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Home > Products > Capacitors > Ceramic Capacitors > VJ0402D2R4BXBAC
Vishay Vitramon
VJ SEries, HIFREQ 0402 61mm.jpg ImageView larger image
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VJ0402D2R4BXBAC

In Stock 164546 pcs Reference Price(In US Dollars)
1+
$0.3318
200+
$0.1284
500+
$0.124
1000+
$0.1217
Manufacturer Part Number:
VJ0402D2R4BXBAC
Manufacturer / Brand
Vishay Vitramon
Part of Description:
CAP CER 2.4PF 100V C0G/NP0 0402
Datasheets:
VJ0402D2R4BXBAC.pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 164546 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number VJ0402D2R4BXBAC
Manufacturer / Brand Vishay Vitramon
Stock Quantity 164546 pcs Stock
Category Capacitors > Ceramic Capacitors
Description CAP CER 2.4PF 100V C0G/NP0 0402
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Rated 100V
Tolerance ±0.1pF
Thickness (Max) 0.024' (0.61mm)
Temperature Coefficient C0G, NP0
Size / Dimension 0.040' L x 0.020' W (1.02mm x 0.51mm)
Series VJ HIFREQ
Ratings -
Package / Case 0402 (1005 Metric)
Package Tape & Reel (TR)
Operating Temperature -55°C ~ 125°C
Mounting Type Surface Mount, MLCC
Lead Style -
Lead Spacing -
Height - Seated (Max) -
Features High Q, Low Loss
Capacitance 2.4 pF
Base Product Number VJ0402
Applications RF, Microwave, High Frequency

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
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Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

How does the PCB land pattern design affect the effective capacitance and resonant frequency of the VJ0402D2R4BXBAC in 5GHz matching networks?
At high frequencies, the 2.4pF nominal value of the VJ0402D2R4BXBAC is significantly influenced by parasitic capacitance from the solder pads and the proximity of the ground plane. To maintain the performance of the VJ0402D2R4BXBAC, engineers should utilize a "copper-defined" land pattern and potentially a ground cutout beneath the component to minimize stray capacitance, which can shift the self-resonant frequency (SRF) downwards and detune the matching network.
Can a standard general-purpose 0402 C0G capacitor be used as a drop-in replacement for the VJ0402D2R4BXBAC in high-Q resonator circuits?
Replacing the VJ0402D2R4BXBAC with a standard C0G MLCC is generally discouraged in high-Q applications due to the specific "VJ HIFREQ" series optimization for low Equivalent Series Resistance (ESR). While a standard part may share the same 2.4pF value and 0402 footprint, the VJ0402D2R4BXBAC is engineered for much lower dielectric loss at microwave frequencies; substituting it with a non-high-Q part will likely result in increased signal attenuation and higher power dissipation within the resonator.
What are the thermal management implications when using the VJ0402D2R4BXBAC in high-power RF pulse applications?
Although the VJ0402D2R4BXBAC is rated for 100V, its power handling in pulsed RF applications is limited by its ability to dissipate heat generated by the circulating current and the device's ESR. Because the VJ0402D2R4BXBAC has a very low loss tangent, it minimizes self-heating, but designers must ensure the trace widths are sufficient to act as a heatsink, preventing the component from exceeding its 125°C maximum operating temperature during high-duty-cycle pulses.
How does the 100V DC voltage rating of the VJ0402D2R4BXBAC influence its performance compared to lower voltage 25V or 50V high-Q alternatives?
The 100V rating of the VJ0402D2R4BXBAC indicates a robust internal dielectric structure which typically provides a higher safety margin against voltage spikes in RF power stages. In 0402 (1005 Metric) form factors, choosing the 100V rated VJ0402D2R4BXBAC over lower voltage counterparts does not significantly increase ESR, making it a versatile choice for both small-signal processing and low-power transmit paths where DC bias voltages might fluctuate.
When migrating from a 0603 size high-frequency capacitor to the VJ0402D2R4BXBAC, what impact will the package change have on the circuit's parasitic inductance?
Transitioning to the VJ0402D2R4BXBAC from a larger 0603 package reduces the equivalent series inductance (ESL) due to the shorter physical distance between the terminals. This lower ESL shifts the self-resonant frequency of the 2.4pF VJ0402D2R4BXBAC higher, allowing the capacitor to behave as a purely capacitive element further into the GHz range, which is essential for maintaining gain flatness in wideband amplifiers.
Is the ±0.1pF tolerance of the VJ0402D2R4BXBAC stable enough for use in precision filter stages subject to wide temperature swings?
The VJ0402D2R4BXBAC utilizes a C0G (NP0) dielectric, which provides a temperature coefficient of 0 ±30 ppm/°C. This ensures that the ±0.1pF tolerance remains exceptionally stable across the -55°C to 125°C range. For precision filtering, the VJ0402D2R4BXBAC minimizes frequency drift compared to X7R or other class II dielectrics, ensuring that the filter's center frequency remains within design specifications regardless of the environmental operating conditions.
What are the risks of using the VJ0402D2R4BXBAC in ultrasonic or high-vibration industrial environments?
Like all multilayer ceramic capacitors (MLCCs), the VJ0402D2R4BXBAC is susceptible to mechanical cracking if the PCB experiences excessive flexing or vibration. In industrial designs, the small 0402 footprint of the VJ0402D2R4BXBAC offers better resistance to board flexure than larger case sizes, but it is still necessary to place the component away from mounting holes and board edges to prevent mechanical stress from compromising the hermetic seal of the ceramic layers.
How does the moisture sensitivity level (MSL 1) of the VJ0402D2R4BXBAC affect high-volume SMT production workflows?
The VJ0402D2R4BXBAC is classified as MSL 1, which means it has an unlimited floor life when stored at ≤30°C/85% RH. For high-volume manufacturing, this eliminates the need for specialized dry-packing or baking procedures before reflow. The VJ0402D2R4BXBAC can be integrated into standard lead-free reflow profiles without the risk of "popcorning" or internal delamination caused by trapped moisture, ensuring high assembly yields.

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