The AMD Xilinx Versal AI Core FPGA (Part Number XCVE1752-2MSENSVG1369) represents an advanced, high-performance System-on-Chip (SoC) solution designed for complex computational and embedded processing requirements. This cutting-edge integrated circuit leverages a sophisticated heterogeneous architecture that combines robust processing capabilities with adaptable programmable logic.
At its core, the device features a powerful dual-core ARM Cortex-A72 MPCore processor complemented by a dual ARM Cortex-R5F processor, enabling sophisticated real-time and high-performance computing across diverse application domains. The integrated design supports a wide operating temperature range from 0°C to 110°C, ensuring reliable performance in challenging environmental conditions.
The FPGA delivers exceptional computational flexibility with 500 I/O pins and multiple connectivity options, including Ethernet, CAN bus, USB OTG, SPI, UART, and PCIe interfaces. Its impressive processing speeds ranging from 600MHz to 1.4GHz, coupled with 256KB of RAM, make it suitable for demanding applications in artificial intelligence, edge computing, telecommunications, industrial automation, and aerospace systems.
Key architectural advantages include its MPU/FPGA hybrid design, which provides unparalleled programmability and performance optimization. The device supports critical peripheral interfaces like DDR memory, DMA, and multiple communication protocols, enabling seamless integration into complex system architectures.
Packaged in a compact 1369-FCBGA (35x35) form factor, this Versal AI Core FPGA offers engineers a versatile, high-performance solution for developing advanced embedded systems requiring significant computational flexibility and robust real-time processing capabilities.
While direct equivalent models are manufacturer-specific, comparable alternatives within the AMD Xilinx Versal AI Core series might include models like XCVE2002, XCVE1752, and XCVE1702, each offering varying performance characteristics and integration capabilities.
XCVE1752-2MSENSVG1369 Key Technical Attributes
Manufacturer part number XCVE1752-2MSENSVG1369
Manufacturer AMD Xilinx
Series Versal AI Core
Main category Integrated Circuits ICs
Small classification Embedded System On Chip SoC
Architecture MPU and FPGA heterogeneous compute
Core processors Dual ARM Cortex A72 MPCore with CoreSight and Dual ARM Cortex R5F with CoreSight
Maximum CPU speeds 1.4 GHz A72 and 600 MHz R5F
On chip RAM 256 KB
Number of I O 500
Peripherals DDR DMA PCIe
Connectivity CANbus EBI EMI Ethernet I2C MMC SD SDIO SPI UART USART USB OTG
Operating temperature 0°C to 110°C TJ
XCVE1752-2MSENSVG1369 Packing Size
Package type 1369 FCBGA 35 x 35 mm
Alternate package listing 1369 BFBGA FCBGA
Supplier device package 1369 FCBGA 35 x 35 mm
Shipment package Tray
Ball count 1369 full array
Mounting type Surface mount BGA reflow compatible
Package material Organic substrate with lead free RoHS compliant solder balls
Pin configuration Ball grid array refer to datasheet for exact ball map and pitch
Thermal characteristics Junction temperature range 0°C to 110°C TJ use device thermal models and heatsinking for compliance
Electrical properties Multi rail power domains typical for Versal devices refer to datasheet for rail names voltage levels and sequencing
XCVE1752-2MSENSVG1369 Application
Edge AI inference and embedded acceleration
Industrial automation robotics motion control and PLC upgrade platforms
5G O RAN and fronthaul midhaul packet processing
Automotive domain control ADAS sensor fusion and gateway compute where applicable grade allows
Software defined radio radar and lidar signal processing
Smart cameras machine vision video analytics and video transport
High speed networking storage and PCIe acceleration cards
Aerospace and defense compute where COTS devices are suitable
XCVE1752-2MSENSVG1369 Features
- Heterogeneous compute platform that blends high performance application processing with adaptable hardware acceleration. The dual ARM Cortex A72 complex provides rich operating system support and user space applications, while the dual ARM Cortex R5F pair enables real time determinism for time critical control and safety tasks.
