The STM32F301C8Y6TR is a high-performance 32-bit microcontroller from STMicroelectronics that belongs to the embedded microcontroller category within integrated circuits. This ARM Cortex-M4 based device operates at 72MHz and incorporates 64KB of flash memory with 16KB of RAM, making it suitable for demanding embedded applications requiring real-time processing capabilities.
The microcontroller addresses several critical design challenges in modern embedded systems through its compact 49-WLCSP (Wafer Level Chip Scale Package) form factor, which measures among the smallest available packages while maintaining robust functionality. This ultra-miniature packaging solution enables designers to create space-constrained applications without sacrificing performance. The device operates reliably across an industrial temperature range of -40°C to 85°C, ensuring consistent performance in harsh environmental conditions.
Key specifications include 37 general-purpose I/O pins providing extensive interfacing capabilities, integrated analog-to-digital conversion with 8 channels of 12-bit resolution, and a single 12-bit digital-to-analog converter for precision analog output generation. The microcontroller features comprehensive connectivity options including I²C, IrDA, LIN bus, SPI, and UART/USART interfaces, enabling seamless integration with various communication protocols and peripheral devices. Essential peripherals such as DMA controllers, interrupt systems, power-on reset, pulse-width modulation, and watchdog timers are integrated to support complex system designs.
The primary advantages include exceptional power efficiency with a wide supply voltage range of 2V to 3.6V, making it ideal for battery-powered applications. The ARM Cortex-M4 core provides advanced digital signal processing capabilities while maintaining low power consumption. The internal oscillator eliminates the need for external timing components, reducing bill-of-materials costs and board space requirements. RoHS3 compliance ensures environmental responsibility and regulatory adherence.
Surface mount technology compatibility facilitates automated assembly processes, while the tape and reel packaging format supports high-volume manufacturing requirements. The device finds extensive application in industrial automation, consumer electronics, medical devices, automotive systems, IoT sensors, motor control applications, and portable instrumentation where space constraints and power efficiency are paramount.
Equivalent and alternative models within the STM32F3 series include the STM32F301C6 with 32KB flash memory, STM32F301K6 and STM32F301K8 in smaller 32-pin packages, and STM32F302 series offering enhanced peripheral sets. Competitive alternatives include NXP's LPC4300 series ARM Cortex-M4 microcontrollers, Microchip's SAM4 series, Texas Instruments' TM4C series Tiva microcontrollers, and Infineon's XMC4000 series, though specific package and feature compatibility should be verified for direct replacement scenarios.
STM32F301C8Y6TR (1)
STM32F301C8Y6TR Key Technical Attributes
Series STM32F3
Core ARM Cortex-M4 32-bit single-core
Max frequency 72 MHz
Flash 64 KB (64K x 8)
SRAM 16 KB
Supply voltage 2.0 V to 3.6 V
Operating temperature -40°C to +85°C (TA)
I/O count 37
Data converters ADC 8×12-bit; DAC 1×12-bit
Oscillator Internal
Peripherals DMA, interrupt system (IS), power-on reset (POR), PWM timers, watchdog timer (WDT)
Connectivity I2C, IrDA, LINbus, SPI, UART/USART
Mounting Surface Mount
RoHS ROHS3 Compliant
Package 49-WLCSP; Tape & Reel (TR)
Base product number STM32F301
STM32F301C8Y6TR Packing Size
Type 49-WLCSP; case option 49-UFBGA/WLCSP
Ball array 7×7; 49 total balls; fine-pitch class
Ball pitch see datasheet; commonly 0.4 mm class
Pin breakout 37 user GPIO; remaining balls for power, ground, reset, clock, and system pins
Material silicon die with under-bump metallization; lead-free SAC solder balls; RoHS3
Carrier Tape & Reel for automated SMT
Mounting reflow soldering per JEDEC; moisture handling per ST specification
Thermal characteristics board-dependent; consult datasheet thermal tables
Electrical properties VDD 2.0–3.6 V; I/O electrical limits, drive strength, and leakage per datasheet; ESD/latch-up per IEC/JESD
