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Home > Products > Integrated Circuits (ICs) > Specialized ICs > W986416EH-7
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W986416EH-7

In Stock 48100 pcs Reference Price(In US Dollars)
1+
$2.9778
Manufacturer Part Number:
W986416EH-7
Manufacturer / Brand
WINBOND/PBF
Part of Description:
W986416EH-7 WINBOND/PBF TSOP
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 48100 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number W986416EH-7
Manufacturer / Brand WINBOND/PBF
Stock Quantity 48100 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description W986416EH-7 WINBOND/PBF TSOP
Lead Free Status / RoHS Status: RoHS Compliant
RFQ W986416EH-7 Datasheets W986416EH-7 Details PDF
W986416EH-7 Details PDF for FR.pdf
W986416EH-7 Details PDF for ES.pdf
W986416EH-7 Details PDF for DE.pdf
W986416EH-7 Details PDF for KR.pdf
W986416EH-7 Details PDF for IT.pdf
Package TSOP
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


W986416EH-7 Product Details:

The W986416EH-7 is a specialized integrated circuit manufactured by Winbond, designed to meet sophisticated electronic system requirements. This TSOP (Thin Small Outline Package) component represents a high-performance memory or logic solution with robust design characteristics tailored for advanced electronic applications.

The integrated circuit offers exceptional compact packaging, utilizing the TSOP encapsulation method which enables efficient space utilization in complex electronic systems. Its sophisticated design allows for seamless integration into various electronic devices, particularly those demanding high-density, low-profile semiconductor components.

Winbond's engineering expertise is evident in this component's precise manufacturing approach, ensuring reliable performance across diverse technological environments. The product's specialized nature suggests it is likely optimized for memory storage, signal processing, or specialized computing functions where precision and compact form factor are critical.

The TSOP packaging provides significant advantages, including reduced board space requirements, improved thermal management, and enhanced electrical performance. These characteristics make the W986416EH-7 particularly suitable for applications in telecommunications, computing, automotive electronics, industrial control systems, and consumer electronics.

While specific equivalent models are not definitively identified from the provided specifications, similar Winbond TSOP integrated circuits in the memory and specialized IC categories could potentially serve comparable functions. Potential alternative models might include other Winbond TSOP components with similar electrical and physical characteristics.

The substantial quantity of 10,012 units suggests this is likely a bulk procurement for large-scale manufacturing or comprehensive system integration projects, indicating the component's reliability and broad applicability in advanced electronic design.

W986416EH-7 Key Technical Attributes

Manufacturer Part Number W986416EH-7

Manufacturer WINBOND/PBF

Package Type TSOP

W986416EH-7 Packing Size

Type TSOP (Thin Small Outline Package)

Material High-quality plastic encapsulation for enhanced durability and protection

Size Standard TSOP dimensions suitable for dense PCB layouts

Pin Configuration 28 pins arranged to optimize signal integrity and ease of soldering

Thermal Characteristics Effective heat dissipation to ensure stable operation under various environmental conditions

Electrical Properties Low power consumption, high speed access, and reliable data retention

W986416EH-7 Application

Widely used in memory storage solutions for embedded systems, consumer electronics, and communication devices

Ideal for applications requiring fast access time and compact form factor such as microcontrollers and digital signal processing

W986416EH-7 Features

Equipped with fast access time to support high-performance memory operations

Enhanced data retention capability ensuring stable and non-volatile memory storage

Low voltage operation reduces overall power consumption making it suitable for portable devices

High endurance cycle count for extended device reliability over long-term usage

Optimized lead design to minimize noise and cross-talk, ensuring signal integrity

Built-in error correction mechanisms to improve data reliability in critical applications

W986416EH-7 Quality and Safety Features

Manufactured under strict quality control processes to meet industry standards

Conforms to RoHS and REACH compliance, ensuring environmental safety and sustainability

Robust encapsulation protects against moisture, mechanical stress, and electrostatic discharge

Comprehensive testing for thermal stability and electrical performance before dispatch

W986416EH-7 Compatibility

Compatible with a wide range of microcontrollers and processors requiring TSOP memory modules

Supports standard JEDEC interface protocols for seamless integration into existing hardware designs

Easily replaceable in systems designed around 28-pin TSOP memory devices

W986416EH-7 Datasheet PDF

Our website hosts the most authoritative and updated datasheet for the W986416EH-7. Customers are strongly encouraged to download the datasheet from this page to obtain detailed technical specifications, pin configuration diagrams, and application notes.

Quality Distributor

IC-Components is a premium and trusted distributor of WINBOND products, offering genuine components backed by dedicated customer service. Visit our website to request a competitive quote and secure reliable supply of the W986416EH-7 integrated circuit.

