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MM3Z18ST

In Stock 145097 pcs Reference Price(In US Dollars)
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$0.1506
Manufacturer Part Number:
MM3Z18ST
Manufacturer / Brand
ST
Part of Description:
593
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 145097 pcs Stock Available.
ECAD Model:
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Hong Kong
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Part Number MM3Z18ST
Manufacturer / Brand ST
Stock Quantity 145097 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description 593
Lead Free Status / RoHS Status: RoHS Compliant
RFQ MM3Z18ST Datasheets MM3Z18ST Details PDF
MM3Z18ST Details PDF for FR.pdf
MM3Z18ST Details PDF for KR.pdf
MM3Z18ST Details PDF for DE.pdf
MM3Z18ST Details PDF for IT.pdf
MM3Z18ST Details PDF for ES.pdf
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
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Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

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Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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MM3Z18ST Product Details:

The MM3Z18ST is a specialized integrated circuit (IC) manufactured by STMicroelectronics, designed to meet advanced electronic design requirements. This precision component belongs to the Specialized ICs category and offers robust performance for complex electronic applications.

The integrated circuit is engineered to provide high-reliability signal management and electronic functionality across various technical environments. Its 7795 encapsulation format ensures enhanced durability and consistent performance, making it suitable for demanding electronic systems that require precise signal processing and component integration.

With a standard quantity packaging of 1000 units, the MM3Z18ST is ideal for medium to large-scale electronic manufacturing processes, enabling efficient production workflows and consistent component supply. The circuit's specialized design suggests it is optimized for specific technical applications that demand high-precision signal handling, potentially in telecommunications, automotive electronics, industrial control systems, or advanced computing infrastructure.

While detailed technical specifications are limited in the provided information, the component's classification as a specialized IC indicates it likely offers unique functionality beyond standard integrated circuit capabilities. The STMicroelectronics manufacturing pedigree further underscores the product's potential reliability and technical sophistication.

For precise equivalent or alternative models, technical consultation with STMicroelectronics or a comprehensive electronic components database would provide the most accurate comparative information. Engineers and procurement specialists would benefit from direct manufacturer specifications to fully understand the circuit's precise performance characteristics and potential application scenarios.

MM3Z18ST Key Technical Attributes

Manufacturer Part Number MM3Z18ST

Manufacturer STMicroelectronics

Main Category Integrated Circuits (ICs)

Small Classification Specialized ICs

MM3Z18ST Packing Size

The MM3Z18ST typically comes in compact and robust packaging designed to protect the device during transport and handling. It utilizes the 7795 encapsulation, a form of surface-mount technology package that supports high-density PCB configuration. This package ensures ease of integration into automated assembly lines and provides excellent thermal stability. Its small size suits space-constrained applications, and it is engineered for effective heat dissipation. The pin configuration allows streamlined connection to surrounding circuit elements, supporting stable performance. Electrical properties such as leakage current, reverse voltage, and power dissipation are carefully optimized within its physical form.

MM3Z18ST Application

The MM3Z18ST is suitable for a wide range of electronic equipment, particularly where voltage regulation and reliable protection are required. Common applications include consumer electronics, power management systems, industrial automation, telecommunication devices, and automotive electronics. It is frequently utilized in circuits demanding precision and stability, making it ideal for design engineers building reliable and efficient subsystems.

MM3Z18ST Features

The MM3Z18ST offers a host of advanced features detailed by STMicroelectronics for integrated circuit optimization. Its miniaturized 7795 surface-mount package ensures low profile and compatibility with densely packed PCBs. Engineered for reliability, it delivers stable operation over wide temperature ranges and exhibits notable resistance to environmental and electrical stresses. The device supports high efficiency through low leakage current and constant voltage regulation. Its robust thermal characteristics guarantee optimal performance even in demanding operating conditions. With a specialized architecture, the MM3Z18ST excels in voltage clamping, ESD protection, and other circuit safeguarding roles, making it a dependable solution in sensitive designs. Furthermore, STMicroelectronics’ manufacturing quality imbues the component with longevity, low failure rates, and consistent characteristics across every batch.

