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Home > Products > Integrated Circuits (ICs) > Embedded - CPLDs (Complex Programmable Logic Devices) > XC2C256-7VQG100I
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XC2C256-7VQG100I

In Stock 16782 pcs Reference Price(In US Dollars)
1+
$24.9739
Manufacturer Part Number:
XC2C256-7VQG100I
Manufacturer / Brand
AMD
Part of Description:
IC CPLD 256MC 6.7NS 100VQFP
Datasheets:
XC2C256-7VQG100I(1).pdfXC2C256-7VQG100I(2).pdfXC2C256-7VQG100I(3).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 16782 pcs Stock Available.
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Part Number XC2C256-7VQG100I
Manufacturer / Brand AMD
Stock Quantity 16782 pcs Stock
Category Integrated Circuits (ICs) > Embedded - CPLDs (Complex Programmable Logic Devices)
Description IC CPLD 256MC 6.7NS 100VQFP
Lead Free Status / RoHS Status: ROHS3 Compliant
RFQ XC2C256-7VQG100I Datasheets XC2C256-7VQG100I Details PDF
XC2C256-7VQG100I Details PDF for FR.pdf
XC2C256-7VQG100I Details PDF for KR.pdf
XC2C256-7VQG100I Details PDF for IT.pdf
XC2C256-7VQG100I Details PDF for ES.pdf
XC2C256-7VQG100I Details PDF for DE.pdf
Voltage Supply - Internal 1.7V ~ 1.9V
Supplier Device Package 100-VQFP (14x14)
Series CoolRunner II
Programmable Type In System Programmable
Package / Case 100-TQFP
Package Tray
Operating Temperature -40°C ~ 85°C (TA)
Number of Macrocells 256
Number of Logic Elements/Blocks 16
Number of I/O 80
Number of Gates 6000
Mounting Type Surface Mount
Delay Time tpd(1) Max 6.7 ns
Base Product Number XC2C256

Packaging & ESD

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XC2C256-7VQG100I Product Details:

The XC2C256-7VQG100I is a high-performance Complex Programmable Logic Device (CPLD) manufactured by Xilinx. Designed for embedded applications, this CPLD offers a range of advanced features that make it an excellent choice for various electronic projects and system designs.

Functionality-wise, the XC2C256-7VQG100I is a CPLD with 256 macrocells and 16 logic elements/blocks, providing a substantial amount of programmable logic resources. It is capable of in-system programming, allowing for easy design modifications and updates without the need for complex hardware changes.

Addressing design challenges, the XC2C256-7VQG100I features a lead-free, RoHS-compliant design, making it environmentally friendly and suitable for use in a wide range of applications. Its operating temperature range of -40°C to 85°C ensures reliable performance in diverse environmental conditions.

Key specifications of the XC2C256-7VQG100I include a maximum propagation delay (tpd(1)) of 6.7ns, a voltage supply range of 1.7V to 1.9V, and a total of 80 programmable I/O pins. These technical characteristics enable efficient and high-speed data processing, making the CPLD suitable for a variety of applications.

The primary advantages of the XC2C256-7VQG100I include its in-system programmability, which simplifies design changes and updates, and its RoHS-compliant lead-free packaging, which enhances its environmental compatibility. Additionally, the device's wide operating temperature range and robust design make it suitable for use in a wide range of applications, from industrial automation to consumer electronics.

Regarding compatibility, the XC2C256-7VQG100I is part of Xilinx's CoolRunner II series of CPLDs, which are known for their low power consumption and high performance. This CPLD can be used as a replacement or equivalent for other Xilinx CoolRunner II CPLD models, such as the XC2C128, XC2C384, and XC2C512, depending on the specific design requirements and resource needs.

In terms of application areas, the XC2C256-7VQG100I is well-suited for a wide range of embedded systems, including industrial control, telecommunications equipment, automotive electronics, and consumer electronics. Its programmable logic capabilities and versatile I/O options make it a popular choice for designers looking to implement custom logic functions and interface with various peripheral devices.

