The EPF10K50EFC484-2 is a sophisticated Field Programmable Gate Array (FPGA) manufactured by Intel, belonging to the renowned FLEX-10KE series of integrated circuits designed for embedded applications requiring high-density programmable logic solutions. This device addresses the critical design challenge of providing flexible, reconfigurable digital logic capabilities while maintaining robust performance across industrial temperature ranges, making it ideal for applications where custom logic implementation and adaptability are essential without the commitment to ASIC development.
At its core, this FPGA features an impressive architecture with 199,000 gates and 2,880 logic elements distributed across 360 LABs (Logic Array Blocks), providing substantial computational resources for complex digital designs. The device offers 220 I/O pins for interfacing with external systems, housed in a compact 484-FBGA (Fine-pitch Ball Grid Array) package measuring 23x23mm, utilizing surface mount technology for efficient PCB integration. Operating within a supply voltage range of 2.3V to 2.7V, it maintains reliable performance across commercial temperature ranges from 0°C to 70°C, making it suitable for various industrial and commercial environments. The integrated 40,960 RAM bits provide essential on-chip memory resources for data buffering, lookup tables, and temporary storage requirements.
The primary advantages of this FPGA include its high logic density enabling complex system integration, the flexibility to reprogram functionality in the field, reduced time-to-market compared to custom ASIC solutions, and the ability to implement parallel processing architectures for performance-critical applications. The 484-BBGA package format ensures excellent thermal performance and signal integrity while maintaining a reasonable footprint for space-constrained designs. This device finds extensive application in telecommunications infrastructure, industrial automation and control systems, digital signal processing implementations, protocol bridging and conversion, embedded system prototyping, medical instrumentation, test and measurement equipment, and automotive electronics where programmable logic provides system adaptability.
Regarding equivalent or alternative models, designers might consider other devices within Intel's FLEX-10KE family such as the EPF10K30, EPF10K40, EPF10K70, EPF10K100, and EPF10K130, which offer varying logic densities and I/O counts to match specific application requirements. Cross-vendor alternatives include Xilinx Spartan series FPGAs like the XC3S400 or XC3S1000, Lattice Semiconductor's ECP family, and Microsemi's ProASIC3 series, though exact pin-for-pin compatibility would require careful evaluation of specifications, as each manufacturer implements different architectures and toolchains that may necessitate design modifications during migration.
EPF10K50EFC484-2 Key Technical Attributes
Manufacturer: Intel
Manufacturer Part Number: EPF10K50EFC484-2
Main Category: Integrated Circuits (ICs)
EPF10K50EFC484-2 Packing Size
This product is delivered in a compact 484-FBGA (23x23) package, making it suitable for space-constrained applications. The tray packaging ensures protection during handling and transportation. The FBGA package type supports optimal electrical and thermal performance, and the pin configuration includes 220 I/O pins to cater to high-density connectivity requirements.
EPF10K50EFC484-2 Application
The EPF10K50EFC484-2 FPGA from Intel is ideally suited for a wide range of programmable logic solutions, including industrial automation, data processing, telecommunications, and embedded system design. Its significant I/O capability and reprogrammable nature provide excellent flexibility for custom logic implementation.
EPF10K50EFC484-2 Features
This FPGA model is built under the FLEX-10KE series and incorporates 199,000 gates, offering extensive logic resources for complex digital designs. It houses 2880 logic elements, providing high scalability for intricate applications. With 360 LABs/CLBs, designers benefit from enhanced modularity and architecture flexibility. The device includes 40,960 bits of RAM, allowing versatile memory configurations within system designs. It operates within a voltage supply range of 2.3V to 2.7V, ensuring stable performance in various environments. The surface-mount technology enables efficient assembly, and the wide operating temperature range from 0°C to 70°C accommodates commercial-grade requirements.
EPF10K50EFC484-2 Quality and Safety Features
The EPF10K50EFC484-2 is manufactured by Intel, renowned for highly reliable and thoroughly tested integrated circuits. The device features robust electrical insulation and stable power management to minimize risk in demanding applications. It is designed with thermal efficiency in mind, ensuring sustained operation without performance degradation. Safety protocols during production and data integrity in operation are strictly adhered to within Intel’s quality management standards.
EPF10K50EFC484-2 Compatibility
With its standard 484-FBGA form factor and electrical parameters, this FPGA is compatible with a broad range of industry-standard boards and assembly platforms. Its pinout and mounting specifications facilitate easy integration into pre-existing designs and systems requiring high I/O count FPGAs.
EPF10K50EFC484-2 Datasheet PDF
Our website provides the most authoritative and up-to-date datasheet for the EPF10K50EFC484-2 product model. We strongly recommend downloading the datasheet from the current page to access detailed technical information, reference designs, and application guidelines.
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