The Winbond Electronics Corporation W972GG6JB-3 is a high-performance 2Gbit DDR2 SDRAM integrated circuit designed for advanced electronic applications requiring efficient memory solutions. This sophisticated memory component offers robust performance in a compact 84-WBGA (11x13) package, engineered for surface mount technology and optimized for precise computational environments.
Specifically tailored for applications demanding high-speed, low-power memory interfaces, this SDRAM delivers exceptional operational characteristics. The device operates within a stable temperature range of 0°C to 85°C and functions with a supply voltage between 1.7V and 1.9V, ensuring reliable performance across diverse operational conditions.
Key technical specifications include a remarkable 450 picosecond access time, supporting clock frequencies up to 333 MHz, and featuring a parallel memory interface with a 128M x 16 memory organization. The memory's architecture enables efficient data handling with a quick 15ns write cycle time, making it ideal for demanding computational and embedded systems requiring rapid data processing.
The component's primary advantages include its compact form factor, low power consumption, high-speed data transfer capabilities, and robust design supporting critical electronic applications. Its surface mount packaging and TFBGA configuration facilitate easy integration into complex electronic systems across telecommunications, computing, industrial control, and automotive electronics.
Potential alternative or equivalent models might include similar DDR2 SDRAM solutions from manufacturers like Micron Technology, Samsung Electronics, and SK Hynix, though specific direct equivalents would require detailed comparative analysis.
This Winbond memory solution represents a sophisticated, high-performance integrated circuit engineered to meet the stringent demands of modern electronic design, offering an optimal balance between performance, efficiency, and reliability.
W972GG6JB-3 (1)
W972GG6JB-3 Key Technical Attributes
2Gbit DDR2 SDRAM
Parallel Interface, 128M x 16
1.7V to 1.9V Supply Voltage
W972GG6JB-3 Packing Size
Device is supplied in an 84-WBGA (11x13mm) package, enabling compact integration into various PCBs. The WBGA (Wire Ball Grid Array) offers improved thermal performance and efficient heat dissipation, which is critical for extended operation. The 84-pin TFBGA (Thin Fine-pitch Ball Grid Array) configuration provides robust electrical connections and supports surface mount technology for streamlined manufacturing and assembly. Encapsulation is identified as type 139419, ensuring standardized reliability and board compatibility. Supplies are shipped in trays for optimum handling and ESD protection.
W972GG6JB-3 Application
The Winbond W972GG6JB-3 2Gbit DDR2 SDRAM is ideally suited for applications requiring high-speed memory access and substantial storage capacity. Its robust parallel interface and high density make it a reliable fit for consumer electronics, embedded systems, networking equipment, set-top boxes, and advanced digital display solutions. Its capability to operate in temperatures from 0°C to 85°C enhances its suitability for industrial electronics and telecommunications infrastructure.
W972GG6JB-3 Features
This device leverages DDR2 SDRAM technology, delivering exceptional data throughput with a maximum clock frequency of 333 MHz and an access time as low as 450 picoseconds. The 128M x 16 memory architecture supports intensive multitasking and data buffering requirements. The parallel memory interface ensures quick and efficient data transfers, while the wide voltage supply range of 1.7V to 1.9V provides energy efficiency for extended device uptime. The chip offers a fast write cycle time of just 15 nanoseconds for word and page operations, crucial for minimizing latency in high-performance computing scenarios. The volatile memory format makes it ideal for use cases where frequent refreshing is required and enables rapid access and storage of temporary data. The standardized tray packaging and compact BGA form factor speed integration into a wide array of designs while reducing board space requirements. Thermal and electrical reliability is enhanced by the advanced BGA packaging, supporting stable long-term operation.
W972GG6JB-3 Quality and Safety Features
The W972GG6JB-3 supports industry-standard RoHS compliance*, ensuring restriction of hazardous substances for environmentally-conscious designs. Its packaging and pin design enhance protection against electrical overstress and ESD events during assembly. The encapsulation accommodates automated optical inspection, reducing possible defects during manufacturing. With surface mount capability, mechanical stress during mounting is minimized, and long-term reliability is increased.
W972GG6JB-3 Compatibility
This DDR2 SDRAM is engineered for compatibility with numerous leading-edge chipsets and systems requiring parallel memory interface. Its 84-WBGA footprint and standard DDR2 timing parameters ensure straightforward migration from similar DRAM configurations and support legacy and contemporary board designs.
W972GG6JB-3 Datasheet PDF
The most up-to-date and authoritative datasheet for the Winbond W972GG6JB-3 is available directly from our website. We recommend downloading the PDF on this page to access comprehensive technical specifications, timing diagrams, recommended application circuits, and all relevant compliance documentation.
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