STM32F301C8Y6TR Application
Industrial automation controllers and motor/drive control
Sensor hubs and mixed-signal data acquisition with on-chip ADC/DAC
Automotive LIN and IrDA communication nodes (non-safety-critical)
Portable, battery-powered instruments and handheld test equipment
Communication gateways and protocol bridging via SPI/I2C/UART/USART
Embedded control for drones, robotics, and mechatronics
Education and prototyping for ARM Cortex-M4 DSP-capable microcontrollers
STM32F301C8Y6TR Features
The STM32F301C8Y6TR integrates a 32-bit ARM Cortex-M4 core running up to 72 MHz, bringing efficient DSP-capable processing to embedded designs that demand real-time control and signal conditioning. It pairs 64 KB of embedded Flash with 16 KB SRAM to support compact firmware while still enabling advanced control loops, communication stacks, and mixed-signal tasks. A rich set of on-chip peripherals includes DMA for efficient data movement, PWM-capable timers for motor control and precision timing, and an integrated watchdog and power-on reset for robust operation. Mixed-signal functionality is strong: an 8-channel 12-bit ADC provides fast and accurate conversion for sensors, and a 12-bit DAC enables waveform generation or biasing, all tightly coupled with the CPU and DMA for low-latency processing.
Connectivity is flexible and industrially relevant, with I2C for sensor buses, SPI for high-speed peripherals, multiple UART/USARTs for serial links, and support for IrDA and LINbus to address automotive and infrared communication use cases. Up to 37 general-purpose I/O lines are available from the 49-ball map, giving ample digital control and interfacing options. The device operates from 2.0–3.6 V across a -40°C to +85°C ambient range, features an internal oscillator to reduce BOM complexity, and is offered in an ultra-compact 49-WLCSP case optimized for space-constrained designs. The surface-mount WLCSP package supports modern reflow processes and is supplied on Tape & Reel for high-volume manufacturing. As part of the STM32F3 series, developers benefit from a mature ecosystem, libraries, and reference designs tailored to mixed-signal and control applications.
STM32F301C8Y6TR Quality and Safety Features
System resilience is enhanced by an integrated watchdog timer to recover from software faults, a power-on reset to guarantee deterministic startup, and timer-based PWM controls for reliable actuation in motor and power applications. Operating temperature down to -40°C and up to +85°C supports use in demanding industrial environments, while RoHS3 compliance and lead-free solder balls reflect modern environmental and safety standards. Electrical specifications for ESD, latch-up, and I/O robustness are defined in ST’s datasheet to guide safe design-in. The internal oscillator reduces external component count and potential clock-failure points, and the DMA and interrupt system help maintain deterministic real-time behavior under load.
STM32F301C8Y6TR Compatibility
This device is software-compatible across the STM32F3 family, enabling code reuse of HAL drivers, middleware, and examples developed for similar STM32F301/STM32F3 parts. Its voltage domain of 2.0–3.6 V and industry-standard interfaces (I2C, SPI, UART/USART, LIN, IrDA) make it interoperable with a wide range of sensors, transceivers, and modules. The 49-WLCSP ball map supports 37 user I/Os, with power and system pins placed to suit common PCB routing practices; designers migrating within the STM32F301 and related STM32F3 offerings can often maintain firmware with minimal changes. Development flows using common ARM toolchains and ST debug probes are widely supported, facilitating rapid integration into existing projects.
STM32F301C8Y6TR Datasheet PDF
Our website hosts the most authoritative, up-to-date datasheet for the STM32F301C8Y6TR. For precise electrical limits, timing, mechanical dimensions (including exact WLCSP ball pitch and outline), thermal characteristics, and pin mapping, we strongly recommend downloading the official datasheet directly from this product page. It is the definitive reference for design, validation, and compliance.
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