XC2C256-7VQG100I Key Technical Attributes

Manufacturer Part Number XC2C256-7VQG100I

Manufacturer Xilinx

Main Category Integrated Circuits (ICs)

XC2C256-7VQG100I Packing Size

Type 100-VQFP (14x14)

Material Tray

Size 100-TQFP

Pin Configuration Surface Mount

XC2C256-7VQG100I Application

Used in diverse embedded system applications

Applicable in industries like telecommunications, automotive, and consumer electronics

Suitable for high-speed digital signal processing tasks

XC2C256-7VQG100I Features

The XC2C256-7VQG100I is part of the CoolRunner II series by Xilinx, showcasing advanced CPLD features

It houses 256 macrocells and 16 logic elements/blocks which facilitate complex digital integrations

Offers an internal voltage supply ranging between 1.7 V to 1.9 V, enhancing its reliability in fluctuating power conditions

Capable of operating over a temperature range of -40°C to 85°C, making it suitable for various environmental conditions

Supports in-system programmability which allows for easy updates and debugging

Features a low maximum delay time of 6.7ns, ensuring swift signal processing and response times

Boasts a powerful 6000 logic gates for robust and versatile logic operations

XC2C256-7VQG100I Quality and Safety Features

RoHS Compliant, ensuring adherence to latest environmental standards regarding hazardous materials

Moisture Sensitivity Level (MSL) of 3 (168 Hours), indicating durability in humid conditions

XC2C256-7VQG100I Compatibility

Compatible with standard surface mount technology for simplified integration into various circuit designs

Designed to be compatible with a wide range of standard programming and deployment tools

XC2C256-7VQG100I Datasheet PDF

Our website offers the most authoritative datasheet for XC2C256-7VQG100I

We recommend downloading the datasheet on our product page to ensure you have all the needed specifications and installation guidelines