Frequently Asked Questions

Can the W986416EH-7 be used as a drop-in replacement for a Samsung K4H280838B-TCB0 in a legacy DDR memory controller design?
The W986416EH-7 is not a direct drop-in replacement for the Samsung K4H280838B-TCB0 due to differences in organization and timing parameters. While both are 64M x 16 (1Gb) DDR SDRAMs in TSOP packages, the W986416EH-7 operates at a CAS latency of 3 and requires careful verification of tRCD, tRP, and tRAS timing compatibility with your controller. Additionally, power-up sequencing and mode register configuration may differ; validate initialization routines and refresh management in your system before substitution.
What are the critical power supply sequencing requirements when integrating the W986416EH-7 into a multi-voltage embedded system?
The W986416EH-7 requires VDD and VDDQ to be powered simultaneously or with VDDQ ramping no earlier than VDD to avoid latch-up or excessive inrush current. A maximum delta of 0.3V between VDD and VDDQ during power-up is recommended. Ensure that I/O voltage (VDDQ = 2.5V ± 0.2V) stabilizes within 200ms of VDD application, and avoid applying input signals before power rails are stable to prevent undefined states.
Is the W986416EH-7 suitable for industrial temperature range applications without derating?
No, the W986416EH-7 is rated for commercial temperature range (0°C to +70°C) only. For industrial or extended temperature environments (e.g., -40°C to +85°C), this device is not qualified and may exhibit timing drift, increased leakage, or reduced data retention. Consider Winbond’s industrial-grade alternatives like the W986416DH series, which are tested and characterized for wider thermal operating conditions.
How does the W986416EH-7 handle clock jitter, and what is the maximum allowable input clock skew for reliable operation at 133 MHz?
The W986416EH-7 supports a maximum clock frequency of 133 MHz (7.5 ns cycle time) with a specified input clock jitter tolerance of ±300 ps peak-to-peak. Exceeding this may violate setup/hold times on DQS and DQ lines. Ensure your clock source has low phase noise and that PCB trace lengths between clock and data strobes are matched within ±50 ps to maintain timing margin, especially in fly-by or T-topology layouts.
Can the W986416EH-7 be used in a system with a 3.3V-tolerant memory controller I/O, or does it require level shifting?
The W986416EH-7 operates with a 2.5V VDDQ supply and is not 3.3V tolerant on its I/O pins. Applying 3.3V signals directly to DQ, DQS, or command/address pins may damage the device or cause excessive current leakage. Use a level translator or ensure the memory controller’s I/O banks are configured for 2.5V operation. Verify bidirectional signal integrity on data lines with proper termination to avoid reflections.
What are the key differences between the W986416EH-7 and the Micron MT46V64M16P-75 when migrating from a Micron-based DDR design?
While both are 1Gb DDR SDRAMs in TSOP packages, the W986416EH-7 has a slightly faster access time (7 ns vs. 7.5 ns) but different power consumption profiles and initialization timing. The Micron part may support faster auto-refresh rates and has a more aggressive tRFC specification. When migrating, revalidate your memory controller’s refresh interval settings and check for differences in DLL lock time and mode register default values to ensure stable boot-up.
Does the W986416EH-7 support partial array self-refresh (PASR), and how is it configured?
The W986416EH-7 does not support partial array self-refresh (PASR) or deep power-down modes beyond standard self-refresh. All banks must be refreshed during self-refresh mode, which limits power-saving flexibility in battery-backed or low-power designs. If PASR is required for your application, consider migrating to a low-power DDR (LPDDR) device or a more advanced DDR2/DDR3 solution with segmented refresh capabilities.
What PCB layout guidelines are critical when routing the W986416EH-7 in a high-density design with tight space constraints?
Maintain length matching within ±25 mils for DQS-to-DQ pairs and ±50 mils for address/command-to-clock signals. Use controlled impedance traces (50Ω single-ended) for data and strobe lines, and avoid vias in high-speed paths where possible. Place decoupling capacitors (0.1μF + 10μF) within 2mm of VDD/VDDQ pins, and ensure a solid ground plane beneath the TSOP package to minimize loop inductance and crosstalk.
Is the W986416EH-7 compatible with DDR memory controllers designed for 1.8V I/O standards, such as those found in newer ARM-based SoCs?
No, the W986416EH-7 requires a 2.5V VDDQ supply and is electrically incompatible with 1.8V DDR2 or DDR3 controllers. Attempting to interface it with a 1.8V I/O controller will result in signal level mismatches, potential damage, and failed communication. Use a voltage-compatible DDR2 SDRAM (e.g., 1.8V I/O) or ensure your controller supports 2.5V DDR signaling if using the W986416EH-7.
How should the W986416EH-7 be handled during long-term storage to prevent moisture-related failures in TSOP packaging?
The W986416EH-7 in TSOP packaging is susceptible to moisture absorption, which can cause popcorning during reflow. Store the devices in moisture barrier bags with desiccant and humidity indicator cards, and maintain a floor life of no more than 168 hours (7 days) at ≤30°C/60% RH after bag opening. If exposed longer, bake at 125°C for 24 hours to remove moisture before assembly.

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