MM3Z18ST Quality and Safety Features

The MM3Z18ST is manufactured in compliance with international standards to support performance and reliability. It features strict control for electrostatic discharge protection and is subjected to comprehensive quality assessment processes. The encapsulation provides both physical robustness and thermal protection. Additionally, the device is RoHS-compliant, ensuring that it meets environmental and safety requirements for global markets. The product’s reliability is reinforced by rigorous testing protocols, ensuring safe operation in critical applications. The construction ensures minimal risk of malfunction due to overvoltage, overcurrent, or harsh environmental conditions.

MM3Z18ST Compatibility

Engineered to be a drop-in solution for a range of applications, the MM3Z18ST is designed to seamlessly work with complementary ICs and supporting hardware. Its pin-out configuration and voltage ratings enable straightforward integration into both new designs and existing circuit boards. The packaging is compatible with automated pick-and-place equipment, making it ideal for high-volume manufacturing. Its electrical properties align with industry standards, facilitating design flexibility and cross-compatibility with related STMicroelectronics IC products.

MM3Z18ST Datasheet PDF

For the most up-to-date and comprehensive technical details on the MM3Z18ST, we provide the official STMicroelectronics datasheet on our website. Our datasheet offers detailed performance parameters, application guidelines, recommended operating conditions, and more. We strongly encourage you to download this authoritative technical document directly from this page to support your development, selection, and design work.

Quality Distributor

IC-Components is proud to be your premium distributor for STMicroelectronics products. By sourcing directly from trusted supply channels, we guarantee genuine and high-quality MM3Z18ST parts for your needs. Discover best-in-class service, fast delivery, and competitive pricing with us—get a personalized quote today on our website for any quantity you require!

