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Home > Products > Connectors, Interconnects > Rectangular Connectors - Board Spacers, Stackers (Board to Board) > MW-07-03-G-D-130-180-A-P-TR
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MW-07-03-G-D-130-180-A-P-TR

Manufacturer Part Number:
MW-07-03-G-D-130-180-A-P-TR
Manufacturer / Brand
Samtec Inc.
Part of Description:
CONN HDR 14POS 0.039 STACK SMD
Datasheets:
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 36221 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number MW-07-03-G-D-130-180-A-P-TR
Manufacturer / Brand Samtec Inc.
Stock Quantity 36221 pcs Stock
Category Connectors, Interconnects > Rectangular Connectors - Board Spacers, Stackers (Board to Board)
Description CONN HDR 14POS 0.039 STACK SMD
Lead Free Status / RoHS Status: ROHS3 Compliant
Termination Solder
Series Flex Stack, MW
Row Spacing 0.039" (1.00mm)
Pitch 0.039" (1.00mm)
Package Tape & Reel (TR)
Number of Rows 2
Number of Positions 14
Mounting Type Surface Mount
Length - Tail -
Length - Stack Height 0.130" (3.302mm)
Length - Post (Mating) 0.180" (4.572mm)
Length - Overall Pin 0.310" (7.874mm)
Contact Finish Thickness - Post (Mating) 10.0µin (0.25µm)
Contact Finish - Post (Mating) Gold
Color Black, Natural
Base Product Number MW-07-03

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

How do I know if MW-07-03-G-D-130-180-A-P-TR fits my board-to-board stack height and enclosure clearance?
MW-07-03-G-D-130-180-A-P-TR is suited for designs that need a fixed 3.302 mm stack height with a 1.0 mm pitch, but the final assembled height depends on PCB thickness, solder fillet, and mating-part tolerance. For tight enclosures, check worst-case Z-height using the full stack-up, including board warp, component height nearby, and any standoffs or shields.
Can MW-07-03-G-D-130-180-A-P-TR be used for blind-mate board stacking, or does it need alignment features?
MW-07-03-G-D-130-180-A-P-TR can work in board-to-board assemblies, but blind-mate use is usually more forgiving when the system includes guide pins, locating bosses, or chassis constraints. Without alignment features, lateral offset during mating can increase insertion stress and reduce contact wipe quality. If the boards are assembled in a fixed fixture, verify positional tolerance in both X/Y and angular alignment.
Is MW-07-03-G-D-130-180-A-P-TR suitable for high-speed or mixed-signal signals?
MW-07-03-G-D-130-180-A-P-TR can support moderate-speed board-to-board connections when the PCB escape, return path, and impedance are planned correctly. At 1.0 mm pitch, route adjacent ground references where possible and keep the interconnect short to limit discontinuities. For very fast serial links, run SI simulation with the full connector model and the actual stack-up rather than assuming the connector is transparent to the channel.
What PCB assembly details should I check before placing MW-07-03-G-D-130-180-A-P-TR in production?
For MW-07-03-G-D-130-180-A-P-TR, the key production checks are land pattern accuracy, placement coplanarity, and reflow profile compatibility. Fine-pitch SMT headers can be sensitive to paste volume and board flatness, so use the manufacturer-recommended footprint and confirm solder wetting on both rows. If the assembly is reflowed on both sides, verify that the first-side attachment remains stable through the second reflow cycle.
Is MW-07-03-G-D-130-180-A-P-TR a good choice for vibration-prone or industrial equipment?
MW-07-03-G-D-130-180-A-P-TR can be used in industrial assemblies when the boards are mechanically supported, but the connector alone should not be expected to carry large off-axis loads. In vibration or shock environments, add standoffs, board-to-chassis support, or other mechanical retention so the solder joints do not absorb repeated bending. If the application includes cable pull or frequent service movement, a locking interconnect or guided docking approach is usually easier to manage.
Can MW-07-03-G-D-130-180-A-P-TR replace another Samtec MW part with a different stack height?
MW-07-03-G-D-130-180-A-P-TR is easiest to replace with another Samtec MW family part when pitch, row spacing, footprint, and post length remain the same. If the replacement changes stack height or mating-post length, the boards may no longer clear nearby components or the mating pair may not fully engage. Before changing to a nearby MW variant, compare the land pattern and mechanical drawing rather than relying on the same series name alone.
Is MW-07-03-G-D-130-180-A-P-TR a drop-in replacement for 0.8 mm or 1.27 mm board-to-board connectors from other brands?
MW-07-03-G-D-130-180-A-P-TR is not a drop-in replacement for most 0.8 mm or 1.27 mm board-to-board connectors from brands such as Molex, Hirose, or Harwin because the pitch, row spacing, footprint, and mating geometry are different. A redesign usually needs new pad dimensions, new keep-out checks, and a review of mating counterpart compatibility. The trade-off is a smaller 1.0 mm interface, but the assembly tolerances become tighter than with larger-pitch connector families.
How should I plan the mating counterpart for MW-07-03-G-D-130-180-A-P-TR in a stacked-board design?
MW-07-03-G-D-130-180-A-P-TR should be paired with the matching Samtec Flex Stack receptacle or a verified compatible counterpart that matches the same pitch, row count, and stack geometry. If the mating part differs in wipe length or post engagement depth, contact reliability and separation height can change even if the footprint looks similar. For a new design, confirm the full connector pair as a system, not just the header by itself.
Is MW-07-03-G-D-130-180-A-P-TR appropriate for long-term field use and storage?
MW-07-03-G-D-130-180-A-P-TR is RoHS3 compliant and rated MSL1, so it does not require moisture-bake handling like moisture-sensitive parts. That simplifies storage and line readiness, but normal controls for ESD, cleanliness, and contamination still apply. In field use, keep the contact area protected from debris and excessive micro-motion so the gold-plated interface remains stable over time.
What should I consider if I need more pins or a different signal grouping than MW-07-03-G-D-130-180-A-P-TR provides?
If MW-07-03-G-D-130-180-A-P-TR does not provide enough positions, it is better to move to a larger MW family configuration that preserves the same pitch and mechanical style rather than stretching the existing footprint. Adding positions can change routing escape, board-edge clearance, and nearby component placement, especially in dense 1.0 mm-pitch designs. For a higher-density revision, re-check both the mechanical envelope and the signal assignment before freezing the PCB layout.

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MW-07-03-G-D-130-180-A-P-TR

Samtec Inc.

CONN HDR 14POS 0.039 STACK SMD

In Stock: 36221

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