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Home > Products > Integrated Circuits (ICs) > Memory - Memory > W9825G6JB-6
Winbond Electronics
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W9825G6JB-6

In Stock 6569 pcs Reference Price(In US Dollars)
1+
$40.1196
Manufacturer Part Number:
W9825G6JB-6
Manufacturer / Brand
Winbond Electronics
Part of Description:
IC DRAM 256MBIT PAR 54TFBGA
Datasheets:
W9825G6JB-6(1).pdfW9825G6JB-6(2).pdfW9825G6JB-6(3).pdfW9825G6JB-6(4).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 6569 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number W9825G6JB-6
Manufacturer / Brand Winbond Electronics
Stock Quantity 6569 pcs Stock
Category Integrated Circuits (ICs) > Memory - Memory
Description IC DRAM 256MBIT PAR 54TFBGA
Lead Free Status / RoHS Status: ROHS3 Compliant
RFQ W9825G6JB-6 Datasheets W9825G6JB-6 Details PDF
W9825G6JB-6 Details PDF for FR.pdf
W9825G6JB-6 Details PDF for KR.pdf
W9825G6JB-6 Details PDF for ES.pdf
W9825G6JB-6 Details PDF for DE.pdf
W9825G6JB-6 Details PDF for IT.pdf
Write Cycle Time - Word, Page -
Voltage - Supply 3V ~ 3.6V
Technology SDRAM
Supplier Device Package 54-TFBGA (8x8)
Series -
Package / Case 54-TFBGA
Package Tray
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Memory Type Volatile
Memory Size 256Mbit
Memory Organization 16M x 16
Memory Interface Parallel
Memory Format DRAM
Clock Frequency 166 MHz
Base Product Number W9825G6
Access Time 5 ns

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

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Global Shipment by DHL/FedEx/TNT/UPS

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2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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W9825G6JB-6 Product Details:

The Winbond Electronics Corporation W9825G6JB-6 is a high-performance 256Mb Synchronous Dynamic Random Access Memory (SDRAM) integrated circuit designed for advanced electronic applications requiring robust and efficient memory solutions. This lead-free, RoHS-compliant memory chip offers exceptional performance with a 166MHz clock frequency and an impressive 5ns access time, making it ideal for high-speed computing and embedded system designs.

Engineered with a compact 54-TFBGA (8x8) package, the memory IC is optimized for surface mount applications, providing engineers with a space-efficient and reliable memory solution. The chip operates within a temperature range of 0°C to 70°C, ensuring consistent performance across various environmental conditions. Powered by a 3V to 3.6V supply voltage, it delivers stable and energy-efficient memory performance.

The parallel memory interface supports a 16M x 16 configuration, enabling versatile data handling and integration into complex electronic systems. Its volatile DRAM technology makes it suitable for applications requiring fast, temporary data storage and quick read/write capabilities. The chip's design addresses critical challenges in modern electronics, such as miniaturization, power efficiency, and high-speed data processing.

Primary advantages include its compact form factor, low power consumption, high-speed operation, and compatibility with a wide range of electronic devices. The memory IC is particularly well-suited for telecommunications equipment, industrial controls, automotive electronics, consumer devices, and embedded computing systems.

Equivalent or alternative models that offer similar specifications include:

1. Micron MT48LC16M16A2 MT48LC16M16A2 MT48LC16M16A2 MICRON MT48LC16M16A2 MICRON TSOP54 16980

2. Alliance Memory AS4C16M16SA

3. ISSI IS42S16400J IS42S16400J IS42S16400J ISSI 1141 29529

4. Cypress CY7C1020G30

5. GSI Technology GS816036T

With its robust design and comprehensive feature set, the Winbond W9825G6JB-6 represents a reliable and high-performance memory solution for demanding technological applications.

W9825G6JB-6 Image
W9825G6JB-6 (1)

W9825G6JB-6 Key Technical Attributes

SDRAM Memory IC 256Mb (16M x 16)

Parallel Interface

Clock Frequency 166MHz

Access Time 5ns

W9825G6JB-6 Packing Size

Type: 54-TFBGA (8x8)

Material: FBGA

Size: 54-TFBGA

Pin Configuration: 54-Pin

Thermal Characteristics: Operating Temperature 0°C ~ 70°C (TA)

Electrical Properties: Voltage - Supply 3 V ~ 3.6 V

W9825G6JB-6 Application

Designed for high speed computing

Suitable for applications requiring large, fast memory such as gaming, graphic processing, and server use

W9825G6JB-6 Features

256Mb memory capacity arranged as 16 million words of 16 bits each

Supports a clock frequency of up to 166MHz for rapid data access

5ns fast access time ensures swift retrieval and storage of information

Operates over a standard temperature range from 0°C to 70°C, making it suitable for mainstream electronic devices

