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Home > Products > Connectors, Interconnects > Rectangular Connectors - Headers, Receptacles, Female Sockets > SFM-120-02-L-D-SN
Samtec Inc.
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SFM-120-02-L-D-SN

In Stock 7529 pcs Reference Price(In US Dollars)
1+
$13.5848
209+
$5.4214
494+
$5.2397
1007+
$5.151
Manufacturer Part Number:
SFM-120-02-L-D-SN
Manufacturer / Brand
Samtec Inc.
Part of Description:
CONN RCPT 40POS 0.05 GOLD SMD
Datasheets:
SFM-120-02-L-D-SN(1).pdfSFM-120-02-L-D-SN(2).pdfSFM-120-02-L-D-SN(3).pdfSFM-120-02-L-D-SN(4).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 7529 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SFM-120-02-L-D-SN
Manufacturer / Brand Samtec Inc.
Stock Quantity 7529 pcs Stock
Category Connectors, Interconnects > Rectangular Connectors - Headers, Receptacles, Female Sockets
Description CONN RCPT 40POS 0.05 GOLD SMD
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage Rating 250VAC
Termination Solder
Style Board to Board or Cable
Series Tiger Eye™ SFM
Row Spacing - Mating 0.050" (1.27mm)
Pitch - Mating 0.050" (1.27mm)
Package Tube
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 40
Mounting Type Surface Mount
Material Flammability Rating UL94 V-0
Mated Stacking Heights 6.15mm, 6.30mm, 7.92mm, 8.08mm, 9.70mm, 9.86mm, 11.61mm, 11.76mm
Insulation Material Liquid Crystal Polymer (LCP)
Insulation Height 0.185" (4.70mm)
Insulation Color Black
Ingress Protection -
Features Solder Retention
Fastening Type Push-Pull
Current Rating (Amps) 3.2A per Contact
Contact Type Female Socket
Contact Shape Square
Contact Material Beryllium Copper
Contact Length - Post -
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Receptacle
Base Product Number SFM-120
Applications -

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can SFM-120-02-L-D-SN support multi-gigabit differential pairs on a 1.27 mm mezzanine link?
SFM-120-02-L-D-SN can be used in high-speed interconnects, but the channel performance is usually limited more by the PCB launch, via design, and return-path continuity than by the connector alone. For multi-gigabit signals, keep differential pairs tightly coupled, preserve a continuous reference plane through the connector breakout, and avoid long via stubs or layer transitions right at the interface. Validate the complete channel with simulation and lab testing, since the mating stack height and board geometry have a stronger effect on eye quality than the connector pitch by itself.
What PCB footprint and alignment issues should I watch for when designing in SFM-120-02-L-D-SN?
SFM-120-02-L-D-SN is a fine-pitch SMT receptacle, so footprint accuracy, solder paste control, and board coplanarity are the main assembly variables. Use the recommended land pattern for the Tiger Eye SFM family, keep silkscreen and solder mask clearances clean, and make sure the two boards are mechanically guided so the connector is not used as the only alignment feature. In longer assemblies, add standoffs or guide pins to reduce side-load on the contacts during mating.
Is SFM-120-02-L-D-SN appropriate for carrying power as well as signals?
SFM-120-02-L-D-SN can carry low to moderate power if the current is distributed across multiple contacts and the board copper can handle the resulting temperature rise. If a rail needs high inrush capability, bulk power distribution, or repeated hot-plug events, a dedicated power connector is usually a better fit. When using SFM-120-02-L-D-SN for power, check current sharing, trace width, via count, and local heating on both mating boards rather than relying on the contact rating alone.
Can SFM-120-02-L-D-SN be used in vibration-prone industrial equipment?
SFM-120-02-L-D-SN has solder retention and a push-pull style mating interface, which helps the connector remain stable in normal equipment use. For vibration or shock, the surrounding mechanics still need to control board motion, because repeated flexing can fatigue SMT joints and alter contact force over time. In industrial designs, add mechanical support near the connector, minimize unsupported board spans, and qualify the full assembly under vibration profiles that match the end application.
What is the recommended assembly approach for reflow soldering SFM-120-02-L-D-SN?
SFM-120-02-L-D-SN is an SMT part with MSL 1 handling, so moisture storage is straightforward, but placement and reflow still need good process control. Keep the stencil deposit balanced across both rows, support the PCB to maintain flatness during reflow, and avoid excessive paste volume that can lift the part or create bridging. The solder-retention feature helps during placement, but the final joint quality still depends on board flatness, paste printing accuracy, and a stable thermal profile.
How do I choose the right mated stacking height for SFM-120-02-L-D-SN in a compact enclosure?
SFM-120-02-L-D-SN is available in several mated stacking heights, so enclosure clearance usually sets the selection. Build the full stack-up first, including PCB thickness, solder thickness, component keep-outs, standoff tolerances, and any expected board warp. If the enclosure is tight, prototype the nominal stack and the worst-case tolerance stack so you can confirm insertion clearance, retention, and component-to-component spacing before release.
Is SFM-120-02-L-D-SN a practical replacement for another 1.27 mm board-to-board connector?
SFM-120-02-L-D-SN can replace many 1.27 mm mezzanine receptacles, but only if the mating height, pin orientation, row spacing, and footprint match closely enough for the existing PCB. When migrating from brands such as Hirose FX8/FX10 or Panasonic AXK series, check the contact wipe length, tail geometry, and board-to-board tolerance stack, because those details affect both signal integrity and assembly yield. A connector swap that looks similar on paper can still require footprint or stack-height changes in production.
When is SFM-120-02-L-D-SN not the best choice for a product design?
SFM-120-02-L-D-SN is less suited to designs that need heavy blind-mate tolerance, sealed environmental protection, or very high current distribution through a single connector. It is also not ideal when the boards will experience significant relative movement after assembly, because fine-pitch board-to-board contacts prefer controlled mechanical alignment. In those cases, a ruggedized connector with polarization, enclosure features, or a dedicated power interface may fit the system constraints better.
How should I plan ground and return paths around SFM-120-02-L-D-SN?
With SFM-120-02-L-D-SN, return-path continuity should be defined before the pin map is finalized, especially if the connector carries fast digital edges or mixed-signal traffic. Keep return contacts adjacent to the active signals where possible, avoid routing across plane splits near the connector breakout, and maintain short, symmetric transitions on both boards. If multiple supplies or isolated grounds are involved, map the connector so the loop area stays small and crosstalk is minimized.
What reliability testing makes sense before releasing SFM-120-02-L-D-SN into long-life equipment?
For SFM-120-02-L-D-SN, the most useful validation usually includes thermal cycling, vibration, and mating-cycle checks, because those tests reveal solder-joint fatigue, contact fretting, and tolerance drift. The gold mating finish and beryllium copper contact system support stable electrical behavior, but the final lifetime still depends on board support, connector loading, and environmental cleanliness. In products that run for years, it is common to qualify the connector together with the full mechanical stack rather than testing the connector in isolation.

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