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Xilinx
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XC7Z030-1FBG676I

In Stock 900 pcs Reference Price(In US Dollars)
1+
$238.80
Manufacturer Part Number:
XC7Z030-1FBG676I
Manufacturer / Brand
Xilinx
Part of Description:
IC SOC CORTEX-A9 KINTEX7 676FBGA
Datasheets:
XC7Z030-1FBG676I(1).pdfXC7Z030-1FBG676I(2).pdfXC7Z030-1FBG676I(3).pdfXC7Z030-1FBG676I(4).pdf
Lead Free Status / RoHS Status:
Lead free / RoHS Compliant
Stock Condition:
New original, 900 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

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Part Number XC7Z030-1FBG676I
Manufacturer / Brand Xilinx
Stock Quantity 900 pcs Stock
Category Integrated Circuits (ICs) > Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 KINTEX7 676FBGA
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
RFQ XC7Z030-1FBG676I Datasheets XC7Z030-1FBG676I Details PDF
XC7Z030-1FBG676I Details PDF for KR.pdf
XC7Z030-1FBG676I Details PDF for IT.pdf
XC7Z030-1FBG676I Details PDF for ES.pdf
XC7Z030-1FBG676I Details PDF for FR.pdf
XC7Z030-1FBG676I Details PDF for DE.pdf
Supplier Device Package 676-FCBGA (27x27)
Speed 667MHz
Series Zynq®-7000
RAM Size 256KB
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Peripherals DMA
Packaging Tray
Package / Case 676-BBGA, FCBGA
Other Names 122-2096
XC7Z030-1FBG676I-ND
Operating Temperature -40°C ~ 100°C (TJ)
Number of I/O 130
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Flash Size -
Detailed Description Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 125K Logic Cells 256KB 667MHz 676-FCBGA (27x27)
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Base Part Number XC7Z030
Architecture MCU, FPGA

Packaging

We offer the highest quality, most economicallypriced static shield packaging available. With 40% light transparency, itallows for easy identification of IC's (integrated circuits) and PCB's (printedcircuit boards). The extremely durable buried metal contruction gives FaradayCage performance needed to effectively shield these componenets against staticcharge.




All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T) and PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


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