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FW-30-03-F-D-304-075-A

Manufacturer Part Number:
FW-30-03-F-D-304-075-A
Manufacturer / Brand
Samtec Inc.
Part of Description:
CONN HDR 60POS 0.05 STACK SMD
Datasheets:
FW-30-03-F-D-304-075-A(1).pdfFW-30-03-F-D-304-075-A(2).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 43306 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number FW-30-03-F-D-304-075-A
Manufacturer / Brand Samtec Inc.
Stock Quantity 43306 pcs Stock
Category Connectors, Interconnects > Rectangular Connectors - Board Spacers, Stackers (Board to Board)
Description CONN HDR 60POS 0.05 STACK SMD
Lead Free Status / RoHS Status: ROHS3 Compliant
Termination Solder
Series Flex Stack, FW
Row Spacing 0.050" (1.27mm)
Pitch 0.050" (1.27mm)
Package Bulk
Number of Rows 2
Number of Positions 60
Mounting Type Surface Mount
Length - Tail -
Length - Stack Height 0.304" (7.722mm)
Length - Post (Mating) 0.075" (1.905mm)
Length - Overall Pin 0.379" (9.627mm)
Contact Finish Thickness - Post (Mating) 3.00µin (0.076µm)
Contact Finish - Post (Mating) Gold
Color Black
Base Product Number FW-30-03

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

How do I know if FW-30-03-F-D-304-075-A is the right stack height for my board-to-board layout?
FW-30-03-F-D-304-075-A is a 0.304" (7.722 mm) stack-height part, so it fits designs where the two boards need that specific separation for enclosure clearance, connector-to-component keepout, or mating-pin engagement. In a Samtec FW-30-03-F-D-304-075-A design-in, the key check is not only nominal spacing but also tolerance stack-up across PCB thickness, solder fillet height, coplanarity, and any mechanical standoffs that share the load.
Can FW-30-03-F-D-304-075-A be used when the mating boards have different PCB thicknesses?
Yes, FW-30-03-F-D-304-075-A can often tolerate different PCB thicknesses, but the usable stack-up depends on the combined height of both assemblies and the alignment of the mating connector. For mixed-thickness boards, verify that the mating post length still provides reliable engagement after accounting for PCB thickness variation, assembly tolerances, and any local warp. In practice, the Samtec FW-30-03-F-D-304-075-A footprint should be checked against the exact board stack, not just the nominal connector height.
What should I check before replacing another board-to-board connector with FW-30-03-F-D-304-075-A?
When replacing an existing part with FW-30-03-F-D-304-075-A, compare the pitch, row spacing, overall pin length, mating post length, and surface-mount footprint, not just the pin count. A 1.27 mm pitch, 2-row connector may look similar to other Samtec or competitor parts, but small differences in post length or plastic body geometry can affect mating depth, retention, and nearby component clearance. A direct swap for FW-30-03-F-D-304-075-A usually requires footprint and stack-height validation.
Is FW-30-03-F-D-304-075-A suitable for high-vibration industrial equipment?
FW-30-03-F-D-304-075-A can be used in industrial assemblies, but vibration performance depends heavily on the mechanical design around it. Because it is a surface-mount stack connector, the PCB support, connector placement, and any board stiffening matter. For FW-30-03-F-D-304-075-A in vibration-prone systems, designers usually verify solder joint strain, board flex, and whether additional fastening or enclosure support is needed to reduce connector stress over time.
Can FW-30-03-F-D-304-075-A be used for signal and power lines on the same connector?
FW-30-03-F-D-304-075-A can carry mixed signals if the pin assignment and current loading are designed conservatively. The connector itself does not define safe power distribution by default, so you need to map high-current nets to pins and planes with enough margin and keep sensitive signals away from noisy returns where possible. For FW-30-03-F-D-304-075-A, the real design question is whether the pinout, trace widths, and thermal rise all stay within your system limits.
What are the main risks when using FW-30-03-F-D-304-075-A in a dense high-speed board-to-board interface?
The main risks are signal integrity, crosstalk, and return-path discontinuity. FW-30-03-F-D-304-075-A uses a 1.27 mm pitch and 2-row arrangement, which can be workable for many digital interfaces, but high-edge-rate buses still need controlled impedance, short stub lengths, and solid reference planes. If the interface carries very fast clocks or SERDES-style traffic, validate the interconnect with the actual PCB stack-up and connector model rather than assuming pin count alone is sufficient.
How does the gold contact finish on FW-30-03-F-D-304-075-A affect long-term reliability?
FW-30-03-F-D-304-075-A uses a gold finish on the mating posts with 3.00 µin thickness, which helps with oxidation resistance and contact stability in low-level signal applications. In long-term use, reliability still depends on contact normal force, mating cycle count, contamination control, and whether the environment contains sulfur, humidity, or airborne residue. For FW-30-03-F-D-304-075-A, gold finish is helpful, but the system-level sealing and handling process remain part of the reliability picture.
Is FW-30-03-F-D-304-075-A appropriate for manual assembly or rework?
FW-30-03-F-D-304-075-A is a surface-mount connector, so it is usually more sensitive to placement accuracy and coplanarity than through-hole parts. Manual rework is possible in some production environments, but the risk profile includes pad damage, misalignment, and uneven soldering across the 60 positions. If FW-30-03-F-D-304-075-A must be reworked, the process should be controlled with appropriate tooling, inspection criteria, and board support.
What alternatives should I consider if I need a different stack height than FW-30-03-F-D-304-075-A?
If your enclosure or board spacing does not match FW-30-03-F-D-304-075-A, look within the Samtec Flex Stack FW family for a different stack height while keeping the same pitch and row count where possible. The main trade-off is that changing height can affect mating tolerance, mechanical stability, and signal path length. A close substitute for FW-30-03-F-D-304-075-A should be chosen from the same family when you want to preserve footprint compatibility, but the exact post and stack dimensions still need verification.
Can FW-30-03-F-D-304-075-A be used in products exposed to temperature cycling?
FW-30-03-F-D-304-075-A can be used in temperature-cycling environments if the PCB, solder alloy, and mechanical constraints are designed for it. The primary concerns are differential expansion between boards, connector body stress, and solder-joint fatigue from repeated thermal movement. In an FW-30-03-F-D-304-075-A application, designers usually confirm that board spacing, anchor support, and assembly process minimize strain across the expected operating range.
How do I verify that FW-30-03-F-D-304-075-A will mate correctly with the opposite board assembly?
For FW-30-03-F-D-304-075-A, verify the mating partner’s compatible pin header style, row spacing, and engagement depth, then check the finished board-to-board distance after soldering. Even when the part numbers look compatible, differences in board thickness, component height under the connector, or solder paste volume can change the final position. A practical fit check for FW-30-03-F-D-304-075-A includes mechanical drawings, PCB stack-up review, and a physical first article.
Is FW-30-03-F-D-304-075-A a good choice when I need a compact connector for a long-life industrial product?
FW-30-03-F-D-304-075-A can fit compact industrial designs because it combines a fine 1.27 mm pitch with a high pin count in a relatively small footprint. For long-life products, the deciding factors are usually not the connector size alone but the expected mating cycle count, shock/vibration exposure, contamination level, and whether field replacement is needed. FW-30-03-F-D-304-075-A is a reasonable candidate when the enclosure and reliability targets align with a low-profile board-to-board stack connection.

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FW-30-03-F-D-304-075-A

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