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FTMH-132-02-L-DV-ES-A

In Stock 7437 pcs Reference Price(In US Dollars)
17+
$12.6078
Manufacturer Part Number:
FTMH-132-02-L-DV-ES-A
Manufacturer / Brand
Samtec Inc.
Part of Description:
CONN HEADER SMD 64POS 1MM
Datasheets:
FTMH-132-02-L-DV-ES-A(1).pdfFTMH-132-02-L-DV-ES-A(2).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 7437 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number FTMH-132-02-L-DV-ES-A
Manufacturer / Brand Samtec Inc.
Stock Quantity 7437 pcs Stock
Category Connectors, Interconnects > Rectangular Connectors - Headers, Male Pins
Description CONN HEADER SMD 64POS 1MM
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage Rating -
Termination Solder
Style Board to Board
Shrouding Unshrouded
Series FTMH
Row Spacing - Mating 0.039" (1.00mm)
Pitch - Mating 0.039" (1.00mm)
Package Tube
Overall Contact Length -
Operating Temperature -55°C ~ 125°C
Number of Rows 2
Number of Positions Loaded All
Number of Positions 64
Mounting Type Surface Mount
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Insulation Height 0.059" (1.50mm)
Insulation Color Black
Ingress Protection -
Features Board Guide, End Shrouds
Fastening Type Push-Pull
Current Rating (Amps) 2.8A per Contact
Contact Type Male Pin
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post -
Contact Length - Mating 0.075" (1.90mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Tin
Contact Finish - Mating Gold
Connector Type Header
Base Product Number FTMH-132
Applications -

