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SCT3022ALGC11

In Stock 830 pcs Reference Price(In US Dollars)
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$50.3654
10+
$46.9909
100+
$40.8002
Manufacturer Part Number:
SCT3022ALGC11
Manufacturer / Brand
Rohm Semiconductor
Part of Description:
SICFET N-CH 650V 93A TO247N
Datasheets:
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 830 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SCT3022ALGC11
Manufacturer / Brand Rohm Semiconductor
Stock Quantity 830 pcs Stock
Category Discrete Semiconductor Products > Transistors - FETs, MOSFETs - Single
Description SICFET N-CH 650V 93A TO247N
Lead Free Status / RoHS Status: ROHS3 Compliant
Vgs(th) (Max) @ Id 5.6V @ 18.2mA
Vgs (Max) +22V, -4V
Technology SiCFET (Silicon Carbide)
Supplier Device Package TO-247N
Series -
Rds On (Max) @ Id, Vgs 28.6mOhm @ 36A, 18V
Power Dissipation (Max) 339W (Tc)
Package / Case TO-247-3
Package Tube
Operating Temperature 175°C (TJ)
Mounting Type Through Hole
Input Capacitance (Ciss) (Max) @ Vds 2208 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs 133 nC @ 18 V
FET Type N-Channel
FET Feature -
Drive Voltage (Max Rds On, Min Rds On) 18V
Drain to Source Voltage (Vdss) 650 V
Current - Continuous Drain (Id) @ 25°C 93A (Tc)
Base Product Number SCT3022

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

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Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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SCT3022ALGC11 Product Details:

The SCT3022ALGC11 from LAPIS Technology is a high-performance N-Channel Silicon Carbide MOSFET (SiCFET) designed to address the demanding challenges of high-voltage, high-current power switching applications. This discrete semiconductor transistor falls within the FETs and MOSFETs single transistor category, specifically engineered for applications requiring superior thermal performance and efficient power management in harsh operating environments.

Built on advanced Silicon Carbide (SiC) technology, this component delivers exceptional electrical characteristics that overcome traditional silicon MOSFET limitations, including a robust drain-to-source voltage rating of 650V and an impressive continuous drain current capability of 93A at 25°C (Tc), making it ideal for high-power density designs. The device features a low on-resistance of just 28.6 milliohms at 36A drain current and 18V gate-to-source voltage, significantly reducing conduction losses and improving overall system efficiency. With a maximum power dissipation of 339W (Tc) and an exceptional operating junction temperature of 175°C, this MOSFET excels in thermally challenging applications where conventional silicon devices would fail.

The transistor's gate threshold voltage is specified at 5.6V maximum at 18.2mA, with a total gate charge of 133 nC at 18V and input capacitance of 2208 pF at 500V, providing fast switching characteristics essential for high-frequency power conversion. The device operates with a drive voltage of 18V for optimal performance and supports a gate-to-source voltage range of +22V to -4V. Housed in a standard TO-247N (TO-247-3) through-hole package supplied in tube format, this component offers excellent thermal management and ease of mounting for industrial and commercial applications, while maintaining RoHS3 compliance for environmental standards.

Primary advantages include superior thermal conductivity inherent to SiC technology, reduced switching losses, higher operating temperatures compared to silicon alternatives, lower on-resistance enabling compact designs, and enhanced reliability in demanding power electronics applications. This MOSFET is particularly well-suited for switch-mode power supplies, motor drives, solar inverters, uninterruptible power supplies (UPS), electric vehicle charging systems, industrial automation equipment, and renewable energy conversion systems where efficiency, reliability, and thermal performance are critical.

Equivalent or alternative models that designers might consider include the ROHM SCT3022AL, Wolfspeed (formerly Cree) C3M0021120K and C3M0025065K series, Infineon IMW65R027M1H and IMZA65R027M1H, STMicroelectronics SCTWA35N65G2V and SCT30N65G2V-7, ON Semiconductor NTBG022N65S3 and NTH4L028N065SC1, as well as other 650V-class SiC MOSFETs from manufacturers like Littelfuse (IXYS), GeneSiC, and Microchip that offer similar voltage ratings, current capabilities, and package configurations for comparable high-power switching applications.

