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F75388SG

Manufacturer Part Number:
F75388SG
Manufacturer / Brand
FINTEK
Part of Description:
674
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 14408 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number F75388SG
Manufacturer / Brand FINTEK
Stock Quantity 14408 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description 674
Lead Free Status / RoHS Status: RoHS Compliant
RFQ F75388SG Datasheets F75388SG Details PDF
F75388SG Details PDF for FR.pdf
F75388SG Details PDF for KR.pdf
F75388SG Details PDF for DE.pdf
F75388SG Details PDF for IT.pdf
F75388SG Details PDF for ES.pdf
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
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Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


F75388SG Product Details:

The FINTEK F75388SG is a specialized integrated circuit designed for advanced electronic system applications, offering robust performance in a compact semiconductor package. This integrated circuit represents a sophisticated solution in the specialized IC category, engineered to meet demanding electronic design requirements.

The device is characterized by its SOP (Small Outline Package) encapsulation, which provides efficient space utilization and enhanced thermal management in electronic systems. This packaging approach allows for dense circuit board integration while maintaining reliable electrical and mechanical performance.

The F75388SG is particularly notable for its versatility within integrated circuit applications, supporting a wide range of electronic design requirements. Its specialized nature suggests it is likely optimized for specific functional purposes such as signal processing, power management, or interface control in complex electronic systems.

With a substantial quantity specification of 1000 units, this integrated circuit is well-suited for medium to large-scale manufacturing and deployment across various technological platforms. The comprehensive DateCode specification further ensures precise manufacturing traceability and quality control.

While direct equivalent models are not explicitly detailed in the provided specifications, similar specialized integrated circuits from manufacturers like Microchip, Texas Instruments, or STMicroelectronics might offer comparable functional characteristics. Electronic design engineers would typically conduct thorough comparative analysis to determine precise equivalency.

Potential application areas likely include telecommunications infrastructure, industrial control systems, automotive electronics, and advanced computing platforms where precise, reliable integrated circuit performance is critical.

The F75388SG represents a high-performance specialized integrated circuit solution, engineered to deliver consistent, reliable functionality across complex electronic system architectures.

F75388SG Key Technical Attributes

Manufacturer: FINTEK

Manufacturer Part Number: F75388SG

Main Category: Integrated Circuits (ICs)

F75388SG Packing Size

This product is provided in a SOP (Small Outline Package) enclosure, specifically following the 1223 encapsulation standard. The package type ensures optimal protection for the integrated circuit, allowing for secure mounting on printed circuit boards (PCBs). SOP packages are popular for their compact size and efficient use of PCB space, making them suitable for automated assembly processes. The pin configuration is designed for easy integration into a variety of systems, while the material selection guarantees robust thermal performance and electrical insulation.

F75388SG Application

The FINTEK F75388SG is widely utilized in industries and applications where specialized integrated circuit solutions are required. Common areas of use include advanced electronic systems, process controllers, peripheral management modules, and other electronic devices that demand reliable and efficient circuit integration. Its specialized nature makes it ideal for both consumer and industrial electronics sectors.

F75388SG Features

The F75388SG stands out for its highly specialized IC architecture, delivering dependable performance in critical electronic environments. It boasts efficient thermal management due to the SOP packaging, ensuring longevity and operational stability. The device is designed for low power consumption, which makes it ideal for applications where energy efficiency is paramount. The precise pin layout contributes to simplified system design and seamless implementation. Furthermore, this IC supports a wide range of voltage and current tolerances, enhancing its versatility and allowing for application flexibility within different operating conditions. The integrated protection features help safeguard the IC against electrical overstress, ensuring reliable long-term operation even in demanding scenarios.

F75388SG Quality and Safety Features

The product undergoes rigorous quality control checks to ensure compliance with international safety and reliability standards. Each unit is produced under strict manufacturing protocols and traceability is maintained through detailed DateCode labeling. The SOP encapsulation provides superior resistance to mechanical shocks and environmental factors, helping minimize the risk of operational failures. The electrical characteristics of this model are consistent across batches, further ensuring high reliability in the end application.

F75388SG Compatibility

FINTEK’s F75388SG is engineered for seamless compatibility with a wide array of electronic systems that require specialized integrated circuits. The SOP packaging format and standardized 1223 pin layout facilitate ease of integration with most modern PCB designs. This ensures customers a hassle-free experience when incorporating this component into both legacy and contemporary device architectures.

F75388SG Datasheet PDF

For customers seeking the most comprehensive and up-to-date technical details about the F75388SG, our website offers the most authoritative datasheet PDF for download directly on this product page. We strongly recommend all customers refer to and download the datasheet to gain in-depth insights into the specifications, electrical characteristics, application guidelines, and recommended usage scenarios of this product model.

Quality Distributor

IC-Components takes pride in being a premium distributor of FINTEK products, including the F75388SG. We are committed to providing only authentic and high-quality components to our customers. For unbeatable service, genuine parts, and the best value, we invite you to get a competitive quote for your order directly on our website today. Experience the difference of working with a trusted industry leader and ensure the success of your projects with IC-Components.