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key design constraints when integrating the FTMH-132-02-L-DV-ES-A into a high-density board-to-board application with limited PCB real estate?
The FTMH-132-02-L-DV-ES-A offers 64 positions in a 2-row configuration at 1.00mm pitch, resulting in a compact footprint suitable for space-constrained designs. However, the unshrouded design and 1.00mm pitch require careful layout planning to avoid crosstalk on adjacent signal traces, particularly for high-speed digital or analog signals. The surface mount termination demands precise solder reflow profiles to ensure reliable contact formation, and the push-pull fastening mechanism necessitates adequate clearance on the mating board for connector insertion and removal cycles.
Can the FTMH-132-02-L-DV-ES-A handle mixed-signal applications combining high-current power delivery with low-level analog or clock signals on the same connector?
The FTMH-132-02-L-DV-ES-A supports up to 2.8A per contact, making it suitable for moderate power distribution across multiple pins. However, routing power and signal lines through the same unshrouded header introduces risks of electromagnetic coupling and signal integrity degradation, particularly for analog or RF signals. Best practice involves segregating power planes, using dedicated ground return paths adjacent to signal traces, and considering separate connector sections or daughterboard layout techniques to minimize cross-talk within the FTMH-132-02-L-DV-ES-A assembly.
What are the reliability considerations for the FTMH-132-02-L-DV-ES-A in outdoor or extended temperature industrial environments?
The FTMH-132-02-L-DV-ES-A operates across -55°C to 125°C, meeting wide industrial temperature ranges. The liquid crystal polymer (LCP) insulation material maintains mechanical stability across this range, and the gold-plated mating contacts (0.25µm thickness) provide corrosion resistance in humid conditions. However, the unshrouded design exposes contacts to potential moisture ingress; conformal coating or environmental sealing around the FTMH-132-02-L-DV-ES-A connector body is recommended for outdoor deployments. The MSL 1 rating indicates no moisture sensitivity concerns during storage, reducing handling complexity in field inventory scenarios.
How does the contact finish specification of the FTMH-132-02-L-DV-ES-A (gold mating surface, tin post) affect long-term mating cycle reliability?
The FTMH-132-02-L-DV-ES-A employs a 10.0µin (0.25µm) gold plating on mating contacts to reduce insertion force and fretting corrosion, while tin plating on the post provides cost-effective solderability. This asymmetric finish combination typically delivers stable contact resistance over 1000+ mating cycles. Concerns arise when the connector undergoes frequent hot-swap operations or when vibration-induced micro-motion occurs; in such cases, the relatively thin gold layer on FTMH-132-02-L-DV-ES-A may wear through to the base phosphor bronze, increasing contact resistance. For high-cycle applications, periodic inspection of contact condition and consideration of nickel or thicker gold plating alternatives may be warranted.
What is the mating interface specification for the FTMH-132-02-L-DV-ES-A, and what receptacle options are available for design-in?
The FTMH-132-02-L-DV-ES-A is a male pin header with square contact geometry and 1.90mm mating contact length, designed for use with Samtec FTMH series receptacles (such as FTMH-1XX-01-x-DV-ES-x variants) in a push-pull board-to-board configuration. When sourcing a mating receptacle, confirm that the receptacle's contact retention force and insulation height are compatible with the 0.059" (1.50mm) insulation height of the FTMH-132-02-L-DV-ES-A to avoid mechanical misalignment or contact separation. Cross-manufacturer receptacles may introduce impedance mismatches for high-speed signals or altered mating force profiles; validation testing is recommended before production use.
How does the FTMH-132-02-L-DV-ES-A compare to legacy 2.54mm pitch connectors or finer-pitch alternatives like 0.8mm headers in terms of design tradeoffs?
The FTMH-132-02-L-DV-ES-A at 1.00mm pitch occupies roughly one-sixth the footprint of equivalent 2.54mm pitch headers while supporting similar current ratings (2.8A per contact), making it attractive for miniaturized applications. Compared to 0.8mm pitch alternatives, the FTMH-132-02-L-DV-ES-A offers easier assembly handling, lower soldering defect rates, and reduced crosstalk sensitivity due to wider trace spacing. However, 0.8mm systems may offer slightly higher density at the cost of tighter PCB layout tolerances and more stringent reflow process control. The choice depends on production volume, assembly capability, and target form factor; the FTMH-132-02-L-DV-ES-A balances density and manufacturability effectively for moderate-volume industrial designs.
What are the solder joint reliability concerns specific to the surface mount termination of the FTMH-132-02-L-DV-ES-A?
Surface mount connectors like the FTMH-132-02-L-DV-ES-A experience higher mechanical stress at solder joints during thermal cycling and vibration compared to through-hole designs. The push-pull fastening mechanism induces lateral forces during mating, transferring stress to the solder interface. To mitigate joint failure, the PCB layout should incorporate wide solder pads (per IPC-2221 guidelines for 1.00mm pitch), controlled solder fillet profiles achieved through optimized stencil design, and underfill or adhesive reinforcement if vibration exposure is anticipated. The phosphor bronze contact material and LCP insulation of the FTMH-132-02-L-DV-ES-A are compatible with lead-free solder (SAC alloys), but peak reflow temperatures must not exceed 260°C to avoid insulation degradation.
Is the FTMH-132-02-L-DV-ES-A suitable as a direct replacement for legacy Samtec or third-party connectors in existing designs?
The FTMH-132-02-L-DV-ES-A may serve as a replacement only if the legacy connector shares identical pitch (1.00mm), row spacing (1.00mm), contact length (1.90mm), and mating receptacle compatibility. Differences in contact finish thickness, insulation height, or shrouding style can render the FTMH-132-02-L-DV-ES-A mechanically incompatible or introduce impedance changes in high-speed applications. Before adopting the FTMH-132-02-L-DV-ES-A as a drop-in substitute, verify mating force specifications, receptacle availability, and conduct functional testing on a prototype board. Documentation of the original connector's performance baseline (contact resistance, insertion loss, crosstalk) should inform acceptance criteria for the FTMH-132-02-L-DV-ES-A migration.
How does the board guide and end shroud feature of the FTMH-132-02-L-DV-ES-A improve assembly or field reliability?
The board guide feature of the FTMH-132-02-L-DV-ES-A aids self-alignment during soldering, reducing skew and bridging defects on high-density PCB layouts. The end shrouds provide mechanical keying and lateral strain relief, preventing accidental cross-mating with incompatible receptacles and reducing stress concentration on edge contacts. In field conditions, the shrouds protect the FTMH-132-02-L-DV-ES-A from incidental contact with conductive debris or moisture ingress at the connector edges. For vibration-prone applications, the shroud design distributes mating force more evenly across the contact array, reducing localized wear patterns.
What environmental compliance and supply chain considerations apply to the FTMH-132-02-L-DV-ES-A?
The FTMH-132-02-L-DV-ES-A is RoHS3 compliant and carries MSL 1 rating, indicating no moisture-sensitivity restrictions during storage or handling. The UL94 V-0 flammability rating of the LCP insulation material satisfies safety requirements for consumer and industrial applications. ECCN classification as EAR99 permits export without licensing restrictions for most commercial destinations. Samtec maintains FTMH-132-02-L-DV-ES-A production across multiple facilities, reducing single-source risk; however, the 1.00mm pitch and specific shrouding geometry limit immediate cross-manufacturer substitutes. Supply planning should account for lead times typical of semi-custom connectors and confirm long-term availability commitments from the distributor.

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