SCT3022ALGC11 Key Technical Attributes

N-Channel SiC MOSFET

650V / 93A / 28.6mΩ

TO-247N Package

SCT3022ALGC11 Packing Size

The SCT3022ALGC11 uses the robust TO-247N package, renowned for its high power dissipation capabilities and excellent thermal performance, supporting up to 339W (Tc). This through-hole package features three pins and is constructed from high-quality materials compatible with harsh, high-temperature environments, allowing for operation up to 175°C junction temperature. The device is supplied in a tube format, ensuring components are well-protected during storage and shipment. The standardized TO-247N pin configuration allows for straightforward integration into power circuit designs, ensuring mechanical and electrical reliability.

SCT3022ALGC11 Application

This advanced SiC N-Channel MOSFET is engineered for high-efficiency power conversion applications, including switching power supplies, motor inverters, solar inverters, uninterruptible power supplies (UPS), and high-voltage DC-DC converters. Its high current capability and superior voltage-withstand make it especially suitable for applications demanding fast switching speeds, low conduction losses, and operation in demanding industrial or automotive environments.

SCT3022ALGC11 Features

The SCT3022ALGC11 leverages Silicon Carbide (SiC) technology, offering lower switching losses and superior high-temperature performance compared to traditional silicon MOSFETs. It features a maximum drain-to-source voltage (Vdss) of 650V and is capable of continuous drain current up to 93A (Tc), making it ideal for high-power and high-efficiency circuits. The device exhibits an extremely low maximum Rds(on) of 28.6mΩ at 36A, 18V Vgs, resulting in excellent efficiency and reduced heat generation. The MOSFET supports a maximum gate-source voltage of +22V to -4V, and it has a total gate charge (Qg) of 133nC, facilitating rapid switching. The device also offers high input capacitance (Ciss) of 2208pF and is designed for robust operation under demanding thermal and electrical stress, extending the operational lifespan of electronic systems. Detailed and precise thermal, electrical, and gate parameters ensure engineers can take full advantage of the latest SiC performance benefits.

SCT3022ALGC11 Quality and Safety Features

Compliant with the strict ROHS3 environmental standards, the SCT3022ALGC11 is free from hazardous substances, supporting global environmental initiatives and safety compliance. The package provides exceptional thermal characteristics, supporting high junction temperatures up to 175°C and maintaining reliable performance under extended duty cycles and overload conditions. Through-hole mounting and superior mechanical integrity contribute to enhanced system-level reliability, reducing the risk of failure in critical power applications.

SCT3022ALGC11 Compatibility

The SCT3022ALGC11 is part of the broader SCT3022 family, ensuring compatibility with designs requiring TO-247-3 or TO-247N package MOSFETs. Its standardized electrical characteristics enable seamless integration into various circuit designs, making it a direct replacement or upgrade for other N-channel SiC MOSFETs rated at similar voltages and currents. It is extremely suitable for both new designs and for designers seeking improved efficiency or thermal headroom in upgrading existing systems.

SCT3022ALGC11 Datasheet PDF

Our website provides the most authoritative and up-to-date datasheet for the SCT3022ALGC11, featuring detailed electrical, mechanical, and application information necessary for accurate design and implementation. We strongly encourage customers to download the datasheet directly from this page to ensure you have the latest specifications and guidance.

Quality Distributor

IC-Components is proud to be a premium distributor of LAPIS Technology products. By sourcing your SCT3022ALGC11 through our platform, you benefit from rigorous quality control, genuine products, and competitive pricing. We invite you to request a quote today on our website and experience trusted service and exceptional availability for all your component needs.