- Programmable logic fabric enables custom hardware pipelines, offload engines, and protocol bridging. This allows designers to move hot paths from software into adaptable logic to reduce latency and power and to increase throughput without changing board hardware.
- Integrated debug visibility via ARM CoreSight across both Cortex A and Cortex R cores, simplifying software bring up, trace, and performance optimization throughout development and field validation.
- Rich peripheral set including DDR memory interfaces, high performance DMA, and PCI Express for board to board and host acceleration use cases. The built in DMA engines reduce CPU overhead and maintain sustained data movement between memories, peripherals, and programmable logic.
- Comprehensive connectivity for embedded and edge systems including CANbus for industrial and automotive networks, EBI EMI for external memory interfaces, Ethernet for networking and TSN style applications, I2C for low speed control, MMC SD SDIO for removable or eMMC storage, SPI for sensor and peripheral attachment, UART USART for console and legacy integration, and USB OTG for device or host roles.
- Scalable performance with CPU frequencies up to 1.4 GHz on the Cortex A72 application cores and up to 600 MHz on the Cortex R5F real time cores, enabling strong single thread control and multicore workloads while keeping determinism where needed.
- High I O density with 500 user I O pins accessible through the 1369 ball package, allowing wide external connectivity, parallel interfaces, and plentiful control lines without resorting to complex expanders.
- Industrial grade junction temperature support from 0°C to 110°C TJ which allows reliable operation across challenging thermal environments when paired with appropriate thermal design, heatsinking, and airflow management.
- Flexible boot and system integration through standard interfaces such as SPI and SD with straightforward software enablement using AMD Xilinx toolchains and reference software platforms for rapid prototyping and production.
XCVE1752-2MSENSVG1369 Quality and Safety Features
- Manufactured by AMD Xilinx with rigorous wafer sort and final test screens to ensure device functionality, continuity, and parametric compliance before shipment.
- RoHS compliant and lead free solder balls per current environmental directives help simplify global compliance and manufacturing approvals.
- ESD sensitive device with handling and storage per JEDEC best practices recommended including grounded work surfaces, ESD safe packaging, and personnel protection.
- Moisture sensitivity and reflow considerations consistent with large FCBGA devices. Follow the MSL rating printed on the dry pack label, observe bake out guidance when required, and use controlled reflow profiles to protect package integrity.
- Full device traceability through lot and date coding on the shipping labels and documentation aids quality systems and field return analysis.
- Thermal reliability supported by published thermal models and guidelines. Use junction temperature monitoring and adequate heatsinking to maintain operation within the 0°C to 110°C TJ range.
- Security, functional safety, and ECC capabilities may be design selectable at the platform level. Consult the official datasheet and technical reference materials for details on memory protection options, isolation strategies, and secure design flows.
XCVE1752-2MSENSVG1369 Compatibility
- Design flow and tools compatibility with AMD Xilinx Vivado and Vitis for hardware and software development, including compilation of programmable logic, device configuration, and embedded software toolchains for ARM cores.
- Operating system and middleware support through common embedded stacks for ARM Cortex A platforms such as Linux and real time operating systems for Cortex R, aiding rapid software integration.
- Board level compatibility with footprints providing the 1369 FCBGA land pattern. Follow the recommended land grid, keep out zones, escape routing, and power decoupling practices from the package user guide.
- Interface level compatibility with standard protocols including CAN, Ethernet, PCIe, USB OTG, SPI, I2C, UART and SDIO, easing integration with commercial transceivers, PHYs, sensors, storage, and host systems.
XCVE1752-2MSENSVG1369 Datasheet PDF
Our website hosts the most authoritative and up to date datasheet for XCVE1752-2MSENSVG1369. For accurate electrical specifications, ball maps, power rail details, timing, and design guidelines, we strongly recommend downloading the datasheet directly from this product page.
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