The XA2C256-7VQG100C is a specialized integrated circuit manufactured by Xilina, designed to provide advanced programmable logic solutions for complex electronic systems. This TQFP (Thin Quad Flat Package) device offers high-density integration and flexible performance capabilities for sophisticated electronic design applications.
The circuit is part of Xilina's programmable logic device family, featuring a compact 100-pin TQFP encapsulation that enables efficient space utilization in dense electronic designs. Its specialized nature makes it particularly suitable for applications requiring complex logic processing, signal management, and system-level integration across various technological domains.
Key characteristics include its high-density configuration, which allows for sophisticated signal routing and processing within a compact footprint. The device is engineered to address design challenges related to signal complexity, system miniaturization, and performance optimization. Its versatile architecture supports multiple electronic design requirements, making it ideal for telecommunications, industrial control, automotive electronics, and advanced computing systems.
The TQFP packaging provides excellent thermal management and signal integrity, ensuring reliable performance across diverse operating environments. This design enables seamless integration into complex electronic systems while maintaining robust operational parameters.
Compatible with advanced electronic design automation (EDA) tools, the XA2C256-7VQG100C supports comprehensive programming and configuration options. Its specialized integrated circuit classification indicates advanced functionality beyond standard logic components.
Potential equivalent or alternative models might include similar programmable logic devices from manufacturers like Xilinx, Altera (Intel), and Lattice Semiconductor, though specific model comparisons would require detailed technical evaluation.
The component's availability in a quantity of 273 units suggests it is suitable for both prototype development and moderate-scale production environments, offering engineers and designers a flexible and reliable solution for complex electronic system implementations.
XA2C256-7VQG100C Key Technical Attributes
XA2C256-7VQG100C
True Quantity: 273
XA2C256-7VQG100C Packing Size
This product adopts the TQFP (Thin Quad Flat Package) form, ensuring a compact and space-saving footprint ideal for modern PCB layouts. The encapsulation code 1548 further classifies its dimensional identity, which is designed for ease of mounting and solid thermal dissipation. This package typically provides a sufficient number of pins for versatile connectivity, ensuring efficient electrical performance with optimal heat management, and suits high-density surface mount applications.
XA2C256-7VQG100C Application
The XA2C256-7VQG100C is primarily used in embedded system applications, digital logic integration, and system prototypes. Its specialized nature makes it suitable for designs requiring programmable logic solutions, rapid prototyping, automotive electronics, and communication equipment. The part is ideal for implementation in both consumer and industrial electronics, meeting the needs of advanced digital circuits with reliability and speed.
XA2C256-7VQG100C Features
The XA2C256-7VQG100C showcases high integration capabilities, offering a programmable logic framework within a single compact package. It is tailored to provide robust signal processing, design flexibility, and low-static power consumption—all essential traits for modern embedded solutions. The device emphasizes fast switching speeds, facilitating rapid data throughput and logic operations. Enhanced ESD protection and programmable input/output standards ensure safe deployment across a range of environments and applications. The TQFP encapsulation also provides robust mechanical and thermal stability, making the component suitable for dense board designs and multilevel circuit boards.
XA2C256-7VQG100C Quality and Safety Features
This integrated circuit adheres to strict quality and reliability standards, including high resilience to static discharge, temperature fluctuations, and power surges. Manufactured by XILINA, each unit undergoes rigorous factory testing processes, ensuring compliance with international safety and performance standards. The TQFP package further guarantees excellent thermal dissipation, decreasing the risk of heat-induced failure and increasing product longevity.
XA2C256-7VQG100C Compatibility
The XA2C256-7VQG100C is engineered for maximum interoperability with standard digital platforms and supporting toolchains established by the XILINA brand. It is compatible with a wide array of development environments and logic design tools, allowing seamless programming and integration into both new and legacy systems that require TQFP-packaged programmable logic devices.
XA2C256-7VQG100C Datasheet PDF
Our website provides the most authoritative and up-to-date datasheet for the XA2C256-7VQG100C. We strongly recommend downloading the datasheet directly from this page for comprehensive reference and technical design assurance.
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