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ESDZL5-1F4

In Stock 14830 pcs Reference Price(In US Dollars)
1+
$0.0302
Manufacturer Part Number:
ESDZL5-1F4
Manufacturer / Brand
STMicroelectronics
Part of Description:
TVS DIODE 5.5VWM 10VC 0201
Datasheets:
ESDZL5-1F4(1).pdfESDZL5-1F4(2).pdfESDZL5-1F4(3).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 14830 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number ESDZL5-1F4
Manufacturer / Brand STMicroelectronics
Stock Quantity 14830 pcs Stock
Category Circuit Protection > Transient Voltage Suppressors (TVS) - TVS Diodes
Description TVS DIODE 5.5VWM 10VC 0201
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Reverse Standoff (Typ) 5.5V (Max)
Voltage - Clamping (Max) @ Ipp 10V
Voltage - Breakdown (Min) -
Unidirectional Channels 1
Type Zener
Supplier Device Package 0201
Series ESDZ
Power Line Protection No
Power - Peak Pulse 60W
Package / Case 0201 (0603 Metric)
Package Tape & Reel (TR)
Operating Temperature -55°C ~ 150°C (TJ)
Mounting Type Surface Mount
Current - Peak Pulse (10/1000µs) 7A (8/20µs)
Capacitance @ Frequency 7.5pF @ 1MHz
Base Product Number ESDZL5
Applications General Purpose

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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Frequently Asked Questions

How does the low 7.5pF capacitance of the ESDZL5-1F4 affect signal integrity when integrating it on high-speed data lines like USB or MIPI in space-constrained designs?
The ESDZL5-1F4 from STMicroelectronics adds approximately 7.5pF at 1MHz in parallel to the protected line in its 0201 package. On interfaces with edge rates in the low nanosecond range or data rates above several hundred Mbps, this loading can introduce measurable rise-time degradation or eye diagram closure. Engineers typically place it as close as possible to the connector while evaluating the combined trace inductance and source impedance to determine acceptable insertion loss.
What are the key design constraints when using the ESDZL5-1F4 for unidirectional ESD protection on a 3.3V or 5V GPIO or I/O port?
The ESDZL5-1F4 has a 5.5V maximum reverse standoff voltage and clamps at 10V maximum under 7A 8/20µs surge. For normal operation on lines that remain below 5.5V, leakage stays low. Designers must ensure the protected signal does not exceed this standoff under worst-case DC conditions or overshoot to avoid forward conduction or increased leakage during normal function.
Is the ESDZL5-1F4 suitable for protecting high-speed differential pairs, or are there better integration approaches?
The ESDZL5-1F4 is a unidirectional single-line device. For differential pairs, one device per line is required with matched placement to maintain symmetry. Its 7.5pF capacitance may limit use on multi-Gbps interfaces where sub-1pF devices are preferred; engineers often simulate the differential impedance impact and consider bidirectional alternatives only when polarity allows or when using two matched unidirectional parts.
What should engineers consider when migrating from larger package TVS diodes like 0402 or SOT-23 to the ESDZL5-1F4 in 0201 for board space reduction?
The ESDZL5-1F4 offers a significantly smaller 0.6 x 0.3mm footprint compared to 0402 or SOT-23 devices, enabling denser layouts. However, the reduced package size typically correlates with lower thermal mass and peak pulse power handling of 60W. Migration requires re-verifying the surge current waveform (8/20µs at 7A) against the application's expected ESD or transient energy and confirming assembly process capability for 0201 components.
How does the clamping behavior of the ESDZL5-1F4 influence protection effectiveness for sensitive IC inputs with low ESD withstand voltage?
Under an 8/20µs pulse, the ESDZL5-1F4 limits voltage to a maximum of 10V at 7A peak. This clamping level provides a defined upper bound for residual voltage delivered to downstream IC pins. In practice, the dynamic resistance and snap-back characteristic determine the actual voltage seen by the protected circuit; designers perform system-level IEC 61000-4-2 testing to confirm margin relative to the IC's absolute maximum ratings.
What replacement or alternative part considerations arise when the ESDZL5-1F4's unidirectional nature does not match a bidirectional protection requirement?
For applications needing bidirectional protection, engineers may evaluate ST's ESDZV series or similar devices from other manufacturers in comparable packages. Switching requires checking differences in breakdown voltage, capacitance, and clamping levels, as bidirectional parts often exhibit symmetric behavior that alters leakage and dynamic performance on lines with positive and negative swings.
In industrial environments with extended temperature cycling, what operating condition factors should be reviewed for long-term use of the ESDZL5-1F4?
The ESDZL5-1F4 is rated for -55°C to +150°C junction temperature. Over this range, capacitance, leakage current, and clamping voltage exhibit temperature dependence typical of Zener-based TVS structures. In designs targeting 10+ year operation, engineers account for derating of peak pulse capability and perform accelerated life testing to assess any shift in parameters under combined thermal and humidity stress.
When selecting between the ESDZL5-1F4 and higher-capacitance TVS options for general-purpose I/O protection, what trade-offs influence the decision?
Higher-capacitance devices generally provide lower dynamic resistance and potentially tighter clamping at the same current level due to larger die area. The ESDZL5-1F4 prioritizes the 7.5pF level and 0201 size, resulting in a specific balance suited to moderate-speed lines. The choice depends on quantifying the allowable capacitive loading versus the required surge current shunting capability in the target application.
What power supply or configuration considerations apply when placing multiple ESDZL5-1F4 devices near a connector array?
Each ESDZL5-1F4 is a standalone unidirectional TVS without power line protection features. In multi-channel setups, routing return paths and minimizing ground inductance between devices and the system ground plane helps reduce voltage overshoot during fast transients. No additional external biasing or configuration is needed beyond standard surface-mount placement.
For replacement in legacy designs using discrete Zener diodes or other 5.5V TVS in larger packages, what practical differences does the ESDZL5-1F4 introduce?
Compared to conventional Zener diodes, the ESDZL5-1F4 is optimized for low clamping and fast response in an 0201 package with 7A 8/20µs rating. Migration involves updating the land pattern, re-assessing parasitic inductance from shorter traces, and confirming that the lower package thermal capacity still meets the application's transient energy profile without exceeding the 10V clamp limit under expected conditions.

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