Choose your country or region.

Winbond Electronics
W972GG6JB25I ImageView larger image
Image may be representation.
See specs for product details.

W972GG6JB25I

Manufacturer Part Number:
W972GG6JB25I
Manufacturer / Brand
Winbond Electronics
Part of Description:
IC DRAM 2GBIT PARALLEL 84WBGA
Datasheets:
W972GG6JB25I(1).pdfW972GG6JB25I(2).pdfW972GG6JB25I(3).pdfW972GG6JB25I(4).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 11155 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number W972GG6JB25I
Manufacturer / Brand Winbond Electronics
Stock Quantity 11155 pcs Stock
Category Integrated Circuits (ICs) > Memory - Memory
Description IC DRAM 2GBIT PARALLEL 84WBGA
Lead Free Status / RoHS Status: ROHS3 Compliant
Write Cycle Time - Word, Page 15ns
Voltage - Supply 1.7V ~ 1.9V
Technology SDRAM - DDR2
Supplier Device Package 84-WBGA (11x13)
Series -
Package / Case 84-TFBGA
Package Tray
Operating Temperature -40°C ~ 95°C (TC)
Mounting Type Surface Mount
Memory Type Volatile
Memory Size 2Gbit
Memory Organization 128M x 16
Memory Interface Parallel
Memory Format DRAM
Clock Frequency 200 MHz
Base Product Number W972GG6
Access Time 400 ps

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


W972GG6JB25I Product Details:

The Winbond Electronics Corporation W972GG6JB25I is a high-performance 2Gbit DDR2 SDRAM integrated circuit designed for advanced memory applications across various electronic systems. This sophisticated memory component offers robust performance in challenging environmental conditions, with an impressive operating temperature range of -40°C to 95°C, making it suitable for industrial, automotive, and aerospace applications.

Engineered as a parallel interface memory solution, this integrated circuit provides a dense 128M x 16 memory organization, delivering exceptional data storage and retrieval capabilities. The device operates at a supply voltage between 1.7V and 1.9V and achieves remarkable access times of 400 picoseconds, enabling rapid data processing and high-speed memory transactions.

The memory chip features a compact 84-WBGA (11x13) package, designed for surface mount technology, which ensures efficient space utilization and reliable mechanical integration into electronic designs. Its 200 MHz clock frequency supports high-performance computing requirements, while the 15ns write cycle time enables quick data writing operations.

Key advantages include its DDR2 SDRAM technology, which provides enhanced signal integrity, lower power consumption, and improved overall system performance. The volatile memory type ensures data is maintained during active system operation and cleared upon power loss, offering flexibility in memory management.

This memory component is particularly well-suited for applications demanding high-speed, reliable memory solutions, such as telecommunications equipment, networking infrastructure, embedded systems, and advanced computing platforms. Its wide temperature tolerance and surface mount design make it adaptable to diverse technological environments.

Potential equivalent or alternative models might include similar DDR2 SDRAM components from manufacturers like Micron Technology, Samsung, or SK Hynix, which offer comparable specifications in terms of density, speed, and packaging.

The component's RoHS compliance further underscores its commitment to environmental sustainability and adherence to global electronics manufacturing standards, making it an attractive option for manufacturers seeking reliable, high-performance memory solutions.

W972GG6JB25I Image
W972GG6JB25I (1)

W972GG6JB25I Key Technical Attributes

2Gbit SDRAM DDR2

Parallel Memory Interface

Operating Temp: -40°C ~ 95°C

W972GG6JB25I Packing Size

The W972GG6JB25I is supplied in an 84-ball WBGA (11x13 mm) package. This compact, high-density form factor is suitable for space-restricted applications and ensures efficient board layout. The tray packaging is designed to facilitate automatic handling processes in manufacturing lines. The device is surface-mountable, offering robust mechanical performance and supporting high-speed operation with minimal parasitic effects due to its advanced packaging technology. Its pin configuration aligns with industry-standard DDR2 SDRAM layouts, enabling broad compatibility during integration. The 84-TFBGA format supports optimal thermal performance, helping to maintain drive integrity across a wide operational temperature range. Electrical characteristics include a voltage supply range of 1.7V to 1.9V, access time of 400ps, and a clock frequency of 200 MHz, supporting fast data transfer and reliable performance.

W972GG6JB25I Application

The W972GG6JB25I is designed for high-speed memory applications such as embedded systems, consumer electronics (digital TVs, set-top boxes), industrial automation, routers, and data storage solutions. Its high density and performance make it ideal for use in devices requiring rapid and reliable volatile memory access, both in commercial and industrial environments.

W972GG6JB25I Features

This IC delivers a 2Gbit density arranged as 128M x 16 organization, making it suitable for data-intensive applications. Leveraging DDR2 SDRAM technology, it supports the parallel memory interface, which enables high data throughput and minimizes latency. The device operates reliably at temperatures ranging from -40°C to 95°C (TC), ensuring stability for applications in harsh or varying environments. The fast write cycle time of 15ns and quick access time of 400ps provide swift read/write operations. Its supply voltage range of 1.7V ~ 1.9V helps in reducing power consumption, making it an excellent choice for power-sensitive designs. The advanced 84-TFBGA package offers excellent performance in terms of both electrical and thermal characteristics, while tray packaging ensures safe transit and automated machine compatibility. The memory device is volatile and suitable for tasks requiring frequent data refresh and low latency.

