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ESW-102-14-T-S

In Stock 61754 pcs Reference Price(In US Dollars)
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$0.8209
200+
$0.3287
500+
$0.317
1000+
$0.3126
Manufacturer Part Number:
ESW-102-14-T-S
Manufacturer / Brand
Samtec Inc.
Part of Description:
CONN SOCKET 2POS 0.1 TIN PCB
Datasheets:
ESW-102-14-T-S(1).pdfESW-102-14-T-S(2).pdfESW-102-14-T-S(3).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 61754 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number ESW-102-14-T-S
Manufacturer / Brand Samtec Inc.
Stock Quantity 61754 pcs Stock
Category Connectors, Interconnects > Rectangular Connectors - Headers, Receptacles, Female Sockets
Description CONN SOCKET 2POS 0.1 TIN PCB
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage Rating 550VAC
Termination Solder
Style Board to Board
Series ESW
Row Spacing - Mating -
Pitch - Mating 0.100" (2.54mm)
Package Bulk
Operating Temperature -55°C ~ 105°C
Number of Rows 1
Number of Positions Loaded All
Number of Positions 2
Mounting Type Through Hole
Material Flammability Rating UL94 V-0
Mated Stacking Heights -
Insulation Material Liquid Crystal Polymer (LCP)
Insulation Height 0.435" (11.05mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) 5.2A per Contact
Contact Type Forked
Contact Shape Square
Contact Material Phosphor Bronze
Contact Length - Post 0.480" (12.19mm)
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating -
Contact Finish - Post Tin
Contact Finish - Mating Tin
Connector Type Elevated Socket
Base Product Number ESW-102
Applications -

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

ESW-102-14-T-S can be used on a board-to-board design, but what spacing and alignment checks should I make before committing to it?
For ESW-102-14-T-S, confirm that the mating board can tolerate a 2.54 mm pitch, single-row, 2-position layout, and that the elevated socket height of 11.05 mm matches the mechanical stack-up. Because it is a through-hole board-to-board connector with a forked contact style, lateral misalignment and board-to-board coplanarity can affect insertion feel and contact reliability. In practice, it helps to verify hole placement tolerances, board thickness, and keep-out around the elevated body before finalizing the footprint.
Is ESW-102-14-T-S suitable if my design needs higher current on one rail and signal contacts on the same connector?
ESW-102-14-T-S is rated at 5.2 A per contact, so it can support moderate-power rails when the PCB trace width, copper weight, and temperature rise are checked together with the connector rating. If the connector is used for both power and signals, keep in mind that only two positions are available, so any mixed-power use leaves no spare pins for redundancy or shielding. For designs with frequent inrush current or elevated ambient temperature, it is wise to derate the contact current rather than relying on the nameplate value alone.
Can ESW-102-14-T-S be used in a replacement design where the previous connector was a different brand with the same 2.54 mm pitch?
ESW-102-14-T-S can sometimes replace other 2.54 mm board-to-board socket styles, but the footprint must be checked carefully because elevated socket geometry, post length, and mating depth often differ between manufacturers. A like-for-like pitch match does not guarantee compatible stack height, insertion force, or hole pattern. When migrating from another brand, compare the board-to-board spacing, contact engagement depth, and the mating header style to avoid mechanical interference or weak retention.
What should I check if I want to replace an existing 2-pin connector with ESW-102-14-T-S on an industrial board?
When replacing an existing connector with ESW-102-14-T-S, verify three areas: through-hole pad size, board thickness tolerance, and mating part compatibility. Because ESW-102-14-T-S uses tin-plated forked contacts, the mating surface behavior can differ from gold-plated alternatives, especially in low-level signal paths or environments with vibration. For industrial retrofits, it is also useful to confirm whether the original connector relied on a different retention mechanism, since this part uses push-pull fastening rather than latching hardware.
Does ESW-102-14-T-S work well for power distribution between two PCBs in a compact enclosure?
ESW-102-14-T-S can be used for short board-to-board power links in compact enclosures if the 11.05 mm elevated height fits the mechanical envelope and the two contacts are enough for the required return path or dual-rail arrangement. For power distribution, the design should account for contact resistance, trace current carrying capacity, and thermal buildup near the connector body. If the enclosure has limited airflow or the boards see prolonged load, validating temperature rise under worst-case current is a practical step.
How should I think about tin-plated contacts on ESW-102-14-T-S for long-term reliability?
ESW-102-14-T-S uses tin finish on both mating and post contacts, which is commonly used in cost-sensitive and solder-friendly designs. For long-term use, tin can perform well when the interface is not frequently exposed to very low-level signals or harsh fretting conditions. If the application involves vibration, repeated mating cycles, or low-voltage logic with minimal wetting current, it is useful to evaluate whether the contact environment and maintenance interval are compatible with tin-on-tin performance.
Is ESW-102-14-T-S a good choice for low-level analog or sensor signals?
ESW-102-14-T-S may be used for some analog or sensor links, but tin contact finish and forked contact construction can be less forgiving than higher-grade mixed-signal interconnects when the signal level is very small. In low-level applications, contact stability, micro-motion, and contamination become more visible in the system behavior. If the sensor interface is sensitive to offset drift or intermittent contact noise, it is sensible to compare this connector against a version with a different plating strategy or more dedicated signal-contact architecture.
What PCB assembly considerations are specific to ESW-102-14-T-S?
ESW-102-14-T-S is a through-hole, solder-terminated connector, so solder fill, hole plating, and reflow or wave process compatibility should be reviewed during assembly planning. Because it is a bulk-packaged part, pick-and-place handling and insertion fixtures may be needed depending on line setup. The elevated body also means adjacent component clearances should be checked so that soldering access and cleaning paths remain practical.
Can ESW-102-14-T-S be used in a design that experiences shock or vibration?
ESW-102-14-T-S can be used in vibration-prone equipment if the board support, solder joint quality, and connector orientation are controlled. Since the fastening type is push-pull and the contact system is forked, the assembly depends on proper mechanical engagement and stable PCB mounting rather than a separate latch. For moving equipment, it helps to test the connector under the actual vibration spectrum and board resonance conditions, especially if the interface carries both power and control lines.
What are the main trade-offs of using ESW-102-14-T-S instead of a higher-density connector?
ESW-102-14-T-S offers a simple 2-position interface with 2.54 mm pitch and an elevated socket profile, which makes it straightforward for compact board-to-board links. The trade-off is limited pin count, so it is not suited for applications needing many signals, dedicated grounds, or differential pairs. If the design may expand later, engineers often reserve extra footprint area or choose a family with more positions to avoid a future mechanical redesign.
How do I know whether ESW-102-14-T-S is acceptable for a wide-temperature industrial product?
ESW-102-14-T-S is specified for -55°C to 105°C, which covers many industrial temperature profiles. In a real product, the connector should still be checked against board self-heating, enclosure hot spots, and any nearby power components that may raise local temperature beyond ambient. LCP insulation and UL94 V-0 flammability rating support harsh-environment use, but the full assembly should be validated at the actual operating temperature and humidity profile of the end system.
If I need an alternative to ESW-102-14-T-S, what should I compare besides the part number?
When evaluating alternatives to ESW-102-14-T-S, compare stack height, contact finish, insertion force, mounting style, and hole pattern rather than only the 2.54 mm pitch. A connector from another series may appear similar on paper but still change the board spacing, retention feel, or mating depth enough to affect enclosure fit and assembly yield. For a migration project, building a mechanical cross-check against the mating header and the PCB stack-up is the most direct way to confirm compatibility.

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