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Home > Products > Connectors, Interconnects > Rectangular Connectors - Board Spacers, Stackers (Board to Board) > DW-21-13-F-S-975
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DW-21-13-F-S-975

Manufacturer Part Number:
DW-21-13-F-S-975
Manufacturer / Brand
Samtec Inc.
Part of Description:
CONN HDR 21POS 0.1 STACK T/H
Datasheets:
DW-21-13-F-S-975(1).pdfDW-21-13-F-S-975(2).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 28685 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number DW-21-13-F-S-975
Manufacturer / Brand Samtec Inc.
Stock Quantity 28685 pcs Stock
Category Connectors, Interconnects > Rectangular Connectors - Board Spacers, Stackers (Board to Board)
Description CONN HDR 21POS 0.1 STACK T/H
Lead Free Status / RoHS Status: ROHS3 Compliant
Termination Solder
Series Flex Stack, DW
Row Spacing -
Pitch 0.100" (2.54mm)
Package Bulk
Number of Rows 1
Number of Positions 21
Mounting Type Through Hole
Length - Tail 0.110" (2.794mm)
Length - Stack Height 0.975" (24.765mm)
Length - Post (Mating) 0.145" (3.683mm)
Length - Overall Pin 1.230" (31.242mm)
Contact Finish Thickness - Post (Mating) 3.00µin (0.076µm)
Contact Finish - Post (Mating) Gold
Color Black
Base Product Number DW-21-13

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can DW-21-13-F-S-975 be used as a drop-in replacement for a standard 0.100" header in stacked board assemblies?
DW-21-13-F-S-975 is a 21-position, 0.100" pitch through-hole stack header, so it fits applications that already use a compatible 2.54 mm single-row footprint and mating height. In replacement work, DW-21-13-F-S-975 still needs verification of overall pin length, tail length, and stack height against the original board spacing and the mating connector depth, because small differences can affect solder fillets, board-to-board clearance, and connector engagement.
What should I check before substituting DW-21-13-F-S-975 into an existing design with a different stack height?
With DW-21-13-F-S-975, the 0.975" stack height and 0.145" mating post length define the mechanical interface. A substitution is usually feasible only if the mating connector and the opposing PCB spacing match those dimensions closely. If the replacement part changes the stack height, the board pair may lose alignment, the insertion depth may change, or nearby components may interfere with the connector body.
Is DW-21-13-F-S-975 suitable for high-vibration or industrial equipment?
DW-21-13-F-S-975 is a through-hole, soldered header, which generally provides better mechanical retention than surface-mount styles in vibration-prone assemblies. For industrial use, the main design checks are solder joint quality, board support near the connector, and whether the mated stack remains captured under shock or repeated movement. If the application sees continuous vibration, the full connector system and enclosure support matter as much as the part itself.
Can DW-21-13-F-S-975 be used when the mating board uses a different brand header or socket?
DW-21-13-F-S-975 can mate with many 0.100" pitch interconnect systems, but cross-brand compatibility should be verified against post size, contact geometry, and stack height. A different brand may fit physically yet change wipe distance, contact normal force, or retention behavior. In migration work, the safest check is to compare the full mechanical stack-up, not only the pitch and pin count.
What are the main design risks when using DW-21-13-F-S-975 in a dense PCB layout?
DW-21-13-F-S-975 is a single-row through-hole connector with a 0.100" pitch, so the layout risk is usually local clearance rather than routing complexity. The taller stack height can shadow nearby components, limit enclosure height, and reduce access for rework tools. The through-hole pins also consume board area on both layers, so copper keepouts and solder accessibility should be checked early in the layout.
How does the gold contact finish on DW-21-13-F-S-975 affect long-term reliability?
DW-21-13-F-S-975 uses gold on the mating post, which helps maintain contact performance in low-level signal paths and repeated mating cycles. For long-term use, the practical concerns are fretting, contamination, and whether the connector is being cycled often enough to wear the contact interface. Gold finish helps the electrical interface, but stable solder joints and controlled environmental exposure still drive overall reliability.
Can DW-21-13-F-S-975 be used for power as well as signal connections?
DW-21-13-F-S-975 may carry both power and signal in a 21-position stack if the current per contact stays within the system’s limits and the board copper, vias, and solder joints are sized accordingly. The connector itself does not remove the need to validate heating, voltage drop, and ground return paths. For power-heavy rails, designers often review pin allocation and thermal margin rather than assuming all positions can be loaded equally.
What should I consider when migrating from a shorter or longer stack connector to DW-21-13-F-S-975?
Migrating to DW-21-13-F-S-975 changes the mechanical envelope because the stack height is fixed at 0.975". That can alter board spacing, connector engagement, and chassis clearance. If the prior part had a different post length or mating depth, the new connector may require a revised standoff strategy or a board repositioning to preserve alignment and solderability.
Is DW-21-13-F-S-975 appropriate for prototype builds that may be reworked multiple times?
DW-21-13-F-S-975 is suitable for prototype assemblies when the designer expects a stable through-hole footprint and repeated handling. Rework is usually manageable on through-hole parts, but multiple thermal cycles can still stress pads and plated holes. If the board will be reworked often, pad design, barrel quality, and soldering process control become the limiting factors rather than the connector format alone.
What needs to be verified before using DW-21-13-F-S-975 in a design that must survive temperature cycling?
For DW-21-13-F-S-975, temperature cycling can move the mated boards slightly and stress the soldered tails. The relevant checks are coefficient-of-thermal-expansion mismatch between boards, connector height-induced leverage, and whether the assembly remains aligned across the full temperature range. Gold-plated mating posts support stable contact behavior, but the solder joints and board support still govern endurance in cycling environments.
Does DW-21-13-F-S-975 require any special handling for moisture-sensitive assembly processes?
DW-21-13-F-S-975 is listed as MSL not applicable, so it does not carry the same bake and floor-life constraints as moisture-sensitive packaged semiconductors. That said, normal electrostatic, contamination, and storage controls still apply to the finished connector and the assembled PCB. In practice, the main process focus is clean soldering and protection of the plated contacts during assembly and storage.
How do I know if DW-21-13-F-S-975 is a better choice than a lower-profile stack header?
DW-21-13-F-S-975 is a better fit when the stack height and mating post length are needed to clear components or create the required board-to-board separation. A lower-profile part may reduce enclosure height, but it can also tighten tolerance margins and limit accessibility. The decision usually comes down to whether the assembly needs mechanical clearance, reach, and alignment more than compact height.

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DW-21-13-F-S-975

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