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Home > Products > Connectors, Interconnects > Rectangular Connectors - Board Spacers, Stackers (Board to Board) > HW-20-12-F-D-745-SM
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HW-20-12-F-D-745-SM

Manufacturer Part Number:
HW-20-12-F-D-745-SM
Manufacturer / Brand
Samtec Inc.
Part of Description:
CONN HDR 40POS 0.1 STACK SMD
Datasheets:
HW-20-12-F-D-745-SM(1).pdfHW-20-12-F-D-745-SM(2).pdfHW-20-12-F-D-745-SM(3).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 37331 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number HW-20-12-F-D-745-SM
Manufacturer / Brand Samtec Inc.
Stock Quantity 37331 pcs Stock
Category Connectors, Interconnects > Rectangular Connectors - Board Spacers, Stackers (Board to Board)
Description CONN HDR 40POS 0.1 STACK SMD
Lead Free Status / RoHS Status: ROHS3 Compliant
Termination Solder
Series Flex Stack, HW
Row Spacing 0.100" (2.54mm)
Pitch 0.100" (2.54mm)
Package Bulk
Number of Rows 2
Number of Positions 40
Mounting Type Surface Mount
Length - Tail -
Length - Stack Height 0.745" (18.923mm)
Length - Post (Mating) 0.220" (5.588mm)
Length - Overall Pin 0.965" (24.511mm)
Contact Finish Thickness - Post (Mating) 3.00µin (0.076µm)
Contact Finish - Post (Mating) Gold
Color Black
Base Product Number HW-20-12

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

How do I verify whether HW-20-12-F-D-745-SM is the right stack height for my board-to-board spacing?
HW-20-12-F-D-745-SM is a 0.745 in (18.923 mm) stack height part, so the first check is whether your enclosure, daughtercard clearance, and mating connector height budget match that distance. In practice, engineers should account for PCB thickness, solder joint fillet, coplanarity, and any component keepouts near the connector before locking the stack-up.
Can HW-20-12-F-D-745-SM be used when the two boards may see vibration or repeated handling?
HW-20-12-F-D-745-SM is a surface-mount stacked header, so the mechanical load is carried by the solder terminations and the mated connector interface. For vibration or field service environments, designers usually evaluate board support, connector placement near stiff regions, and whether additional retention features or fasteners are needed to reduce stress on the SMT joints.
Is HW-20-12-F-D-745-SM suitable for mixed-voltage digital signals between boards?
HW-20-12-F-D-745-SM is a passive interconnect, so suitability depends on the signaling standard implemented on the connected boards rather than the connector itself. It is typically used where the board-to-board interface already has defined logic levels, return paths, and signal integrity margins; for fast edges or sensitive buses, the trace length, reference plane continuity, and pin assignment matter as much as the connector.
What should I check before replacing another Samtec stack connector with HW-20-12-F-D-745-SM?
When replacing a different Samtec part with HW-20-12-F-D-745-SM, confirm the same 0.100 in pitch, 2-row, 40-position layout, surface-mount footprint, and stack height. Even when the family is similar, small differences in post length, stack height, and tail geometry can change mechanical fit and mating alignment, so the PCB footprint and z-height should be cross-checked against the exact drawing.
Can HW-20-12-F-D-745-SM be used as a drop-in replacement for a through-hole board connector?
HW-20-12-F-D-745-SM is a surface-mount design, so it is not a direct replacement for a through-hole connector without footprint and assembly changes. The mechanical anchoring, solder process, and board loading are different, so a redesign is usually needed if the original layout relied on through-hole retention or wave soldering.
How does the gold contact finish on HW-20-12-F-D-745-SM affect long-term reliability?
HW-20-12-F-D-745-SM uses gold on the mating posts with a 3.00 µin finish, which is typically selected to improve contact stability in low-force interconnects and repeated mating cycles. In long-term use, the practical outcome depends on contamination, wipe action, mating frequency, and whether the interface stays within the intended current and mechanical loading envelope.
What PCB layout constraints are common with HW-20-12-F-D-745-SM in dense designs?
HW-20-12-F-D-745-SM uses a 2.54 mm pitch, dual-row SMT format, so nearby copper, paste apertures, and component keepouts should be arranged to preserve solderability and accessibility. Designers usually check for enough land pattern symmetry to avoid skew during reflow and leave room for mated-board overhang, test access, and rework tools.
Is HW-20-12-F-D-745-SM appropriate for power delivery between boards, or only for signals?
HW-20-12-F-D-745-SM can carry power or signals depending on the system design, but the usable current and thermal margin come from the full interconnect path, not just the connector family. For power distribution, engineers should review pin count allocation, current per contact, simultaneous current on adjacent pins, voltage drop, and heat rise in the mated assembly.
What factors matter when choosing HW-20-12-F-D-745-SM for an industrial product that must stay in service for years?
For industrial service, HW-20-12-F-D-745-SM should be evaluated for connector stress under temperature cycling, PCB flex, contamination exposure, and service access. The surface-mount attachment can perform well when the board is properly supported and the mating cycle count stays within the intended use case, but enclosure rigidity and maintenance strategy often dominate field reliability.
How do I compare HW-20-12-F-D-745-SM with alternative 0.100 in stack headers from other brands?
HW-20-12-F-D-745-SM should be compared against alternatives on stack height tolerance, post length, contact plating, SMT footprint, and available mating compliance rather than just position count. Different brands can have small mechanical differences that affect board spacing, connector engagement, and assembly yield, so the approved footprint and height stack should be verified before substitution.

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HW-20-12-F-D-745-SM

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