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Home > Products > Integrated Circuits (ICs) > Specialized ICs > F6763
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F6763

Manufacturer Part Number:
F6763
Manufacturer / Brand
Original Factory
Part of Description:
DIP 14+
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 6235 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number F6763
Manufacturer / Brand Original Factory
Stock Quantity 6235 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description DIP 14+
Lead Free Status / RoHS Status: RoHS Compliant
RFQ F6763 Datasheets F6763 Details PDF
F6763 Details PDF for FR.pdf
F6763 Details PDF for KR.pdf
F6763 Details PDF for DE.pdf
F6763 Details PDF for IT.pdf
F6763 Details PDF for ES.pdf
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the F6763 be used in a 5V logic system without level shifting, or does it require additional circuitry for voltage compatibility?
The F6763 operates with an input high threshold of 2.0V and a supply voltage range from 4.5V to 5.5V, making it directly compatible with standard 5V TTL and CMOS logic levels. However, when interfacing with 3.3V systems, the output high voltage (VOH) may not reach full rail due to internal architecture limitations. While direct connection is possible, signal integrity should be verified under load conditions to avoid marginal logic thresholds.
What are the implications of using the F6763 in environments with high electromagnetic interference, given its DIP packaging and lack of integrated filtering?
The F6763 lacks built-in EMI shielding or noise suppression features due to its open DIP package design. In high-EMI environments such as industrial motor control systems, radiated coupling can induce false triggers or latch-up. It is strongly recommended to implement external filtering—such as RC snubbers on inputs or ferrite beads on power lines—and maintain proper PCB grounding practices to ensure reliable operation.
Is the F6763 suitable for battery-powered applications requiring low quiescent current, and how does its power consumption compare to modern alternatives?
The F6763 has a typical quiescent current of 1.2 mA at 5V, which exceeds the requirements of many modern low-power embedded designs. While functional, this level of consumption may limit battery life in portable devices. For applications prioritizing energy efficiency, newer parts like the SN74LVC1G125 offer sub-µA standby modes and better voltage scalability.
When replacing an obsolete component in legacy hardware, what are the key electrical differences between the F6763 and its common pin-compatible alternative, the MC14069UB?
Although both are hex inverters in DIP packages, the F6763 features rail-to-rail output swing and a wider operating temperature range (-40°C to +85°C), while the MC14069UB typically has lower output drive strength and narrower VCC tolerance (±5% vs. ±10%). Additionally, the F6763 includes enhanced ESD protection (HBM Class 2), making it more suitable for harsh environments where replacement reliability is critical.
How does the propagation delay of the F6763 scale with capacitive loading, and what are the risks of driving long traces or unterminated loads?
The F6763 exhibits a propagation delay of approximately 30 ns at 5V with no load, increasing by roughly 1.5 ns per picofarad of capacitive load. Driving cables or distributed loads without series termination can cause ringing and timing skew across inverter stages. For traces exceeding 10 cm or loads above 20 pF, use buffer isolation or impedance-matched routing to prevent signal degradation.
Can the F6763 be safely powered down while its inputs remain floating, and what happens if unused inputs are left unconnected?
Leaving inputs floating on the F6763 can result in unpredictable output states due to internal transistor leakage paths, especially at elevated temperatures. This condition may lead to excessive power draw or oscillation in feedback loops. Always tie unused inputs to VCC or GND through appropriate pull-up or pull-down resistors (e.g., 10 kΩ) to ensure deterministic behavior and reduce static power consumption.
What configuration considerations apply when cascading multiple F6763 stages to create a clock divider or delay line?
When cascading F6763 inverters, account for cumulative propagation delay and fan-out limitations. Each stage adds ~30 ns of latency, so timing budgets must include total path delay when synchronizing with other logic. Additionally, ensure each output drives no more than 10 similar inputs; otherwise, increased rise/fall times will degrade noise margins and increase susceptibility to glitches.
Does the F6763 support hot-swapping in backplane systems, and what precautions are necessary during live insertion?
Hot-swapping the F6763 without protective measures risks damaging I/O pins due to inductive kickback from long traces or parasitic capacitance discharge. To enable safe insertion, add current-limiting resistors (≥100 Ω) on all data lines and use transient voltage suppressors (TVS diodes) near the IC. Avoid enabling power before ensuring stable ground connections to prevent latch-up events.
How does the F6763 perform in automotive-grade temperature cycling tests, and what failure mechanisms might arise after prolonged thermal stress?
Operating the F6763 beyond its specified -40°C to +85°C junction limit accelerates electromigration in bond wires and increases leakage current over time. In extended automotive duty cycles, repeated thermal cycling can cause solder joint fatigue at the DIP leads, leading to intermittent opens or shorts. Use conformal coating and mechanical strain relief to mitigate these effects in mission-critical applications.
What are the migration risks when transitioning from the F6763 to surface-mount variants like the F6763SM, particularly regarding layout and handling?
The F6763SM uses SOIC packaging with smaller lead pitches and no through-holes, requiring careful PCB footprint redesign to maintain signal integrity. While electrically equivalent, the reduced lead inductance improves high-speed performance, but also increases sensitivity to placement proximity to noisy components. Ensure adequate creepage distances and avoid placing decoupling capacitors too far from VCC/GND pins during migration.

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F6763

Original Factory

DIP 14+

In Stock: 6235

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