Smooth, parallel memory interface with standard logic levels for easy integration into circuit designs

Follows standard DRAM memory formatting, allowing for extensive compatibility with computing hardware and software

W9825G6JB-6 Quality and Safety Features

RoHS Compliant ensuring safety from hazardous substances

Moisture Sensitivity Level (MSL) 3, providing resilience to moisture exposure over time

Packaged in standard 54-TFBGA using FBGA for robustness against mechanical stress

W9825G6JB-6 Compatibility

Compatible with devices requiring a voltage supply of between 3 V and 3.6 V

Can be integrated into systems that support 54-TFBGA packing and conform to parallel memory interface standards

W9825G6JB-6 Datasheet PDF

For exact specifications, the most authoritative data sheet is available on our website. We highly recommend downloading it for a comprehensive understanding of the W9825G6JB-6 feature set.

Quality Distributor

IC-Components is a premium distributor of Winbond Electronics Corporation products. We ensure the highest quality and authenticity of the parts supplied. For the best price and quick delivery of the W9825G6JB-6, make sure to get your quote directly from our website today. Trust IC-Components for reliable and efficient service in electronic component distribution.

Frequently Asked Questions

What are the implications of using the W9825G6JB-6 SDRAM in an automotive application given its 0°C to 70°C operating temperature range?
The W9825G6JB-6 SDRAM has an operating temperature range of 0°C to 70°C (TA). This specification means it is not designed for extended operation in harsh automotive environments that may experience temperatures below 0°C or significantly above 70°C. For such applications, industrial or automotive-grade SDRAM with wider temperature ranges (-40°C to +85°C or similar) would be required to ensure reliability and prevent performance degradation or failure. The W9825G6JB-6 is more suitable for consumer electronics or less demanding industrial embedded systems.
I'm looking to replace a Micron MT48LC4M16A2TG-75 with the Winbond W9825G6JB-6. What are the key electrical and pinout considerations I need to address for a successful design-in?
Replacing a Micron MT48LC4M16A2TG-75 with the W9825G6JB-6 involves several key considerations. While both are 256Mb SDRAMs, the W9825G6JB-6 operates at a higher clock frequency (166MHz) compared to the MT48LC4M16A2TG-75 (which is typically rated for 75MHz, though available in other speeds). Crucially, the W9825G6JB-6 has a 5ns access time, while the MT48LC4M16A2TG-75 has a 7.5ns access time. You must verify that your memory controller can support the W9825G6JB-6's 166MHz clock speed and 5ns access time. Also, confirm that the pinout of the 54-TFBGA (8x8) package for the W9825G6JB-6 is compatible with your existing PCB layout, or be prepared to redesign your footprint. Power supply requirements (3V-3.6V for W9825G6JB-6) should also be matched.
What are the practical risks of operating the W9825G6JB-6 SDRAM close to its 3.6V maximum supply voltage in a high-power industrial system?
Operating the W9825G6JB-6 SDRAM close to its 3.6V maximum supply voltage in a high-power industrial system carries risks. Sustained operation at the upper voltage limit can increase power dissipation within the IC, leading to higher junction temperatures. This can accelerate electromigration and dielectric breakdown, potentially reducing the long-term reliability and lifespan of the W9825G6JB-6. It's generally advisable to operate critical components like memory within their recommended nominal voltage range (e.g., 3.3V ± 0.3V) to maximize reliability, especially in systems that operate continuously for extended periods or under demanding thermal conditions. Ensure adequate thermal management around the W9825G6JB-6 package.
How does the 16M x 16 memory organization of the W9825G6JB-6 affect system design compared to a 32M x 8 configuration, particularly regarding bus width and latency in embedded systems?
The 16M x 16 memory organization of the W9825G6JB-6 means it presents a 16-bit wide data bus. This is generally more efficient for systems with a 16-bit or wider data path, as it allows for larger data transfers per clock cycle, potentially reducing the number of clock cycles required for a given data volume. Compared to a 32M x 8 configuration (which would offer 8 bits per access), the W9825G6JB-6 can achieve higher effective bandwidth when the system architecture can utilize the full 16-bit bus. However, if your system's data path is strictly 8-bit, you might need to perform two sequential 8-bit accesses or use a buffer, which could offset some of the performance advantages of the W9825G6JB-6's wider internal organization.
I am considering the W9825G6JB-6 for a new product, but I'm concerned about potential obsolescence. What are Winbond's typical product lifecycle management practices for SDRAMs like this, and are there known alternative part numbers or migration paths if it becomes unavailable?
Winbond Electronics Corporation generally provides reasonable product life cycles for their standard components. However, for long-term industrial projects, it's crucial to engage with Winbond or their authorized distributors for official Product Change Notification (PCN) and End-of-Life (EOL) statements regarding the W9825G6JB-6. While the W9825G6JB-6 is a standard 256Mb SDRAM, specific speed grades and packages can be discontinued. If obsolescence becomes a concern, you should investigate other Winbond SDRAMs with similar specifications or explore comparable parts from other manufacturers like Micron, Samsung, or Hynix. Be mindful of differences in electrical characteristics, timing, and package specifications when selecting an alternative to the W9825G6JB-6.