Quality Distributor

IC-Components is a premium distributor of Xilinx products

We guarantee the best availability and competitive pricing

For reliable purchasing and quotations, visit our website and get a quote today

Frequently Asked Questions

When considering the XC2C256-7VQG100I for a new industrial design, what are the critical power supply considerations, especially regarding the 1.7V to 1.9V internal voltage supply requirement?
The XC2C256-7VQG100I operates with a tight internal voltage supply range of 1.7V to 1.9V. For industrial applications, this necessitates a robust and stable power supply regulator capable of maintaining this voltage within tight tolerances, even under fluctuating load conditions and environmental temperature extremes (-40°C to 85°C). Decoupling capacitors strategically placed near the VCC pins of the XC2C256-7VQG100I are crucial to mitigate power supply noise and ensure reliable operation. Designers must also account for the voltage drop across power traces and ensure the regulator can source the peak current required by the CPLD.
What are the practical implications of the XC2C256-7VQG100I's 80 I/O pins in a high-density system, and how can I effectively manage I/O voltage compatibility with other components?
With 80 I/O pins, the XC2C256-7VQG100I offers significant interface capability. However, in high-density systems, careful I/O planning is essential. Ensure that all external interfaces connected to the XC2C256-7VQG100I operate within its logic voltage levels. While the device's internal supply is 1.7V-1.9V, the I/O standard is generally compatible with lower voltage swings. Designers must verify the specific I/O voltage tolerance and ensure proper level shifting is implemented if connecting to components operating at higher or different voltage rails. Cross-talk between adjacent I/O pins should also be a consideration in high-speed designs.
For engineers looking to migrate from older Xilinx CoolRunner devices, what are the key differences and potential design challenges when replacing a previous CPLD with the XC2C256-7VQG100I, considering its 6.7ns maximum tpd?
Migrating to the XC2C256-7VQG100I from older CoolRunner or similar CPLDs requires careful analysis. The XC2C256-7VQG100I offers a maximum propagation delay (tpd) of 6.7ns, which is generally good for CPLDs. However, designers must verify if this delay meets the timing requirements of their existing critical paths. Pin compatibility with older devices is unlikely given the 100-VQFP package, meaning PCB redesign will be necessary. Furthermore, the "In System Programmable" nature of the XC2C256-7VQG100I simplifies in-field updates but requires consideration of the programming interface and its robustness in the target application. Ensure the design flow and compilation tools are updated for the CoolRunner II family.
In an automotive application operating near the upper temperature limit of the XC2C256-7VQG100I (85°C), what reliability concerns should an engineer be aware of, and how can they be mitigated?
Operating the XC2C256-7VQG100I at its maximum rated temperature of 85°C for extended periods in an automotive environment demands careful consideration of reliability. Increased operating temperatures can accelerate wear-out mechanisms. Designers should ensure adequate thermal management within the system to keep the junction temperature well below the maximum. This includes proper PCB layout for heat dissipation, airflow, and potentially heatsinking if the power dissipation of the XC2C256-7VQG100I is significant for the intended logic. Also, selecting components with high MTBF (Mean Time Between Failures) and ensuring a robust power supply are critical for long-term reliability in such demanding conditions.
How does the "In System Programmable" feature of the XC2C256-7VQG100I impact debug strategies, especially in embedded systems where physical access to the device might be limited?
The "In System Programmable" (ISP) capability of the XC2C256-7VQG100I is a significant advantage for debug. It allows for JTAG or similar in-system programming interfaces to be used not only for loading the configuration but also for on-chip debugging tools provided by Xilinx. This means engineers can often trace internal signals, set breakpoints, and observe logic behavior without needing to physically remove and reprogram the device. This is invaluable in embedded systems where access is difficult. However, ensuring a robust and accessible ISP port on the target PCB is paramount for effective debugging and in-field updates of the XC2C256-7VQG100I.
When facing a design constraint where a specific brand's older CPLD (e.g., a Lattice GAL22V10) needs replacement, what are the primary trade-offs and limitations when considering the XC2C256-7VQG100I as an alternative?
Replacing an older device like a Lattice GAL22V10 with the XC2C256-7VQG100I involves several trade-offs. The XC2C256-7VQG100I is a much more complex device with 256 macrocells and 6000 gates compared to the GAL22V10's 22 macrocells. This offers significantly more logic capacity but also implies a steeper learning curve for the design tools and potentially a more complex configuration. The power consumption profile will likely differ. Crucially, the XC2C256-7VQG100I operates at a lower internal voltage (1.7V-1.9V) than older technologies, requiring power supply redesign. Pin compatibility is also a non-starter, necessitating a PCB layout change for the XC2C256-7VQG100I.
For designers working on high-speed digital interfaces, how does the XC2C256-7VQG100I's maximum tpd of 6.7ns fit into critical timing budgets, and what strategies can be employed to maximize its performance?
A maximum propagation delay (tpd) of 6.7ns for the XC2C256-7VQG100I is a key parameter for high-speed interface design. Engineers must ensure that all critical timing paths within their design, including setup and hold times, are met considering this delay. When maximizing performance, careful floorplanning and placement of logic within the CPLD are important. Minimizing routing congestion within the XC2C256-7VQG100I can help achieve better-than-worst-case timing. Furthermore, understanding the I/O delays and how they interact with the internal logic is crucial. If 6.7ns is borderline, designers may need to consider faster devices or re-evaluate the system architecture.
What are the potential integration challenges when using the XC2C256-7VQG100I in a system with microcontrollers that communicate via serial protocols (e.g., SPI, I2C), and how can these be addressed?
Integrating the XC2C256-7VQG100I with microcontrollers using serial protocols like SPI or I2C involves ensuring compatible I/O voltage levels and correct timing. While the XC2C256-7VQG100I has 80 I/O pins, verifying the specific voltage tolerance of these pins against the microcontroller's output swing is critical. The CPLD's internal clocking and logic speed should be sufficient to keep up with typical SPI/I2C clock rates, but complex protocol handling might push the XC2C256-7VQG100I to its limits. Designers should ensure the microcontroller's SPI/I2C peripheral is configured appropriately, and that the CPLD implementation accurately reflects the protocol timing, especially for clocking and data setup/hold requirements.
Considering the XC2C256-7VQG100I's RoHS compliance, what are the implications for board assembly and rework processes in a high-volume manufacturing environment?
The XC2C256-7VQG100I's RoHS compliance (Lead-free / RoHS Compliant) means it uses lead-free solder materials. This has implications for board assembly, particularly with reflow soldering profiles. Lead-free solder typically requires higher peak reflow temperatures compared to tin-lead solder. Engineers must ensure their PCB assembly process is compatible with these higher temperatures to avoid damaging the XC2C256-7VQG100I or other temperature-sensitive components on the board. Rework processes also need to be adjusted to accommodate lead-free solder. Proper flux selection and soldering iron tip temperatures are essential for successful rework if needed.
For applications requiring extended operational life and high reliability, what are the implications of the XC2C256-7VQG100I's Moisture Sensitivity Level (MSL) 3 rating?
A Moisture Sensitivity Level (MSL) 3 rating for the XC2C256-7VQG100I indicates that the component is susceptible to moisture absorption and must be handled appropriately to prevent damage during soldering. MSL 3 means the component can be exposed to ambient conditions (typically below 30°C and 60% RH) for a maximum of 168 hours before it needs to be baked. If this exposure limit is exceeded, the XC2C256-7VQG100I should be baked according to the manufacturer's recommendations to drive out absorbed moisture. Failure to do so can lead to "popcorning" or delamination during reflow soldering, compromising the reliability of the component and the final product. Proper storage and handling procedures are essential.

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