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Home > Products > Crystals, Oscillators, Resonators > Oscillators > SIT8208AI-G3-28E-75.000000T
SiTime
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SIT8208AI-G3-28E-75.000000T

In Stock 60533 pcs Reference Price(In US Dollars)
1+
$1.0068
200+
$0.3897
500+
$0.3767
1000+
$0.3694
Manufacturer Part Number:
SIT8208AI-G3-28E-75.000000T
Manufacturer / Brand
SiTime
Part of Description:
MEMS OSC XO 75.0000MHZ LVCMOS LV
Datasheets:
SIT8208AI-G3-28E-75.000000T(1).pdfSIT8208AI-G3-28E-75.000000T(2).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 60533 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SIT8208AI-G3-28E-75.000000T
Manufacturer / Brand SiTime
Stock Quantity 60533 pcs Stock
Category Crystals, Oscillators, Resonators > Oscillators
Description MEMS OSC XO 75.0000MHZ LVCMOS LV
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply 2.8V
Type XO (Standard)
Spread Spectrum Bandwidth -
Size / Dimension 0.106" L x 0.094" W (2.70mm x 2.40mm)
Series SiT8208
Ratings -
Package / Case 4-SMD, No Lead
Package Tape & Reel (TR)
Output LVCMOS, LVTTL
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Height - Seated (Max) 0.031" (0.80mm)
Function Enable/Disable
Frequency Stability ±50ppm
Frequency 75 MHz
Current - Supply (Max) 33mA
Current - Supply (Disable) (Max) 31mA
Base Resonator MEMS
Base Product Number SIT8208
Absolute Pull Range (APR) -

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

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Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
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Frequently Asked Questions

Can I use SIT8208AI-G3-28E-75.000000T as a drop-in replacement for a 75 MHz crystal oscillator in an existing LVCMOS design?
SIT8208AI-G3-28E-75.000000T can often replace a 75 MHz clock source when the circuit already expects a single-ended LVCMOS or LVTTL oscillator output at 2.8 V. The main checks are supply compatibility, logic-level thresholds at the receiving device, pinout, enable behavior, startup timing, and output loading. If the old part was a crystal plus inverter or a different oscillator family, the frequency may match but the drive, rise/fall behavior, and enable polarity may differ and require a board-level review.
Is SIT8208AI-G3-28E-75.000000T suitable when the clock receiver is powered at 1.8 V or 3.3 V?
SIT8208AI-G3-28E-75.000000T is specified for a 2.8 V supply, so it is not a universal fit for 1.8 V or 3.3 V rails. In mixed-voltage systems, the key question is whether the oscillator supply can be derived cleanly from 2.8 V and whether the receiving input accepts the resulting output high level. If the clock input is not 2.8 V tolerant, level compatibility needs to be verified before layout lock.
How should SIT8208AI-G3-28E-75.000000T be connected if the system needs clock gating or standby control?
SIT8208AI-G3-28E-75.000000T includes an enable/disable function, so it can be used where firmware or hardware needs to stop the clock during low-power or reset states. The design should confirm the enable pin active state, default behavior at power-up, and whether the downstream IC tolerates a stopped or tristated clock. In systems with strict boot sequencing, the oscillator enable should be tied to a defined logic level so the output state is predictable.
What design checks are needed before replacing a 75 MHz oscillator with SIT8208AI-G3-28E-75.000000T in an FPGA or SoC clock tree?
For SIT8208AI-G3-28E-75.000000T, the practical checks are input jitter tolerance, clock input voltage thresholds, trace length, and whether the FPGA or SoC expects a CMOS oscillator rather than a differential source. It is also worth confirming that the device can accept a 75 MHz reference without requiring spread-spectrum or synchronous startup behavior. If the old design used a crystal input on the chip, the external oscillator may require the crystal pins to be reconfigured or left unused according to the silicon vendor guidance.
Can SIT8208AI-G3-28E-75.000000T be used in industrial environments from -40°C to 85°C?
SIT8208AI-G3-28E-75.000000T is specified across -40°C to 85°C, which aligns with many industrial ambient conditions. For long-term field use, the remaining checks are power rail stability, vibration and board flex at the oscillator location, and whether the receiving clock path has enough margin for the frequency stability target of ±50 ppm. If the application sees larger thermal swings or sustained high board temperatures, the oscillator should be evaluated in the final enclosure, not only on the bench.
How much margin should I leave if my design uses SIT8208AI-G3-28E-75.000000T for a communication interface clock?
SIT8208AI-G3-28E-75.000000T provides a 75 MHz reference with ±50 ppm frequency stability, which is usually adequate for many digital interfaces that tolerate modest clock error. The real margin depends on the protocol budget, the device PLL capture range, and any additional error sources in the system. If the clock is feeding a timing-sensitive interface, total frequency error should be checked against the full link budget, including trace effects, reference accuracy requirements, and temperature drift.
Are there any layout concerns when placing SIT8208AI-G3-28E-75.000000T near noisy power circuitry?
SIT8208AI-G3-28E-75.000000T should be placed close to the clock receiver with a short, clean trace and local supply decoupling. Switching regulators, fast GPIO buses, and high-current loops can inject noise that couples into the oscillator supply or the clock net. A compact return path, solid ground reference, and separation from high di/dt nodes help preserve edge integrity and reduce injected jitter.
What are the main differences if I replace SIT8208AI-G3-28E-75.000000T with a 3.3 V oscillator from another vendor?
A 3.3 V part may solve rail compatibility, but it can also change output swing, rise time, power draw, and enable behavior. With SIT8208AI-G3-28E-75.000000T, the system is tuned around a 2.8 V LVCMOS/LVTTL output, so moving to a 3.3 V alternative can affect input overstress limits on downstream devices and may require a different decoupling and power sequencing review. Pinout and package compatibility also need verification because many oscillators are not mechanically interchangeable even when the frequency matches.
Is SIT8208AI-G3-28E-75.000000T a good choice for battery-powered equipment?
SIT8208AI-G3-28E-75.000000T can be used in battery-powered designs if the 2.8 V rail is already present and the power budget accommodates up to 33 mA in normal operation. For systems that spend long periods idle, the enable/disable function becomes useful because the disabled current is lower, though the actual energy benefit depends on how often the clock is turned off and restarted. Designs that are aggressively power-constrained should compare the oscillator’s always-on current against the system sleep profile.
What replacement risks should I check when migrating to SIT8208AI-G3-28E-75.000000T from an older quartz-based clock source?
When migrating to SIT8208AI-G3-28E-75.000000T, check startup behavior, output waveform, and whether the receiving device expects a crystal resonator interface instead of a buffered clock. Quartz-based solutions often behave differently at power-up and may interact with the host IC’s internal amplifier or load capacitors. The MEMS-based oscillator removes the crystal network, but the host timing and pin configuration still need to be validated in the target board and temperature range.

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