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Home > Products > Integrated Circuits (ICs) > Specialized ICs > ESDA6V1-5W6/J
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ESDA6V1-5W6/J

Manufacturer Part Number:
ESDA6V1-5W6/J
Manufacturer / Brand
ST
Part of Description:
ESDA6V1-5W6/J ST SOT
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 50400 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number ESDA6V1-5W6/J
Manufacturer / Brand ST
Stock Quantity 50400 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description ESDA6V1-5W6/J ST SOT
Lead Free Status / RoHS Status: RoHS Compliant
RFQ ESDA6V1-5W6/J Datasheets ESDA6V1-5W6/J Details PDF
ESDA6V1-5W6/J Details PDF for FR.pdf
ESDA6V1-5W6/J Details PDF for IT.pdf
ESDA6V1-5W6/J Details PDF for ES.pdf
ESDA6V1-5W6/J Details PDF for DE.pdf
ESDA6V1-5W6/J Details PDF for KR.pdf
Package SOT
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key design considerations when integrating the ESDA6V1-5W6/J TVS diode into a high-speed digital interface such as USB 2.0 or HDMI, particularly regarding parasitic capacitance and signal integrity?
The ESDA6V1-5W6/J has a typical junction capacitance of 35 pF, which may introduce unacceptable signal degradation in high-speed interfaces operating at or above 480 Mbps (USB 2.0 High-Speed) or 1.48 Gbps (HDMI). Engineers must evaluate insertion loss and reflection effects using simulation tools or test fixtures. For interfaces exceeding 500 MHz, consider alternative low-capacitance ESD protection devices or verify compliance with eye diagram requirements through prototype validation.
How does the clamping voltage of the ESDA6V1-5W6/J compare to other common ESD protection diodes like the PESD3V3L4U, and what implications does this have for protecting sensitive ICs with tight voltage tolerances?
The ESDA6V1-5W6/J clamps transient currents at 9.2 V during an 8 kV IEC 61000-4-2 contact discharge, whereas the PESD3V3L4U maintains clamping below 10 V only under specific test conditions and typically exceeds 15 V at higher energy levels. For protecting ICs rated for 3.3 V logic levels, the ESDA6V1-5W6/J may risk overstress unless sufficient series resistance or filtering is implemented to limit peak current.
Can the ESDA6V1-5W6/J be safely used in automotive-grade applications requiring AEC-Q101 qualification, or are there reliability concerns given its standard industrial rating?
The ESDA6V1-5W6/J is not AEC-Q101 qualified and is rated for industrial temperature range only (-40°C to +125°C). While it may operate within specification under non-extreme conditions, long-term exposure to thermal cycling, humidity, or vibration in automotive environments could accelerate degradation. Designers should either select an automotive-qualified equivalent or implement additional derating and environmental controls.
Is it possible to parallel multiple ESDA6V1-5W6/J devices to increase ESD current handling without compromising response time or introducing imbalance in transient suppression?
Parallel operation of ESDA6V1-5W6/J diodes is not recommended due to potential imbalance in triggering thresholds and response delays between units. Even small mismatches can cause one device to carry disproportionate current, leading to localized heating and failure. Instead, use a single device capable of meeting required IPP (peak pulse current) levels or select a part specifically designed for multi-stage or distributed protection.
What configuration method should be used to ensure optimal ESD protection when routing signals through connectors on a PCB with limited space for placement?
For compact layouts, place the ESDA6V1-5W6/J as close as possible to the connector pin—ideally within 2 mm—to minimize loop inductance and reduce voltage overshoot during fast transients. Use Kelvin connections from the signal line directly to the anode/cathode pads, avoiding vias if possible, and maintain a solid ground return path adjacent to the protection traces to ensure fast discharge.
When migrating from a Bourns CDSOD32-052LD to the ESDA6V1-5W6/J, what layout and component changes are necessary due to differences in package footprint and electrical characteristics?
The ESDA6V1-5W6/J uses a SOT-23 package with slightly larger pad dimensions than the CDSOD32-052LD’s DFN footprint. Layout adaptation requires adjusting copper pour geometry and solder mask openings accordingly. Additionally, the ESDA6V1-5W6/J has lower dynamic resistance (typically <1 Ω vs. ~0.5 Ω for Bourns parts), so verify that downstream components can tolerate marginally higher clamping voltages under sustained transients.
How does the leakage current of the ESDA6V1-5W6/J behave over temperature, and what impact might this have on battery-powered devices with strict quiescent current budgets?
At +85°C, the reverse leakage current of the ESDA6V1-5W6/J increases to approximately 50 nA, rising further toward 200 nA at +125°C. In ultra-low-power designs where total system current must remain below 1 µA, this leakage can represent a significant portion of the budget. Consider using alternative zero-leakage technologies like MOSFET-based ESD arrays or add power gating to disable protection during sleep modes.
Are there any known issues with using the ESDA6V1-5W6/J in conjunction with ferrite beads for EMI filtering, particularly regarding DC bias stability and transient response?
Ferrite beads exhibit increased impedance under DC bias, which can reduce their effectiveness during ESD events when combined with the ESDA6V1-5W6/J. Moreover, the bead’s inductance may slow down the rise time of the protected signal edge, potentially violating timing margins. If both are required, choose a bead with stable impedance across frequency and verify signal integrity using TDR measurements before finalizing the design.
What precautions should be taken when soldering the ESDA6V1-5W6/J in mass production, given its sensitivity to electrostatic discharge during handling?
Although the ESDA6V1-5W6/J itself provides ESD protection, it remains vulnerable to damage during manufacturing. Ensure proper grounding of pick-and-place equipment, use ionizers in wave soldering lines, and store unused devices in conductive packaging. Reflow profiles should adhere strictly to JEDEC standards—avoid excessive dwell time above 240°C—to prevent bond wire degradation and migration.
Can the ESDA6V1-5W6/J be used effectively for surge protection beyond ESD, such as IEC 61000-4-5 lightning surge tests, and what limitations apply?
The ESDA6V1-5W6/J is optimized for nanosecond-range ESD events per IEC 61000-4-2 but lacks sufficient energy absorption capability for milliseconds-long surges described in IEC 61000-4-5. Its repetitive surge rating is limited to 100 pulses at 10 ms intervals, and single-pulse energy may exceed safe limits. For lightning surge scenarios, combine it with external MOVs or gas discharge tubes rather than relying solely on the diode.

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ESDA6V1-5W6/J

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ESDA6V1-5W6/J ST SOT

In Stock: 50400

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