Frequently Asked Questions

What are the key design constraints when integrating the MM3Z18ST Zener diode into a 3.3V microcontroller I/O protection circuit, especially regarding leakage current and dynamic impedance at low test currents?
The MM3Z18ST, with its nominal 18V Zener voltage, is not suitable for direct 3.3V I/O clamping. Its minimum Zener voltage (Vz) is typically 17.1V at 5mA, far exceeding 3.3V logic levels. At lower currents (e.g., 100µA), leakage current can reach several microamps, potentially interfering with high-impedance analog nodes or sleep-mode circuits. Dynamic impedance (Zzt) is ~70Ω at 5mA, but increases significantly below this current, reducing clamping precision. For 3.3V protection, consider a TVS diode array or lower-voltage Zener like the MM3Z3V3ST.
Can the MM3Z18ST be used as a voltage reference in a low-power industrial sensor interface operating from a 24V supply, and what stability issues should be anticipated over temperature?
Yes, the MM3Z18ST can serve as a stable 18V reference in 24V-powered systems, but its temperature coefficient (~+8mV/°C typical) must be accounted for in precision applications. Over the full industrial range (-40°C to +125°C), Vz can drift by up to ±1.25V, which may exceed tolerance in 12-bit or higher ADC reference circuits. Additionally, power dissipation must be limited—use a series resistor to keep current below 20mA (max 200mW) to avoid thermal runaway. For tighter stability, consider a bandgap reference IC instead.
What are the risks of replacing a BZX84C18LT1G (ON Semiconductor) with the MM3Z18ST in an existing automotive ECU design, and what parametric differences could affect long-term reliability?
While both are 18V Zener diodes in SOT-23 packages, the MM3Z18ST has a higher maximum leakage current (0.1µA vs. 0.05µA at 13.2V) and slightly wider Vz tolerance (±5% vs. ±2%). In high-temperature automotive environments (>125°C junction), the MM3Z18ST’s leakage may increase more rapidly, potentially affecting quiescent current budgets in always-on circuits. Verify that the PCB layout accommodates the MM3Z18ST’s thermal characteristics—its lower thermal resistance (200°C/W vs. 220°C/W) offers marginal improvement but requires consistent soldering quality. Always validate under end-use conditions.
Is the MM3Z18ST suitable for reverse polarity protection in a 24V industrial bus application, and what external components are necessary to ensure safe operation?
The MM3Z18ST alone is insufficient for reverse polarity protection. It can clamp transient overvoltage but cannot block reverse current. To implement reverse polarity protection, pair it with a series P-channel MOSFET and a current-limiting resistor. The MM3Z18ST can protect the gate-source junction by clamping Vgs to 18V during transients. Ensure the MOSFET’s Vds rating exceeds system voltage plus margin, and size the resistor to limit power dissipation in the MM3Z18ST during sustained faults (e.g., >20mA continuous may exceed 200mW limit).
How does the MM3Z18ST perform in high-humidity environments typical of outdoor industrial enclosures, and what conformal coating or layout practices are recommended?
The MM3Z18ST’s SOT-23 package (encapsulation 7795) offers basic moisture resistance but is not hermetic. In high-humidity (>85% RH) environments, surface leakage can increase over time, especially with ionic contamination. Apply acrylic or silicone-based conformal coating (e.g., HumiSeal 1B31) to mitigate dendritic growth. Maintain >0.5mm creepage distance between adjacent pads and avoid placing the device near high-voltage traces. For mission-critical outdoor use, consider hermetically sealed alternatives or redundant clamping architectures.
What configuration methods are available to fine-tune the effective clamping voltage when using the MM3Z18ST in a multi-stage transient suppression network?
The MM3Z18ST’s fixed 18V Zener voltage cannot be adjusted directly, but its effective clamping threshold in a multi-stage network can be tuned using series resistors or parallel Zener stacking. For example, placing two MM3Z18ST diodes in series yields ~36V clamping, useful for 48V telecom systems. Alternatively, a small resistor (10–100Ω) in series with the diode slows transient response slightly but reduces peak current through downstream components. Always simulate or test the combined I-V curve, as dynamic impedance effects become nonlinear under fast ESD or surge events.
When migrating from a through-hole 1N5236B Zener to the surface-mount MM3Z18ST in a legacy power supply redesign, what layout and thermal considerations must be addressed to maintain equivalent reliability?
The MM3Z18ST in SOT-23 has significantly lower thermal mass than the 1N5236B (DO-35), requiring careful thermal management. Ensure the PCB pad includes thermal vias to a ground plane to improve heat dissipation—without this, localized heating may reduce lifespan under repetitive surge conditions. The MM3Z18ST’s 200mW power rating is lower than the 1N5236B’s 500mW, so recalculate worst-case power (P = Vz × Iz) and derate by at least 50% for industrial use. Also, verify solder joint reliability under thermal cycling, as SOT-23 is more susceptible to fatigue than axial leads.
In what applications should the MM3Z18ST be avoided despite its 18V nominal rating, particularly in precision analog or high-frequency digital circuits?
Avoid the MM3Z18ST in precision analog signal paths (e.g., op-amp feedback networks or ADC references) due to its relatively high dynamic impedance and loose tolerance (±5%), which introduce nonlinearities and drift. It is also unsuitable for high-frequency (>10MHz) clamping applications because of parasitic capacitance (~10pF typical), which can distort fast edges. Additionally, do not use it in low-leakage battery-powered systems where even 0.1µA of reverse current significantly impacts sleep-mode efficiency. For these cases, select ultra-low-leakage TVS diodes or precision voltage references.
What are the long-term reliability implications of operating the MM3Z18ST continuously at 80% of its maximum power rating (160mW) in a 70°C ambient environment?
Operating the MM3Z18ST at 160mW in 70°C ambient results in a junction temperature of approximately 102°C (using RθJA = 200°C/W), which is within the 150°C limit but reduces long-term reliability. Prolonged operation near thermal limits accelerates dopant diffusion and increases failure rates due to electromigration. STMicroelectronics’ FIT data suggests derating to ≤50% of max power (100mW) for >10-year industrial life. Implement a heatsinking pad or reduce current via higher series resistance to extend MTBF, especially in sealed enclosures with poor airflow.
Can the MM3Z18ST be used interchangeably with the Diodes Incorporated BZT52C18 in a 12V automotive load dump protection circuit, and what are the critical differences in surge handling?
The MM3Z18ST and BZT52C18 are electrically similar (18V Zener, SOT-23), but the MM3Z18ST has a lower peak pulse power rating (200mW continuous, ~400W for 10/1000µs pulses) compared to the BZT52C18’s 500mW continuous and higher surge capability. In automotive load dump scenarios (e.g., ISO 7637-2), the MM3Z18ST may fail if subjected to repeated high-energy transients without additional clamping (e.g., a TVS diode). Always validate surge performance with a transient generator—prefer the BZT52C18 or a dedicated automotive TVS for robust load dump protection.

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MM3Z18ST

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In Stock: 145097

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