Choose your country or region.

EnglishFrançaispolskiSlovenija한국의DeutschSvenskaSlovenskáMagyarországItaliaहिंदीрусскийTiếng ViệtSuomiespañolKongeriketPortuguêsภาษาไทยБългарски езикromânescČeštinaGaeilgeעִבְרִיתالعربيةPilipinoDanskMelayuIndonesiaHrvatskaفارسیNederlandTürk diliΕλλάδαRepublika e ShqipërisëአማርኛAzərbaycanEesti VabariikEuskeraБеларусьíslenskaBosnaAfrikaansIsiXhosaisiZuluCambodiaსაქართველოҚазақшаAyitiHausaКыргыз тилиGalegoCatalàCorsaKurdîLatviešuພາສາລາວlietuviųLëtzebuergeschmalaɡasʲМакедонскиMaoriМонголулсবাংলা ভাষারမြန်မာनेपालीپښتوChicheŵaCрпскиSesothoසිංහලKiswahiliТоҷикӣاردوУкраїнаO'zbekગુજરાતીಕನ್ನಡkannaḍaதமிழ் மொழி繁体中文
Home > Products > Integrated Circuits (ICs) > Embedded - Microcontrollers > XLF212-256-FB236-C20
XMOS
XEF216-512-FB236-C20.jpg ImageView larger image
Image may be representation.
See specs for product details.

XLF212-256-FB236-C20

In Stock 3028 pcs Reference Price(In US Dollars)
1+
$32.9683
168+
$13.1557
504+
$12.7164
1008+
$12.4981
Manufacturer Part Number:
XLF212-256-FB236-C20
Manufacturer / Brand
XMOS
Part of Description:
IC MCU 32BIT 2MB FLASH 236FBGA
Datasheets:
XLF212-256-FB236-C20(1).pdfXLF212-256-FB236-C20(2).pdfXLF212-256-FB236-C20(3).pdfXLF212-256-FB236-C20(4).pdfXLF212-256-FB236-C20(5).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 3028 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number XLF212-256-FB236-C20
Manufacturer / Brand XMOS
Stock Quantity 3028 pcs Stock
Category Integrated Circuits (ICs) > Embedded - Microcontrollers
Description IC MCU 32BIT 2MB FLASH 236FBGA
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply (Vcc/Vdd) 0.95V ~ 3.6V
Supplier Device Package 236-FBGA (10x10)
Speed 2000MIPS
Series XLF
RAM Size 256K x 8
Program Memory Type FLASH
Program Memory Size 2MB (2M x 8)
Peripherals -
Package / Case 236-LFBGA
Package Tray
Oscillator Type External
Operating Temperature 0°C ~ 70°C (TA)
Number of I/O 128
Mounting Type Surface Mount
EEPROM Size -
Data Converters -
Core Size 32-Bit 12-Core
Core Processor XCore
Connectivity -
Base Product Number XLF212

