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XC2V3000-4BF957I

Manufacturer Part Number:
XC2V3000-4BF957I
Manufacturer / Brand
AMD
Part of Description:
IC FPGA 684 I/O 957FCBGA
Datasheets:
XC2V3000-4BF957I(1).pdfXC2V3000-4BF957I(2).pdfXC2V3000-4BF957I(3).pdfXC2V3000-4BF957I(4).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, 13755 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XC2V3000-4BF957I
Manufacturer / Brand AMD
Stock Quantity 13755 pcs Stock
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description IC FPGA 684 I/O 957FCBGA
Lead Free Status / RoHS Status: RoHS non-compliant
RFQ XC2V3000-4BF957I Datasheets XC2V3000-4BF957I Details PDF
XC2V3000-4BF957I Details PDF for FR.pdf
XC2V3000-4BF957I Details PDF for KR.pdf
XC2V3000-4BF957I Details PDF for IT.pdf
XC2V3000-4BF957I Details PDF for DE.pdf
XC2V3000-4BF957I Details PDF for ES.pdf
Voltage - Supply 1.425V ~ 1.575V
Total RAM Bits 1769472
Supplier Device Package 957-FCBGA (40x40)
Series Virtex®-II
Package / Case 957-BBGA, FCBGA
Package Tray
Operating Temperature -40°C ~ 100°C (TJ)
Number of LABs/CLBs 3584
Number of I/O 684
Number of Gates 3000000
Mounting Type Surface Mount
Base Product Number XC2V3000

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

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Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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XC2V3000-4BF957I Product Details:

The XC2V3000-4BF957I is a high-performance Integrated Circuit (IC) from Xilinx's Virtex-II FPGA (Field Programmable Gate Array) family. This FPGA is designed for embedded applications that require advanced processing capabilities, reconfigurability, and customization.

The XC2V3000-4BF957I features a large array of 3,584 Configurable Logic Blocks (CLBs) and a total of 3,000,000 gates, providing ample resources for implementing complex digital logic and processing algorithms. With its 1,769,472 total RAM bits, the FPGA offers substantial on-chip memory for data storage and processing.

One of the key design challenges addressed by the XC2V3000-4BF957I is the need for flexible and customizable processing solutions in embedded systems. FPGAs, such as this Virtex-II model, allow designers to configure the hardware to their specific requirements, enabling the implementation of custom logic, hardware acceleration, and reconfigurable architectures.

The FPGA operates within a wide temperature range of -40°C to 100°C, making it suitable for a variety of harsh environmental conditions. The device is packaged in a 957-FCBGA (40x40) package, providing a high-density and surface-mountable solution.

The primary advantages of the XC2V3000-4BF957I include its high gate count, abundant on-chip memory, and reconfigurable nature, which make it well-suited for applications such as industrial automation, telecommunications, video and imaging processing, military and aerospace systems, and other embedded applications that require robust and customizable hardware solutions.

The XC2V3000-4BF957I is compatible with a range of development tools and software provided by Xilinx, allowing designers to easily integrate and program the FPGA according to their specific requirements.

Equivalent or alternative models to the XC2V3000-4BF957I from Xilinx's Virtex-II FPGA family include the XC2V1000, XC2V2000, XC2V4000, and XC2V6000, each offering varying gate counts, memory capacities, and I/O configurations to cater to different design needs and performance requirements.

XC2V3000-4BF957I Key Technical Attributes

Manufacturer Part Number XC2V3000-4BF957I

Manufacturer Xilinx

Main Category Integrated Circuits (ICs)

XC2V3000-4BF957I Packing Size

Package/Case 957-BBGA, FCBGA

Supplier Device Package 957-FCBGA (40x40)

Material BGA

Thermal characteristics Operating Temperature -40°C ~ 100°C (TJ)

Electrical properties Voltage - Supply 1.425 V ~ 1.575 V

XC2V3000-4BF957I Application

The XC2V3000-4BF957I is typically utilized in high-performance computing applications, custom logic implementations, digital signal processing, and complex algorithm computations in embedded systems.

XC2V3000-4BF957I Features

This FPGA model XC2V3000-4BF957I from Xilinx’s Virtex-II series features a substantial number of gates, totaling 3,000,000, and is equipped with 1769472 total RAM bits. The device boasts 684 I/O pins that facilitate extensive connectivity options and assembly on various designs. It embeds 3584 LABs/CLBs that intensify its logic computation capabilities. The FPGA also operates over an expansive voltage supply range, from 1.425 V to 1.575 V, ensuring versatility in power-sensitive applications.

XC2V3000-4BF957I Quality and Safety Features

With a Moisture Sensitivity Level (MSL) of 4 (72 Hours), the XC2V3000-4BF957I ensures reliability and performance stability under varied environmental conditions. Compliance to RoHS is specified as non-compliant due to the presence of lead.

XC2V3000-4BF957I Compatibility

The 957-FCBGA (40x40) package of this FPGA makes it compatible with surface mount technology, thus simplifying the design and manufacturing process in boards that support this mounting style.

XC2V3000-4BF957I Datasheet PDF

For comprehensive technical specifications and application guidelines, the datasheet PDF for this model XC2V3000-4BF957I is available on our website. We endorse customers to download the datasheet from the current page for the most accurate and detailed product information.

Quality Distributor

IC-Components is the premium distributor of Xilinx products including XC2V3000-4BF957I. We offer unparalleled service, ensuring that our customers have access to the highest quality and a broad spectrum of components. Visit our website to receive a quote today and secure your components from a trusted source in technology solutions.

