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Home > Products > Connectors, Interconnects > Rectangular Connectors - Board Spacers, Stackers (Board to Board) > FW-13-05-G-D-483-150-A-P
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FW-13-05-G-D-483-150-A-P

Manufacturer Part Number:
FW-13-05-G-D-483-150-A-P
Manufacturer / Brand
Samtec Inc.
Part of Description:
CONN HDR 26POS 0.05 STACK SMD
Datasheets:
FW-13-05-G-D-483-150-A-P(1).pdfFW-13-05-G-D-483-150-A-P(2).pdfFW-13-05-G-D-483-150-A-P(3).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 44864 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number FW-13-05-G-D-483-150-A-P
Manufacturer / Brand Samtec Inc.
Stock Quantity 44864 pcs Stock
Category Connectors, Interconnects > Rectangular Connectors - Board Spacers, Stackers (Board to Board)
Description CONN HDR 26POS 0.05 STACK SMD
Lead Free Status / RoHS Status: ROHS3 Compliant
Termination Solder
Series Flex Stack, FW
Row Spacing 0.050" (1.27mm)
Pitch 0.050" (1.27mm)
Package Bulk
Number of Rows 2
Number of Positions 26
Mounting Type Surface Mount
Length - Tail -
Length - Stack Height 0.483" (12.268mm)
Length - Post (Mating) 0.150" (3.810mm)
Length - Overall Pin 0.633" (16.078mm)
Contact Finish Thickness - Post (Mating) 10.0µin (0.25µm)
Contact Finish - Post (Mating) Gold
Color Black
Base Product Number FW-13-05

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can FW-13-05-G-D-483-150-A-P be used in a board stack where the two PCBs may shift slightly during assembly or thermal cycling?
FW-13-05-G-D-483-150-A-P can work in stacked-board assemblies, but the 1.27 mm pitch and surface-mount termination require controlled coplanarity and registration between both PCBs. In designs with board-to-board tolerance buildup, thermal expansion, or repeated vibration, it is common to verify lateral alignment, connector footprint accuracy, and allowable board warp so the mating posts do not see side load. For long-term reliability, the stack height and enclosure constraints should be checked together, not separately.
What should I check before replacing another 26-position 1.27 mm board spacer with FW-13-05-G-D-483-150-A-P?
When replacing an existing 26-position board spacer with FW-13-05-G-D-483-150-A-P, match more than pin count and pitch. Confirm stack height, mating post length, pad layout, row spacing, and overall envelope so the replacement preserves both electrical clearance and mechanical engagement. The 0.483" stack height and 0.150" mating post length can change connector engagement depth, nearby component keepouts, and enclosure clearance even if the pin count appears identical.
Is FW-13-05-G-D-483-150-A-P suitable for high-speed signals on a compact interconnect?
FW-13-05-G-D-483-150-A-P may be used in high-density interconnects where 1.27 mm pitch is acceptable, but signal performance depends on the full channel, not the connector alone. Trace geometry, return path continuity, pad design, and mating pair symmetry all affect crosstalk and impedance discontinuity. For faster interfaces, it is normal to validate insertion loss, rise-time degradation, and pair-to-pair coupling in the actual PCB stack-up before committing to production.
Can FW-13-05-G-D-483-150-A-P be soldered by standard SMT reflow, or does it need a special process?
FW-13-05-G-D-483-150-A-P is a surface-mount connector, so it is generally intended for SMT assembly processes. In practice, the key checks are land pattern fidelity, paste volume, connector coplanarity, and whether the surrounding assembly can tolerate the connector’s thermal mass during reflow. Because connector alignment is less forgiving than small passive parts, fixture support and inspection criteria are usually set carefully for first article builds.
How do I decide whether FW-13-05-G-D-483-150-A-P is appropriate for a product that will see vibration or repeated handling?
FW-13-05-G-D-483-150-A-P can be used in products with moderate mechanical stress if the PCB support and enclosure design keep the connector from carrying excessive leverage. For vibration-prone systems, the practical questions are board thickness, support points near the connector, expected mating cycles, and whether the stack will be serviced in the field. If the assembly is frequently unplugged or mechanically abused, a design review should include retention strategy and fatigue risk, not only electrical fit.
What are the main trade-offs between FW-13-05-G-D-483-150-A-P and a through-hole board stacking header?
FW-13-05-G-D-483-150-A-P trades board retention and hole robustness for a smaller SMT footprint and simpler automated placement. Compared with through-hole stacking headers, it can reduce assembly height and free routing area, but it usually places more responsibility on PCB land design and solder joint quality for mechanical stability. If the application has heavy connectors, high shock, or manual service stress, a through-hole alternative may tolerate abuse better.
Can FW-13-05-G-D-483-150-A-P be used as a drop-in replacement for a different Samtec FW series part with the same pitch?
FW-13-05-G-D-483-150-A-P is only a practical drop-in if the other Samtec FW part matches the same 26-position, 1.27 mm, 2-row geometry and the same stack height family. Even within the FW series, differences in pin length, stack height, or tail configuration can change mating engagement and board spacing. A replacement review should compare the full mechanical drawing, not just the family name.
Does the gold contact finish on FW-13-05-G-D-483-150-A-P affect its use in low-level signal or low-voltage designs?
The gold finish on FW-13-05-G-D-483-150-A-P is useful in low-level signal paths because it helps maintain stable contact behavior over repeated mating and in lower-current applications. For very small analog or sensor signals, the more relevant issue is the connector interface’s long-term contact consistency, along with contamination control and mating cleanliness. In mixed-signal boards, it is still wise to keep sensitive nets away from high-edge-rate or noisy return paths.
What design checks matter if FW-13-05-G-D-483-150-A-P is used in an industrial controller that may run for years?
For long-life industrial use, FW-13-05-G-D-483-150-A-P should be evaluated for solder joint reliability, corrosion exposure, thermal cycling, and connector access during maintenance. The MSL 1 rating simplifies storage and handling, but it does not remove the need to validate the full assembly against temperature range, airflow, dust, and vibration in the final enclosure. Field-replaceability and inspection access also matter if the connector will be used as part of a modular subsystem.
When would FW-13-05-G-D-483-150-A-P not be the right choice?
FW-13-05-G-D-483-150-A-P is less suitable when the design needs very high current, large pin pitch for manual wiring, extremely high mating-force margin, or strong through-hole mechanical anchoring. It is also not the best fit if the application requires frequent blind mating with significant misalignment tolerance. In those cases, a connector with larger geometry, stronger retention, or a different mounting style is usually a better mechanical match.

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FW-13-05-G-D-483-150-A-P

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