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Home > Products > Connectors, Interconnects > Rectangular Connectors - Headers, Male Pins > TMMH-118-01-G-DV-EP
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TMMH-118-01-G-DV-EP

Manufacturer Part Number:
TMMH-118-01-G-DV-EP
Manufacturer / Brand
Samtec Inc.
Part of Description:
2MM LOW PROFILE STRIPS
Datasheets:
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 42532 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number TMMH-118-01-G-DV-EP
Manufacturer / Brand Samtec Inc.
Stock Quantity 42532 pcs Stock
Category Connectors, Interconnects > Rectangular Connectors - Headers, Male Pins
Description 2MM LOW PROFILE STRIPS
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage Rating -
Termination Solder
Style Board to Board or Cable
Shrouding Unshrouded
Series TMMH
Row Spacing - Mating 0.079" (2.00mm)
Pitch - Mating 0.079" (2.00mm)
Package Tube
Overall Contact Length -
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 36
Mounting Type Surface Mount
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Insulation Height 0.079" (2.00mm)
Insulation Color Black
Ingress Protection -
Features End Shrouds, Mating Guide
Fastening Type Push-Pull
Current Rating (Amps) -
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post -
Contact Length - Mating 0.126" (3.20mm)
Contact Finish Thickness - Post 3.00µin (0.076µm)
Contact Finish Thickness - Mating 20.0µin (0.51µm)
Contact Finish - Post Gold
Contact Finish - Mating Gold
Connector Type Header, Cuttable
Base Product Number TMMH-118
Applications -

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the TMMH-118-01-G-DV-EP be used as a direct board-to-board connector when I need a low-profile 2.00 mm pitch interconnect?
The TMMH-118-01-G-DV-EP is a 36-position, 2-row, 2.00 mm pitch surface-mount header intended for board-to-board or cable-mated connections. It fits low-profile stack-up designs where the mating connector and PCB spacing are already aligned to the 2.00 mm family. Before using the TMMH-118-01-G-DV-EP as a direct replacement, confirm the mating part, row orientation, and stack height target, since the product is cuttable but still depends on the footprint and mating geometry of the full TMMH-118 family.
What should I check in the PCB footprint before designing in the TMMH-118-01-G-DV-EP?
For the TMMH-118-01-G-DV-EP, verify pad size, solder-mask clearance, coplanarity tolerance, and any recommended paste pattern for the 2-row SMT layout. The end shrouds and mating guide help alignment, but they do not remove the need for accurate land pattern control. In dense assemblies, also check adjacent component keepout because the unshrouded header and push-pull mating interface can require more lateral clearance than a fully boxed connector.
Is the TMMH-118-01-G-DV-EP suitable for high-vibration assemblies or field service conditions?
The TMMH-118-01-G-DV-EP uses a push-pull fastening interface and end shrouds, which help maintain a stable mated connection during normal handling and assembly. For higher vibration or service-heavy environments, confirm the full system retention strategy, including enclosure support, cable strain relief if applicable, and whether the mating connector provides enough friction and engagement depth for the expected shock profile. If the application sees repeated unplug cycles, inspect wear on the 20.0 µin gold contact finish and validate contact resistance after environmental testing.
Can I use the TMMH-118-01-G-DV-EP in industrial temperature environments?
Yes, the TMMH-118-01-G-DV-EP is specified for -55°C to 125°C, which makes it compatible with many industrial and embedded systems. The LCP housing and phosphor bronze contacts are appropriate for elevated operating temperatures, but the surrounding PCB materials, solder alloy, and mating connector should also be rated for the same thermal range. If the assembly will see thermal cycling, evaluate solder joint robustness and mechanical stress at the connector ends.
What are the practical limits of replacing another Samtec TMMH part with the TMMH-118-01-G-DV-EP?
The TMMH-118-01-G-DV-EP belongs to the TMMH family, so it is a candidate when the existing design already uses a compatible 2.00 mm low-profile, dual-row header. The main replacement checks are orientation, position count, mating style, and stacking height requirement. Even within the same series, small differences in suffixes can change plating, packaging, or mechanical details, so the exact mating connector and footprint should be matched against the TMMH-118-01-G-DV-EP data before swapping it into a released design.
How do I know whether the TMMH-118-01-G-DV-EP is a good choice for signal or power routing?
The TMMH-118-01-G-DV-EP is a general-purpose rectangular connector header, but the provided catalog data does not list a current or voltage rating. That means the design decision should be based on the system’s own electrical requirements and the mated connector’s capability, not assumed from the header alone. For mixed-signal or power paths, confirm trace width, thermal rise, and contact loading against the full interconnect stack rather than relying on the connector family name.
Can the TMMH-118-01-G-DV-EP be used with cable assemblies instead of board-to-board mating?
The TMMH-118-01-G-DV-EP is listed for board-to-board or cable use, so it can work in cable-mated architectures when the matching connector and cable termination are designed for the same pitch and pin orientation. In practice, cable use adds strain-relief and pull-force considerations that do not appear in a pure board-to-board stack. Verify cable bend radius, termination quality, and the mechanical load transferred into the PCB header.
What reliability checks make sense for the TMMH-118-01-G-DV-EP in long-life products?
For the TMMH-118-01-G-DV-EP, typical long-life validation includes thermal cycling, vibration, humidity exposure, and mating-cycle testing on the gold-plated contact interface. Because the part is RoHS3 compliant and uses LCP with UL94 V-0 flammability rating, it is suited to many regulated and enclosure-based designs, but connector performance still depends on assembly quality and the mating partner. For products intended to stay in service for years, verify retention force, solder-joint integrity, and contact resistance drift over time.
If I need a lower-cost or alternate connector, what trade-offs should I expect versus the TMMH-118-01-G-DV-EP?
Alternatives to the TMMH-118-01-G-DV-EP often trade off profile height, plating thickness, mating guidance, or mechanical retention. A lower-cost connector may use thinner gold, different housing material, or less robust alignment features, which can affect wear life and tolerance to handling. When comparing alternatives, check whether the substitute preserves the same 2.00 mm pitch, 2-row geometry, and SMT footprint, since even small mechanical changes can force a board respin.
Does the TMMH-118-01-G-DV-EP need any special handling during SMT assembly and reflow?
The TMMH-118-01-G-DV-EP is a surface-mount connector, so standard SMT process control applies: accurate pick-and-place, coplanarity management, and a reflow profile compatible with the housing and solder system. The MSL 1 rating indicates unlimited floor life under normal storage conditions, which simplifies inventory handling, but assembly still depends on the board’s thermal profile and paste deposition quality. In production, it is worth verifying joint wetting and connector alignment after reflow, especially on long headers.

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TMMH-118-01-G-DV-EP

Samtec Inc.

2MM LOW PROFILE STRIPS

In Stock: 42532

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