fully lead-free and RoHS3 compliant construction.

SN74LVC07APWT Quality and Safety Features

Manufactured to Texas Instruments’ stringent quality controls, the SN74LVC07APWT is certified RoHS3 compliant, ensuring adherence to international safety and environmental requirements. It boasts superior ESD protection, advanced thermal management through efficient package design, and high reliability validated by extended temperature operation from -40°C to 125°C. The device includes enhanced input protection to guard against voltage transients, ensuring safe operation even in fluctuating power environments.

SN74LVC07APWT Compatibility

As part of the 74LVC logic series, the SN74LVC07APWT is universally compatible with other 74LVC and standard CMOS/TTL logic families. Its open-drain outputs enable seamless interfacing with multiple voltage domains, allowing easy integration into both existing and new circuit designs. The standard 14-TSSOP footprint is widely supported by most PCB design tools and assembly processes, ensuring smooth transition into high-volume manufacturing.

SN74LVC07APWT Datasheet PDF

Our website provides the most comprehensive and authoritative datasheet for the SN74LVC07APWT, including all technical specifications, application guides, and recommended usage patterns. For optimal performance and design reliability, we highly recommend downloading the official Texas Instruments SN74LVC07APWT datasheet directly from this page.

Quality Distributor

IC-Components is proud to be a premium distributor of Luminary Micro/Texas Instruments components. With an extensive global inventory and unwavering commitment to authentic, high-quality parts, we guarantee that you will receive only genuine products. Take advantage of our industry-leading service—request a quote for the SN74LVC07APWT directly on our website today and join thousands of satisfied customers worldwide.

Frequently Asked Questions

What are the key considerations when integrating the SN74LVC07APWT into a system with mixed voltage levels?
The SN74LVC07APWT supports a wide supply voltage range of 1.65V to 5.5V, making it suitable for mixed-voltage environments. When integrating, ensure that input signals do not exceed the device’s maximum voltage (which aligns with the supply voltage). Also, verify that the power supply and I/O voltage levels are compatible with other system components. Proper level translation may be needed if interfacing with higher or lower voltage devices to prevent damage or unreliable operation.
Can the SN74LVC07APWT operate reliably in industrial temperature environments of -40°C to 125°C, and what design precautions should be taken?
Yes, the SN74LVC07APWT is rated for an operating temperature range of -40°C to 125°C, suitable for industrial applications. To ensure reliability, confirm proper PCB layout for thermal management, avoid excessive power dissipation, and incorporate appropriate protection measures such as voltage transient suppressors. Additionally, perform long-term testing under intended operating conditions to verify performance stability.
Is the open-drain output type of the SN74LVC07APWT compatible with pull-up resistors for bus applications, and what considerations should I keep in mind?
Yes, the open-drain outputs require external pull-up resistors to define the high state. When designing such a bus, select pull-up resistor values that balance switching speed and power consumption; typical values range from 4.7kΩ to 10kΩ. Ensure the current rating for this resistor is within the device's maximum sink current of 24mA and that the pull-up voltage aligns with the device’s supply voltage for proper logic levels.
How does the SN74LVC07APWT compare to other buffer ICs in terms of power consumption and speed?
The SN74LVC07APWT is optimized for low-voltage operation with a supply voltage range of 1.65V to 5.5V, offering relatively low dynamic power consumption. Its high-speed CMOS technology ensures fast switching characteristics suitable for high-frequency digital circuits. However, for very high-speed applications or power-sensitive designs, compare propagation delay and current parameters with newer or specialized buffer devices to choose the most efficient component.
What are the key factors to consider when replacing a different buffer with the SN74LVC07APWT in an existing design?
When replacing another buffer IC with the SN74LVC07APWT, verify that the device’s voltage requirements, output type, drive strength, and package footprint match your design constraints. Ensure that the open-drain output configuration is compatible or plan additional circuitry if not. Also, check that the operating temperature and current ratings meet the application's environmental and load conditions. Pin compatibility and physical package dimensions should be considered to prevent redesigns.
Are there any specific reliability or aging considerations for using the SN74LVC07APWT in long-term industrial deployments?
The SN74LVC07APWT is designed for high reliability with RoHS3 compliance and industrial temperature specifications. For long-term deployments, ensure that supply voltages remain within specified ranges, avoid exposure to voltage transients beyond absolute maximum ratings, and implement proper PCB design practices for thermal and mechanical stress mitigation. Regular system testing and monitoring can also help detect early signs of device degradation.
How should I handle power-up and power-down sequencing for circuits using the SN74LVC07APWT?
Since the SN74LVC07APWT is a CMOS device with open-drain outputs, ensure that the supply voltage (VCC) is stabilized before activating input signals to prevent undefined states. During power-down, avoid applying input signals that could compete with pull-up resistors or cause unintended state changes. Following manufacturer recommendations for sequencing and including proper decoupling and filtering helps maintain signal integrity.
Can the SN74LVC07APWT be used for high-current driving applications, and what precautions are necessary?
The SN74LVC07APWT can sink or source up to 24mA per output, which is suitable for driving moderate loads such as LEDs or transmission lines. For higher current demands, consider using buffer drivers with higher current ratings or adding external transistors or driver ICs. Always ensure that the thermal dissipation is managed properly to prevent device overheating when operating near maximum current limits.
What are the trade-offs when selecting the SN74LVC07APWT over similar logic buffer ICs from other manufacturers?
The SN74LVC07APWT offers advantages like wide supply voltage range, industrial temperature tolerance, and RoHS compliance, ensuring suitability for diverse applications. Trade-offs may include package size (14-TSSOP) compared to smaller footprints or different signal characteristics. Evaluate parameters such as speed, power consumption, pin compatibility, and manufacturer support to determine the best fit for your specific application.
How does the physical package (14-TSSOP) of the SN74LVC07APWT influence PCB design and assembly?
The 14-TSSOP package requires precise PCB footprint design to ensure reliable solder connections, with attention to pad size, pitch (0.173" / 4.4mm width), and spacing. During assembly, optical inspection or X-ray testing may be necessary to verify solder joints. Consider thermal management since TSSOP packages have limited exposed pad area; proper via stitching and thermal vias can improve heat dissipation in high-density or high-current designs.

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