W972GG6JB25I Quality and Safety Features

The W972GG6JB25I is manufactured with high reliability and consistent quality by Winbond Electronics, ensuring rigorous adherence to production standards. It is compliant with RoHS specifications (inventory verification may be needed), supporting environmentally friendly and safe product integration. Each IC undergoes extensive testing to guarantee performance under stated electrical, mechanical, and temperature conditions, and the robust WBGA package helps minimize risks associated with thermal and mechanical stress.

W972GG6JB25I Compatibility

The W972GG6JB25I is designed for universal compatibility with standard DDR2 SDRAM controllers and system architectures using parallel memory interfaces. Its standardized 84-WBGA package and pinout enhance straightforward PCB integration and replacement compatibility with similar products. This ensures ease of upgrade and supports a wide variety of platforms in both commercial and industrial sectors.

W972GG6JB25I Datasheet PDF

For the most accurate and up-to-date technical details, including block diagrams, timing parameters, and application guidelines, our website provides the most authoritative datasheet for the W972GG6JB25I. We strongly recommend that customers download the complete PDF datasheet directly from this page to ensure successful integration and optimal performance in your project.

Quality Distributor

IC-Components is proud to be a premium and trusted distributor of Winbond Electronics components. Our inventory is sourced directly from the manufacturer, ensuring authenticity, quality, and supply chain transparency for every order. We invite customers to get a fast, competitive quote for the W972GG6JB25I on our website and discover our dedicated customer service, extensive technical resources, and reliable global shipping options. Choose IC-Components for your next product build—your satisfaction and success are our top priorities!

Frequently Asked Questions

When integrating the Winbond W972GG6JB25I DDR2 SDRAM into a design, what are the critical power supply considerations to ensure stable operation?
The Winbond W972GG6JB25I requires a voltage supply in the range of 1.7V to 1.9V. To ensure stable operation, it's crucial to have a low - ripple power supply. A power supply with a ripple voltage of less than 5% of the nominal voltage is recommended. Also, proper decoupling capacitors should be placed close to the power pins of the W972GG6JB25I. Use ceramic capacitors with values in the range of 0.1μF and 10μF to filter out high - frequency and low - frequency noise respectively.
In which industrial applications is the Winbond W972GG6JB25I DDR2 SDRAM most suitable, and what are the limitations in other applications?
The Winbond W972GG6JB25I is well - suited for industrial control systems, data acquisition devices, and some embedded computing applications where a moderate amount of volatile memory is required. It can operate in a temperature range of - 40°C to 95°C (TC), making it suitable for harsh industrial environments. However, it may not be suitable for high - performance computing applications like modern gaming consoles or high - end servers because its clock frequency is 200 MHz, which may be too low for the high - speed data transfer requirements of such applications.
If I need to replace the Winbond W972GG6JB25I in an existing design, what alternative part numbers can I consider, and what are the trade - offs?
Some alternative part numbers could be Samsung K4T1G164QE - QCF7 or Micron MT47H64M16HR - 25E:G. The Samsung part has a different memory size (1Gbit compared to the 2Gbit of the W972GG6JB25I), so you may need to adjust your design to handle the reduced memory capacity. The Micron part has different access time characteristics. The W972GG6JB25I has an access time of 400 ps, while the Micron part may have a different value, which can affect the overall system performance. You also need to consider the physical package compatibility as the pin - out and package size may vary.
What are the clocking requirements and potential issues when using the Winbond W972GG6JB25I DDR2 SDRAM in a system?
The Winbond W972GG6JB25I has a clock frequency of 200 MHz. The clock signal should be clean and have low jitter. High jitter in the clock signal can lead to data transfer errors. It's important to use proper clock buffering and distribution techniques. For example, use a dedicated clock driver to ensure the clock signal reaches all the necessary components, including the W972GG6JB25I, with minimal skew.
How does the operating temperature range of - 40°C to 95°C (TC) of the Winbond W972GG6JB25I affect its long - term reliability in industrial use?
The wide operating temperature range of the Winbond W972GG6JB25I makes it suitable for industrial applications. However, continuous operation at the extreme ends of the temperature range can affect its long - term reliability. At - 40°C, the electrical characteristics of the components may change, such as an increase in resistance, which can lead to slower data transfer speeds. At 95°C, the device may experience thermal stress, which can cause solder joint fatigue over time. It's recommended to keep the operating temperature as close to the mid - range as possible to maximize the long - term reliability of the W972GG6JB25I.
When configuring the Winbond W972GG6JB25I DDR2 SDRAM in a system, what are the non - obvious design considerations for its parallel memory interface?
One non - obvious consideration is the signal integrity of the parallel data lines. The parallel interface has multiple data lines, and any impedance mismatches can cause signal reflections, leading to data errors. You need to carefully design the PCB traces to ensure consistent impedance. Also, the timing of the control signals (such as chip select, write enable) relative to the data signals is crucial. Incorrect timing can result in data being written or read at the wrong time. For the W972GG6JB25I, make sure to follow the recommended timing diagrams in the datasheet during the configuration process.
Can the Winbond W972GG6JB25I DDR2 SDRAM be used in a battery - powered device, and what are the power - consumption implications?
The Winbond W972GG6JB25I can be used in a battery - powered device. However, its power consumption needs to be carefully considered. The device operates at a voltage of 1.7V - 1.9V. During active operation, the power consumption is relatively high due to the continuous data transfer and memory access. To reduce power consumption in a battery - powered device, you can implement power - saving modes such as putting the W972GG6JB25I into a low - power standby state when not in use. Also, optimize the data transfer patterns to minimize unnecessary memory accesses.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


W972GG6JB25I

W972GG6JB25I

Winbond Electronics

IC DRAM 2GBIT PARALLEL 84WBGA

In Stock: 11155

Submit RFQ