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the critical power supply sequencing requirements when integrating the XLF212-256-FB236-C20 into a multi-rail embedded system?
The XLF212-256-FB236-C20 supports a wide Vcc/Vdd range of 0.95V to 3.6V, but proper power-up sequencing is essential to avoid latch-up or I/O contention. When used in systems with multiple voltage domains, ensure that the core voltage stabilizes before applying I/O voltages to prevent reverse biasing of internal protection diodes. A soft-start controller or voltage supervisor with sequenced enable signals is recommended for designs where power rails are derived from separate regulators.
Can the XLF212-256-FB236-C20 operate reliably in industrial temperature environments beyond its specified 0°C to 70°C range?
The XLF212-256-FB236-C20 is rated for commercial temperature operation (0°C to 70°C TA), and performance outside this range is not guaranteed. For industrial applications requiring -40°C to 85°C operation, consider derating clock frequencies or selecting a qualified industrial-grade alternative, as timing margins, flash endurance, and oscillator stability may degrade significantly at temperature extremes.
What are the implications of using an external oscillator with the XLF212-256-FB236-C20, and how should clock signal integrity be managed in high-noise environments?
Since the XLF212-256-FB236-C20 requires an external oscillator, careful attention must be paid to clock signal integrity. Use a low-jitter, CMOS-compatible oscillator with tight frequency tolerance (±50 ppm or better for timing-critical applications). Route the clock trace as a controlled impedance signal with minimal length, avoid crossing split planes, and terminate appropriately to reduce reflections. In electrically noisy environments, consider using differential clocking or shielding to maintain timing accuracy.
Is the XLF212-256-FB236-C20 suitable for real-time motor control applications requiring deterministic multi-core task scheduling?
Yes, the XLF212-256-FB236-C20, with its 12-core XCore architecture and 2000 MIPS performance, is well-suited for deterministic real-time control tasks such as motor control. Its fine-grained threading model allows precise timing control across cores, enabling concurrent PWM generation, encoder feedback processing, and communication handling. However, ensure firmware implements strict thread scheduling and avoids shared resource contention to maintain timing predictability.
What design considerations apply when replacing the XLF212-256-FB236-C20 with the XLF212-256-FB236-C20A variant?
The XLF212-256-FB236-C20A is a direct functional and pin-compatible successor to the XLF212-256-FB236-C20, typically offering improved process reliability or minor errata fixes. However, verify the latest revision of the datasheet for any changes in power consumption, startup timing, or flash programming algorithms. Firmware compatibility is generally maintained, but revalidation of timing-critical code is advised, especially in applications sensitive to instruction cycle accuracy.
How should I/O voltage levels be managed when interfacing the XLF212-256-FB236-C20 with 5V logic devices?
The XLF212-256-FB236-C20 I/O pins are not 5V-tolerant when Vcc/Vdd is below 3.6V. Direct connection to 5V signals may damage the device or cause unreliable operation. Use level-shifting buffers or voltage translators (e.g., TXB0108 or discrete MOSFET-based circuits) to interface with 5V logic. Ensure that input signals do not exceed Vdd + 0.3V under any condition, as specified in the absolute maximum ratings.
What are the flash memory endurance and data retention characteristics of the XLF212-256-FB236-C20 under continuous firmware update cycles?
The embedded 2MB flash in the XLF212-256-FB236-C20 typically supports 10,000 program/erase cycles per sector with a data retention of 20 years at 25°C. For applications involving frequent firmware updates, implement wear-leveling in software or reserve a secondary boot partition to minimize write cycles on any single block. Monitor cumulative write activity and consider external non-volatile storage for logging or configuration data.
Can the XLF212-256-FB236-C20 be used in safety-critical systems requiring functional safety certification (e.g., ISO 13849 or IEC 61508)?
The XLF212-256-FB236-C20 is not inherently designed or certified for functional safety applications. While its multi-core architecture can support redundancy and diagnostic mechanisms, the device lacks built-in safety features such as lockstep cores, ECC on memories, or certified failure mode documentation. For safety-critical designs, additional external monitoring, fault detection circuitry, and rigorous software validation are required to meet certification targets.
What are the layout and decoupling requirements for the 236-FBGA package of the XLF212-256-FB236-C20 to ensure stable operation at 2000 MIPS?
The 236-FBGA package of the XLF212-256-FB236-C20 demands careful PCB layout: use a solid ground plane beneath the device, place decoupling capacitors (100nF ceramic) as close as possible to each Vdd pin, and include bulk capacitance (10µF) near the power entry point. Ensure symmetrical power distribution and minimize loop areas for high-frequency return currents. Follow XMOS-recommended stack-up and via-in-pad techniques to manage thermal and electrical performance.
How does the 256KB RAM size of the XLF212-256-FB236-C20 impact application development for complex communication protocols like Ethernet AVB or USB Audio?
The 256KB of on-chip RAM in the XLF212-256-FB236-C20 is sufficient for moderate implementations of protocols like USB Audio or Ethernet AVB, but memory partitioning must be carefully managed. Allocate dedicated buffers for isochronous data streams and avoid dynamic memory allocation during real-time operation. For high-channel-count or low-latency applications, optimize data flow using double-buffering and direct memory access (DMA)-like patterns via thread-to-thread communication channels inherent to the XCore architecture.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


XLF212-256-FB236-C20

XLF212-256-FB236-C20

XMOS

IC MCU 32BIT 2MB FLASH 236FBGA

In Stock: 3028

SUBMIT RFQ