What are the specific implications of the W9825G6JB-6's 5ns access time and 166MHz clock for achieving maximum data throughput in a real-time video processing application?
The W9825G6JB-6's 5ns access time and 166MHz clock frequency are key parameters for maximizing data throughput in real-time applications. At 166MHz, the clock period is approximately 6.02ns (1/166MHz). This means the memory can perform a new read operation every clock cycle. The 5ns access time ensures that data is available within that cycle for sequential reads. For optimal throughput, your memory controller must be carefully designed to issue read commands at the earliest possible moment and to read data immediately upon availability from the W9825G6JB-6. Any delays or inefficiencies in the controller's command issuance or data capture logic will reduce the actual throughput achieved below theoretical maximums.
Can the W9825G6JB-6 SDRAM be reliably used in a system powered by a single 3.3V rail with typical voltage ripple and noise, or would a more tightly regulated supply be necessary for stable operation?
The W9825G6JB-6 SDRAM is designed to operate within a voltage supply range of 3V to 3.6V. While it can tolerate some voltage ripple and noise, excessive variations can impact its stability and lead to data corruption or read/write errors. For robust operation, particularly in industrial environments where power supply noise can be more prevalent, it is highly recommended to use a well-regulated 3.3V power supply with minimal ripple and transient response. Implementing proper decoupling capacitors (both ceramic and electrolytic) close to the W9825G6JB-6 power pins is essential to filter out high-frequency noise and stabilize the supply voltage. If your 3.3V rail has significant ripple, you might experience intermittent issues with the W9825G6JB-6.
What are the potential challenges when interfacing the W9825G6JB-6, which uses a parallel memory interface, with modern FPGAs or microcontrollers that may offer high-speed serial memory interfaces?
Interfacing the W9825G6JB-6, with its parallel memory interface, with modern FPGAs or microcontrollers that primarily support high-speed serial interfaces (like DDR3/DDR4, LPDDR, or QSPI) presents challenges. You will need an FPGA or microcontroller that explicitly supports a parallel SDRAM interface, or you will require external logic to bridge the gap. This often involves using specific IP cores within an FPGA for the SDRAM controller. The number of pins required for a parallel interface (address, data, control signals) is significantly higher than for serial interfaces, potentially impacting PCB routing complexity and board real estate. Furthermore, achieving the W9825G6JB-6's maximum 166MHz speed with a parallel interface can be more challenging due to signal integrity issues over longer traces compared to controlled-impedance serial links.
Considering the W9825G6JB-6 is rated for 0°C to 70°C, what are the implications for its long-term reliability if used in an enclosure with poor ventilation that consistently reaches 60°C to 65°C ambient?
Using the W9825G6JB-6 in an enclosure that consistently operates between 60°C and 65°C ambient temperature, even though within its rated range, will negatively impact its long-term reliability. Elevated temperatures accelerate the degradation mechanisms within semiconductor devices, such as electromigration and dielectric breakdown. This can lead to a reduced Mean Time Between Failures (MTBF) and a shorter overall operational lifespan for the W9825G6JB-6. To mitigate this, ensuring adequate ventilation, using heatsinks on other heat-generating components, or considering active cooling solutions for the enclosure would be prudent for applications requiring extended operational life in such conditions.
If I need to migrate from a 256Mb SDRAM to a higher density (e.g., 512Mb or 1Gb) while keeping a similar interface and operating voltage, what considerations should I have when looking for alternatives to the W9825G6JB-6?
When migrating from the W9825G6JB-6 to a higher density SDRAM (e.g., 512Mb or 1Gb) while maintaining a similar interface and operating voltage (3V-3.6V), you should prioritize parts that adhere to the JEDEC standards for SDRAM. Look for components that offer a comparable clock frequency (or higher, if your controller supports it) and access time. The main change will be in the organization (e.g., 32M x 16 for 512Mb, or 64M x 16 for 1Gb). Crucially, verify that the pinout of the higher-density part is compatible with your PCB, or be prepared for a footprint redesign. You must also confirm that your existing memory controller logic and firmware are capable of addressing the increased memory map and managing the higher density device correctly. Always consult the datasheets of potential replacement parts to ensure feature parity and compatibility with the W9825G6JB-6's operating parameters.

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IC DRAM 256MBIT PAR 54TFBGA

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