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W972GG8KB25I

Manufacturer Part Number:
W972GG8KB25I
Manufacturer / Brand
Winbond Electronics
Part of Description:
IC DRAM 2GBIT PARALLEL 84WBGA
Datasheets:
W972GG8KB25I(1).pdfW972GG8KB25I(2).pdfW972GG8KB25I(3).pdfW972GG8KB25I(4).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 5505 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number W972GG8KB25I
Manufacturer / Brand Winbond Electronics
Stock Quantity 5505 pcs Stock
Category Integrated Circuits (ICs) > Memory - Memory
Description IC DRAM 2GBIT PARALLEL 84WBGA
Lead Free Status / RoHS Status: ROHS3 Compliant
Write Cycle Time - Word, Page 15ns
Voltage - Supply 1.7V ~ 1.9V
Technology SDRAM - DDR2
Supplier Device Package 84-WBGA (8x12.5)
Series -
Package / Case 84-TFBGA
Package Tray
Operating Temperature -40°C ~ 95°C (TC)
Mounting Type Surface Mount
Memory Type Volatile
Memory Size 2Gbit
Memory Organization 256M x 8
Memory Interface Parallel
Memory Format DRAM
Clock Frequency 400 MHz
Base Product Number W972GG8
Access Time 400 ps

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the power supply constraints when integrating the W972GG8KB25I into my design?
The W972GG8KB25I operates within a supply voltage range of 1.7V to 1.9V. It’s crucial to ensure that your power supply maintains stability within this range to prevent potential damage or instability in the memory functionality. Additionally, consider the input voltage ripple and transient response of your power supply to avoid issues during peak current demands.
Can I use the W972GG8KB25I in an application requiring operation beyond -40°C to 95°C?
The W972GG8KB25I is rated for an operating temperature range of -40°C to 95°C. If your application requires operation outside this range, it may lead to reliability issues or failure. Ensure that your chosen components meet the necessary thermal qualifications for your specific application environment.
What should I consider for clock configuration when using the W972GG8KB25I?
The W972GG8KB25I has a clock frequency of 400 MHz. When integrating this IC, ensure your system’s clock circuitry can support this frequency without introducing skew or jitter, which can impact data integrity. Additionally, verify that all timing relationships specified in the datasheet are adhered to for proper operation.
If I need to replace the W972GG8KB25I, what alternative components should I consider?
When looking for alternatives to the W972GG8KB25I, consider components with similar voltage, speed ratings, and packaging. For example, other DDR2 SDRAM parts with close specifications such as W971GG6KB-25 may be suitable, but pay attention to differences in access times and memory organization, as they may affect system performance.
How does the write cycle time of the W972GG8KB25I impact its performance in high-speed applications?
The W972GG8KB25I has a write cycle time of 15ns, which may limit performance in applications requiring rapid data writes. If your application demands higher write throughput, consider optimizing your controller configuration for burst writing or evaluating other memory solutions with lower write times that match your speed requirements.
What are the implications of using the W972GG8KB25I in a high-reliability industrial application?
In high-reliability applications, you must consider the endurance and temperature ratings of the W972GG8KB25I. Make sure to design for adequate thermal management and account for potential data retention issues in extreme conditions. Also, employ error detection and correction mechanisms to mitigate the effects of any transient faults that could affect data integrity.
Are there any packaging considerations I should keep in mind when designing with the W972GG8KB25I?
The W972GG8KB25I comes in an 84-WBGA (8x12.5) package, which requires specific PCB layout techniques for optimal electrical performance and heat dissipation. Ensure you follow the recommended land pattern dimensions and consider the via-in-pad design for effective thermal management. Additionally, manage the distance between the IC and other components to limit inductive coupling and signal integrity issues.
How can I ensure compatibility with the memory interface when integrating the W972GG8KB25I?
The W972GG8KB25I features a parallel memory interface. Ensure your microcontroller or FPGA is capable of handling a parallel communication scheme. This includes having the appropriate number of I/O pins and supporting the necessary data protocol, as well as considering timing cohesion between the device and the controller to facilitate error-free data transfer.
What are the consequences of not adhering to the specified access time of 400 ps for the W972GG8KB25I?
Failing to adhere to the 400 ps access time specification of the W972GG8KB25I can lead to timing violations, resulting in data corruption or system instability. It is essential to design your timing closure with safe margins to avoid any setup or hold time issues that could disrupt the reliable operation of your system.
In what scenarios would the memory organization of the W972GG8KB25I limit its application?
The memory organization of the W972GG8KB25I is 256M x 8. This organization may limit its applicability in systems that require byte or word-addressable access for larger data sizes. For applications with strict data throughput or architecture-specific requirements, assess whether the memory layout aligns with the needs to avoid bottlenecks or inefficient data handling.

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