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Home > Products > Connectors, Interconnects > Rectangular Connectors - Board Spacers, Stackers (Board to Board) > HW-09-20-S-S-375-SM
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HW-09-20-S-S-375-SM

Manufacturer Part Number:
HW-09-20-S-S-375-SM
Manufacturer / Brand
Samtec Inc.
Part of Description:
CONN HDR 9POS 0.1 STACK SMD GOLD
Datasheets:
HW-09-20-S-S-375-SM(1).pdfHW-09-20-S-S-375-SM(2).pdfHW-09-20-S-S-375-SM(3).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 49724 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number HW-09-20-S-S-375-SM
Manufacturer / Brand Samtec Inc.
Stock Quantity 49724 pcs Stock
Category Connectors, Interconnects > Rectangular Connectors - Board Spacers, Stackers (Board to Board)
Description CONN HDR 9POS 0.1 STACK SMD GOLD
Lead Free Status / RoHS Status: ROHS3 Compliant
Termination Solder
Series Flex Stack, HW
Row Spacing -
Pitch 0.100" (2.54mm)
Package Bulk
Number of Rows 1
Number of Positions 9
Mounting Type Surface Mount
Length - Tail -
Length - Stack Height 0.375" (9.525mm)
Length - Post (Mating) 0.690" (17.526mm)
Length - Overall Pin 1.065" (27.051mm)
Contact Finish Thickness - Post (Mating) 30.0µin (0.76µm)
Contact Finish - Post (Mating) Gold
Color Black
Base Product Number HW-09-20

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

For HW-09-20-S-S-375-SM, how do I verify that the 0.375" stack height matches my board-to-board clearance and connector engagement depth?
With HW-09-20-S-S-375-SM, the stack height is fixed at 0.375" (9.525 mm), so the practical check is whether your PCB spacing, coplanarity, and enclosure keep-out allow the full mating length without bottoming out or over-stressing the solder joints. In stackable header designs, the usable height also depends on any solder mask swell, assembly tolerance, and component height near the connector field.
Can HW-09-20-S-S-375-SM be used as a replacement for a different Samtec 0.100" stackable header without changing the PCB footprint?
HW-09-20-S-S-375-SM is part of Samtec’s Flex Stack HW family, but replacement compatibility depends on pin count, pitch, stack height, and tail geometry matching the existing footprint. A same-pitch part may still require layout changes if the original connector used a different overall pin length, post length, or mounting style. For a drop-in replacement, HW-09-20-S-S-375-SM should be checked against the original part’s mechanical drawing rather than only the series name.
Is HW-09-20-S-S-375-SM suitable for signal interconnects that need low-profile board stacking in compact industrial equipment?
HW-09-20-S-S-375-SM is a 9-position, 2.54 mm pitch stack spacer connector that works well when the design needs a simple vertical interconnect with moderate density. It fits compact assemblies when the board spacing is around 0.375", but it is less appropriate if the application needs very high pin count, differential pair control, or tighter impedance management than a single-row 0.100" header usually supports.
What PCB assembly issues should I check before using HW-09-20-S-S-375-SM on a production surface-mount design?
HW-09-20-S-S-375-SM is a surface-mount solder part, so the main production checks are pad geometry, solder paste volume, reflow profile, and board flatness under the connector body. Because it is a stackable header with tall posts, uneven solder wetting can create tilt or heel stress if the PCB is not well supported during reflow. A stencil and footprint review against Samtec’s recommended land pattern is usually the right starting point.
Can HW-09-20-S-S-375-SM handle repeated mating in a field-serviceable product?
HW-09-20-S-S-375-SM uses gold plating on the mating post contact area, which helps with contact stability in repeated mate cycles and in environments where oxidation is a concern. For field-serviceable use, the practical limits come from insertion alignment, mechanical side loading, and how often the stack is disconnected. If the product will be serviced frequently, the connector should be supported by the enclosure and PCB so the solder joints are not carrying repeated pry forces.
What should I consider if I want to replace HW-09-20-S-S-375-SM with a connector from another brand?
A replacement for HW-09-20-S-S-375-SM should be matched not only by 9 positions and 2.54 mm pitch, but also by stack height, post length, surface-mount footprint, and plating thickness. Another brand may advertise the same pitch while using different post geometry or recommended land patterns, which can change the mechanical stack height or the solder joint reliability. In migration work, the board outline and mating envelope usually need to be checked first, then the electrical fit.
Is HW-09-20-S-S-375-SM a good choice for harsh-environment or long-life industrial assemblies?
HW-09-20-S-S-375-SM can be appropriate for industrial hardware when the operating environment is controlled and the connector is protected from vibration, shock, and contamination. The gold-plated mating surface supports contact reliability, but long-life performance still depends on board support, connector retention, thermal cycling range, and whether the assembly sees mechanical strain from cable harnesses or mating boards. For harsher conditions, designers often verify retention and vibration behavior in the actual enclosure.
How do I know whether HW-09-20-S-S-375-SM is enough for my I/O count, or whether I should move to a higher-density connector?
HW-09-20-S-S-375-SM provides 9 positions in a single row, so it is best when the interface is small and the signal set is straightforward. If the design needs power plus multiple control, status, and high-speed lines, the pin count may become limiting quickly, and a higher-density connector or multi-row option may reduce board space and improve routing efficiency. The trade-off is usually between simplicity of assembly and total interconnect capacity.
Does HW-09-20-S-S-375-SM require any special considerations for mixed-voltage boards or signal level translation?
HW-09-20-S-S-375-SM is only the physical interconnect, so mixed-voltage compatibility depends on the circuitry on each side of the connector. The practical check is whether the mating boards share a common reference, whether the pin assignment keeps higher-voltage nets isolated from low-voltage logic, and whether creepage or clearance needs are met for the system voltage. For mixed-voltage designs, connector pinout discipline matters more than the connector itself.
When migrating from a through-hole stack header, what changes should I expect with HW-09-20-S-S-375-SM?
HW-09-20-S-S-375-SM is a surface-mount part, so migration from a through-hole stack header usually changes both assembly flow and mechanical behavior. The PCB footprint must provide adequate solder area, and the design may need additional anchoring support if the connector sees side loads during mating. The benefit is lower assembly profile and easier automated placement; the trade-off is reduced tolerance for board flex and connector misuse during handling.

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