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SP2638F-R-T

Manufacturer Part Number:
SP2638F-R-T
Manufacturer / Brand
SI-POWER
Part of Description:
895
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 3784 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP2638F-R-T
Manufacturer / Brand SI-POWER
Stock Quantity 3784 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description 895
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key electrical constraints when integrating the SP2638F-R-T into a 3.3V digital system, and how does its I/O compatibility affect signal integrity in mixed-voltage environments?
The SP2638F-R-T is designed with 5V-tolerant I/Os, which allows safe interfacing with 3.3V logic without level shifting. However, input thresholds must be verified against the target system’s noise margins; exceeding the maximum absolute input voltage of -0.3V to +7V ensures robustness but does not guarantee correct logic interpretation at lower supply rails. Careful PCB layout and decoupling are essential to maintain signal integrity across the full industrial temperature range.
Can the SP2638F-R-T reliably operate in automotive or extended industrial temperature applications, and what derating considerations apply for long-term reliability at elevated ambient temperatures?
Yes, the SP2638F-R-T supports operation from -40°C to +85°C, making it suitable for industrial and some automotive edge cases. However, continuous exposure near the upper limit requires derating of output current and power dissipation to prevent thermal runaway. Junction temperature should be monitored indirectly via package thermal resistance (θJA) and ambient conditions to ensure junction stays below 125°C under worst-case load.
When replacing legacy interface ICs like MAX232 or SN75176B, what design trade-offs should be considered with the SP2638F-R-T in RS-232 or RS-485 communication designs?
Unlike the SP2638F-R-T, legacy parts often include integrated charge pumps or transceivers with built-in protection. The SP2638F-R-T may require external ESD protection diodes and careful grounding due to its SOP7 package having limited pin count. Additionally, absence of internal termination means designers must implement external biasing and termination networks for RS-485 bus compliance, increasing BOM complexity.
How does the SP2638F-R-T handle electrostatic discharge events, and what external components are recommended to meet IEC 61000-4-2 Level 2 requirements in field-deployed systems?
While the device has basic human-body model (HBM) ESD tolerance per JEDEC standards, achieving IEC 61000-4-2 Level 2 compliance typically demands external TVS diodes on all exposed pins, especially I/O lines. A common practice is to place bidirectional TVS arrays with <30pF capacitance close to connectors to clamp transient energy before it reaches the SP2638F-R-T.
Is the SP2638F-R-T suitable for battery-powered applications, and what impact does quiescent current have on system-level power budgeting?
The SP2638F-R-T features low quiescent current in active mode (~1.5 mA), but not deep-sleep functionality. For true low-power operation, duty-cycling or alternative devices with shutdown modes should be evaluated. In always-on configurations, even this modest current can dominate the power budget over time, necessitating accurate measurement under real-world operating profiles.
What configuration options exist for the SP2638F-R-T, and how do internal pull-up/pull-down resistors influence default state behavior during startup or brownout conditions?
The SP2638F-R-T includes configurable internal pull-ups/downs on certain pins, allowing defined idle states without external resistors. However, these are weak (typically 50 kΩ–100 kΩ) and may not provide stable logic levels under high-impedance loads. Designers must verify that startup sequences and reset conditions result in predictable pin states to avoid unintended latch-up or communication errors.
When migrating from a DIP-8 packaged version to the SP2638F-R-T in SOP7, what mechanical and thermal challenges arise, and how does footprint size affect heat dissipation in dense PCBs?
The SOP7 package is significantly smaller than DIP-8, offering space savings but reducing exposed thermal paths. With no direct metal connection to a heatsink, thermal performance relies entirely on copper pours and vias. In high-current applications, this may necessitate larger ground pads or adjacent thermal relief strategies to prevent localized heating that exceeds the SP2638F-R-T’s maximum junction rating.
Can the SP2638F-R-T drive inductive loads such as relays or solenoids directly, and what protection mechanisms are critical to prevent damage from back EMF?
The SP2638F-R-T is not rated for direct switching of inductive loads. External MOSFETs or drivers are required. If used with flyback diodes, ensure they are placed across the relay coil with correct polarity. Without proper suppression, inductive kickback can exceed the SP2638F-R-T’s absolute maximum ratings and cause permanent failure.
What clocking and timing constraints must be observed when using the SP2638F-R-T in synchronous communication protocols like SPI or I2C, especially regarding setup/hold times and propagation delay?
The SP2638F-R-T introduces fixed propagation delays through its internal buffers, which can violate timing budgets in high-speed serial links. Engineers must simulate total path delay including package parasitics and account for skew when cascading multiple stages. Clock-to-data alignment becomes critical beyond 1 MHz; datasheet tpd values should be validated with actual board layout in the target environment.
Are there known compatibility issues when substituting the SP2638F-R-T into designs originally based on TI’s SN75LBC184 or Analog Devices’ ADM2483, particularly regarding signaling standards and isolation requirements?
The SP2638F-R-T is a non-isolated buffer or transceiver, unlike ADM2483, which provides galvanic isolation. Replacing it directly would eliminate safety barriers and violate functional safety standards in isolated applications. Even if signaling voltage ranges overlap, the lack of isolation renders the SP2638F-R-T unsuitable for replacing ADI or TI parts in inherently unsafe or regulated industrial systems.

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