Frequently Asked Questions

How does the high operating temperature of the SCT3022ALGC11, rated at 175°C TJ, impact its suitability for my industrial power applications?
The high operating temperature of 175°C TJ allows the SCT3022ALGC11 to operate reliably in harsh industrial environments with elevated temperatures. It reduces the need for extensive cooling and helps maintain performance stability under thermal stress, making it suitable for high-power, high-temperature switching and power conversion applications. Ensure proper heat sinking and thermal management to prevent exceeding its maximum junction temperature during operation.
What considerations should I keep in mind when integrating the SCT3022ALGC11 SiCFET in a circuit with a 650V drain-source voltage requirement?
When integrating the SCT3022ALGC11, verify that the drain-to-source voltage (Vdss) rating of 650V exceeds your maximum circuit voltage with adequate safety margin. Proper layout to minimize parasitic inductances and ensure robust gate and drain connections are essential. Additionally, account for transient voltage spikes; include snubbers or TVS diodes if needed to protect against voltage transients beyond 650V.
Can the SCT3022ALGC11 handle fast switching applications, and what gate charge considerations should I be aware of for high-frequency operation?
The SCT3022ALGC11 has a gate charge (Qg) of up to 133 nC at 18V, which influences drive circuitry. For high-frequency switching, ensure your driver can source and sink this gate charge efficiently to achieve desired switching speeds and minimize losses. Proper gate drive design, including suitable gate resistors and drive voltage, is critical to optimize switching performance and reduce electromagnetic interference.
How can I replace the SCT3022ALGC11 with alternative SiC FETs without impacting system reliability or performance?
When replacing SCT3022ALGC11, select SiC FETs with comparable voltage ratings (650V), current ratings (93A), Rds on, and package type (TO-247N). Consider differences in gate charge, switching characteristics, and thermal management requirements. Consult datasheets to evaluate whether the alternative part offers similar or improved efficiency, and assess any changes needed in gate drive circuitry or cooling solutions to maintain system reliability.
What are the key impact factors when designing a circuit with the SCT3022ALGC11 for automotive or aerospace environments?
In automotive or aerospace applications, consider the device’s RoHS3 compliance, high-temperature operation, and robust package (TO-247N). Verify the device’s environmental ratings beyond standard specifications, such as vibration, shock, and transient voltage conditions. Ensure that the power dissipation capacity (339W max) and thermal management are sufficient for reliability over the long term. Additionally, account for voltage transients and EMI immunity specific to these environments.
Is the through-hole mounting type of SCT3022ALGC11 suitable for high-density PCB designs, and what are the assembly considerations?
The through-hole TO-247N package offers excellent power dissipation and mechanical stability but is less suitable for ultra-high-density PCBs compared to surface-mount devices. During assembly, ensure proper hole alignment, sufficient heat sinking, and adequate clearance around the package to facilitate cooling. Use appropriate mounting techniques to maintain reliable electrical and thermal contact throughout the device’s lifespan.
What are the main design risks associated with operating the SCT3022ALGC11 at maximum Rds(on) and gate voltage (Vgs) conditions?
Operating at the maximum specified Rds(on) (28.6mΩ at 36A, 18V) and Vgs (up to +22V) can increase conduction losses and thermal stress. To optimize efficiency and device longevity, operate at or below recommended gate voltages (e.g., 18V drive). Exceeding these limits may lead to increased Rds(on), thermal overstress, or failure. Incorporate proper gate drive circuitry and thermal management strategies to mitigate these risks.
How does the input capacitance (Ciss) of 2208 pF at 500V impact the design of the gate driver circuit for SCT3022ALGC11?
The high input capacitance requires a gate driver capable of delivering sufficient current to charge and discharge Ciss quickly, especially at high switching frequencies. Use a driver with low output impedance and consider adding a gate resistor to balance switching speed and electromagnetic interference. Proper driver selection helps prevent voltage overshoot and reduces switching losses while ensuring reliable operation.
In what scenarios should the SCT3022ALGC11 be avoided or replaced with a different type of power transistor?
Avoid using the SCT3022ALGC11 in circuits where voltages exceed 650V or in environments with significant voltage transients beyond its rating. Also, if ultra-low Rds(on) for minimal conduction losses at low gate voltages is required, consider alternative devices specifically designed for such low on-resistance. Furthermore, for applications requiring surface-mount solutions or different package forms, select accordingly. Always verify that the device’s thermal and electrical ratings match your application's operational envelope.
What long-term reliability considerations should I account for when using the SCT3022ALGC11 in high-current, high-temperature power systems?
For reliable long-term operation, ensure proper thermal management to stay within its operating temperature of 175°C TJ, including adequate heat sinking and airflow. Monitor power dissipation, especially under continuous high-current loads (93A), and design for derating where appropriate. Use high-quality gate drive circuitry to prevent overvoltage or undershoot at the gate, and incorporate protective measures against voltage transients and electrostatic discharge. Regular thermal cycling and environmental conditions should be considered to prevent device degradation over time.

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