Frequently Asked Questions

What are the critical power supply sequencing requirements for the XC2V3000-4BF957I, and what risks arise if VCCINT is applied before or after VCCO rails during power-up?
The XC2V3000-4BF957I requires that VCCINT (1.5V core voltage) must ramp up before or simultaneously with all VCCO I/O banks to prevent latch-up and ensure correct internal state initialization. Applying VCCO before VCCINT can forward-bias internal parasitic diodes, leading to excessive current draw, potential damage, and unreliable configuration. Always follow Xilinx UG002 (Virtex-II Platform FPGA User Guide) power sequencing guidelines using a compliant supervisor IC or sequencing controller.
Can the XC2V3000-4BF957I be safely replaced with a modern Artix-7 or Kintex-7 FPGA in an existing design without significant board modifications?
Direct drop-in replacement of the XC2V3000-4BF957I with Artix-7 or Kintex-7 FPGAs is not feasible due to incompatible pinouts, voltage domains (1.5V core vs. 1.0V core), I/O standards, and packaging differences (FCBGA vs. newer packages). Additionally, the Virtex-II uses SelectMAP and Master Serial configuration modes not fully compatible with 7-series devices. A full schematic and layout review is required; migration typically necessitates PCB re-spin and firmware updates.
How does the moisture sensitivity level (MSL 4) of the XC2V3000-4BF957I impact handling and storage in high-volume manufacturing environments?
With an MSL 4 rating (72-hour floor life), the XC2V3000-4BF957I must be baked at 125°C for 24 hours if exposed to ambient conditions beyond 72 hours after dry packaging is opened. Failure to follow IPC/JEDEC J-STD-033 guidelines risks popcorning during reflow due to moisture expansion. Use dry storage cabinets (<5% RH) and track exposure time rigorously in production logs to avoid field failures.
What are the thermal management implications of operating the XC2V3000-4BF957I near its maximum junction temperature (100°C) in an industrial enclosure with limited airflow?
Operating the XC2V3000-4BF950 near 100°C TJ significantly reduces long-term reliability due to electromigration and accelerated aging. At high ambient temperatures (>70°C), ensure adequate heatsinking and airflow to maintain TJ below 85°C for industrial designs. Use Xilinx’s Power Estimator tool to model dynamic power dissipation and validate thermal resistance (θJA) with empirical testing under worst-case load conditions.
Are there known compatibility issues when interfacing the XC2V3000-4BF957I’s 3.3V LVTTL I/Os with 2.5V logic families without level translation?
Yes. While the XC2V3000-4BF957I’s 3.3V LVTTL inputs are generally 2.5V-tolerant per Xilinx specifications, output high levels (VOH ≈ 2.4V min) may not reliably meet 2.5V input high thresholds (VIH ≥ 2.0V) under low supply or high temperature. For robust operation across PVT (process, voltage, temperature), use a dedicated level translator (e.g., TI SN74AVC8T245) when driving 2.5V inputs from 3.3V VCCO banks.
What configuration methods are supported by the XC2V3000-4BF957I, and which is most reliable for field-upgradable industrial systems?
The XC2V3000-4BF957I supports Master Serial, Slave Serial, Master SelectMAP, and Slave SelectMAP configuration modes. For field-upgradable systems, Slave SelectMAP via an external microcontroller or CPLD offers the best balance of speed, reliability, and in-system reprogrammability. Ensure the configuration clock (CCLK) meets timing specs and that INIT_B and DONE pins are properly pulled up to avoid boot failures.
Can the XC2V3000-4BF957I be used in automotive applications despite being RoHS non-compliant and lacking AEC-Q100 qualification?
No. The XC2V3000-4BF957I is not qualified for automotive use due to its lack of AEC-Q100 certification, extended temperature validation, and lead-containing construction (non-RoHS). Even though its operating range (-40°C to 100°C) overlaps with some automotive grades, mission-critical systems require full qualification, traceability, and PPAP documentation unavailable for this commercial-grade FPGA.
What are the key differences between the XC2V3000-4BF957I and the pin-compatible XC2V4000-4BF957C that affect migration decisions?
The XC2V4000-4BF957C offers higher gate count (4M vs. 3M), more I/Os (720 vs. 684), and additional block RAM, but shares the same 957-FCBGA package and 1.5V core voltage. Migration from XC2V3000-4BF957I is feasible if the design has unused I/O and logic headroom, but power delivery must be re-evaluated due to increased dynamic current. Note that the “-C” suffix indicates commercial grade; ensure temperature requirements align with your application.
How should unused I/O pins on the XC2V3000-4BF957I be terminated to minimize leakage and EMI in a high-noise industrial environment?
Unused I/O pins on the XC2V3000-4BF957I must not be left floating. Configure them as outputs driven low or inputs with pull-down resistors (1kΩ to 10kΩ to ground). This prevents oscillation, reduces static power consumption, and minimizes EMI susceptibility. Refer to Xilinx XAPP452 for best practices on I/O handling in Virtex-II devices, especially in electrically noisy environments.
Is it safe to operate the XC2V3000-4BF957I at the lower end of its voltage supply range (1.425V) under full logic and I/O loading without risking functional failure?
Operating the XC2V3000-4BF957I at 1.425V (minimum VCCINT) under full load increases propagation delay and may violate timing closure, especially at elevated temperatures. While the device is specified to function at this voltage, margin is reduced. Always validate timing simulations at PVT corners and consider derating clock frequencies by 10–15% when running at the lower voltage limit in production systems.

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