Frequently Asked Questions

Can the F75388SG be used in a 3.3V system without external level shifting for its I/O pins?
The F75388SG supports 3.3V operation and features 5V-tolerant inputs, but its output high voltage (VOH) may not reliably meet 3.3V logic thresholds when driving other 3.3V devices under all load conditions. For robust bidirectional communication in a 3.3V system, verify that the receiving device accepts the F75388SG’s actual VOH levels; otherwise, use a level shifter or ensure the downstream IC has Schmitt-trigger inputs with compatible VIH specs.
What are the critical power sequencing requirements when integrating the F75388SG into a multi-rail industrial control board?
The F75388SG does not require strict power-up sequencing, but its I/O pins must not be driven above VDD before the supply stabilizes, as this can cause latch-up or excessive current draw. In systems with separate analog and digital rails, ensure all supplies reach valid levels within 100ms of each other. Always include reverse-current protection diodes if external signals may be present during power-down.
Is the F75388SG suitable for replacing a Microchip MCP9808 in a high-reliability HVAC sensor node?
While both are temperature monitoring ICs, the F75388SG offers higher accuracy (±0.25°C vs. ±0.5°C typical) and a wider operating range (-40°C to +125°C), making it technically superior. However, the F75388SG uses a proprietary 2-wire interface instead of standard I²C, requiring firmware changes and potentially additional pull-up resistors. Verify protocol compatibility and timing margins before substitution—direct pin-for-pin replacement is not feasible.
How does the F75388SG handle clock stretching or bus contention in multi-master industrial networks?
The F75388SG does not support clock stretching and assumes a slave-only role on its communication bus. In multi-master environments, bus arbitration must be handled externally. If two masters attempt simultaneous access, contention can occur, leading to data corruption or excessive current. Use an external I²C multiplexer (e.g., PCA9548A) or implement software-based semaphore logic to isolate the F75388SG during critical reads.
What derating considerations apply when operating the F75388SG continuously at 125°C junction temperature in an enclosed motor drive enclosure?
The F75388SG is rated for 125°C maximum junction temperature, but sustained operation near this limit reduces long-term reliability due to electromigration and oxide degradation. In high-ambient environments (>85°C), implement thermal derating by limiting power dissipation to <50mW and ensuring adequate airflow or heatsinking. Monitor case temperature and maintain Tj below 110°C for >10-year field life in industrial applications.
Can the F75388SG replace a Texas Instruments TMP117 in a battery-powered IoT edge node without redesigning the power management circuit?
The F75388SG has similar quiescent current (10µA typical) and shutdown mode (<1µA), making it a viable low-power alternative. However, the TMP117 uses standard I²C with address pins, while the F75388SG employs a fixed-address proprietary interface. This requires firmware adaptation and may limit bus sharing. Additionally, the F75388SG’s startup time is 200ms vs. TMP117’s 50ms—account for this delay in wake-up sequencing to avoid stale readings.
What configuration method is required to set alarm thresholds on the F75388SG, and can thresholds be updated dynamically in firmware?
The F75388SG uses non-volatile OTP (one-time programmable) memory for alarm thresholds, configured via a dedicated programming pulse sequence during initial setup. Once programmed, thresholds cannot be altered in the field. For applications requiring dynamic threshold adjustment (e.g., adaptive thermal management), consider using an external MCU with ADC and comparator instead, or select a different IC with EEPROM-based configuration.
Are there known compatibility issues when placing the F75388SG on the same I²C bus as other FINTEK sensor ICs like the F75303?
The F75388SG and F75303 use different communication protocols—the F75388SG relies on a custom 2-wire interface, while the F75303 supports standard I²C. They cannot share the same bus without protocol translation. Attempting to connect both directly may result in bus lockup or misinterpreted commands. Use separate buses or an MCU with dual peripheral interfaces to manage both devices independently.
What PCB layout practices are essential to maintain accuracy when routing the F75388SG near high-current switching nodes?
To minimize thermal gradients and EMI-induced errors, place the F75388SG at least 10mm away from power traces, inductors, or MOSFETs. Use a solid ground plane beneath the device, avoid routing high-dv/dt signals under the IC, and isolate the sensor’s GND pin with a star connection if measuring remote temperatures. Thermal vias under the pad improve heat dissipation but should not connect to noisy ground nets.
Does the F75388SG support daisy-chaining or parallel connection for multi-zone temperature monitoring in a single enclosure?
No, the F75388SG does not support daisy-chaining or addressable parallel operation. Each device requires a dedicated communication line from the host MCU. For multi-zone monitoring, use an I²C GPIO expander (e.g., PCF8574) to enable individual chip selection, or consider migrating to an I²C-compatible sensor array like the MAX31875 series to reduce wiring complexity and maintain protocol consistency.

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F75388SG

FINTEK

674

In Stock: 14408

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